公开(公告)号：US20070139938A1

公开(公告)日：2007-06-21

申请号：US11676812

申请日：2007-02-20

申请人： James Petroski ,  Mehmet Arik

发明人： James Petroski ,  Mehmet Arik

IPC分类号： F21V29/00

CPC分类号： F21V29/70 ,  F21K9/232 ,  F21K9/233 ,  F21K9/64 ,  F21V3/02 ,  F21V3/12 ,  F21V23/02 ,  F21V29/02 ,  F21V29/63 ,  F21Y2115/10 ,  H01L23/467 ,  H01L23/473 ,  H01L2924/0002 ,  Y10S362/80 ,  H01L2924/00

摘要： An LED lamp that includes a piezoelectric fan or synthetic jet to cool component of the lamp is disclosed.

摘要翻译： 公开了一种包括压电风扇或合成射流以冷却灯的部件的LED灯。

公开(公告)号：US07204615B2

公开(公告)日：2007-04-17

申请号：US10726882

申请日：2003-12-03

申请人： Mehmet Arik ,  Todd Garrett Wetzel ,  Seyed Gholamali Saddoughi ,  Matthew Patrick Boespflug ,  James T. Petroski

发明人： Mehmet Arik ,  Todd Garrett Wetzel ,  Seyed Gholamali Saddoughi ,  Matthew Patrick Boespflug ,  James T. Petroski

IPC分类号： F21V29/00

CPC分类号： F21V29/02 ,  F04D33/00 ,  F21V29/503 ,  F21V29/67 ,  F21V29/763 ,  F21Y2115/10 ,  H01L23/467 ,  H01L23/473 ,  H01L2924/0002 ,  Y10S362/80 ,  H01L2924/00

摘要： An LED light assembly includes a housing, an LED disposed in the housing, a heat dissipating structure and a fluid current generator. The LED is in thermal communication with the heat dissipating structure and includes a flow path surface. The fluid current generator is disposed in the housing to create a current over the flow path surface.

摘要翻译： LED灯组件包括壳体，设置在壳体中的LED，散热结构和流体电流发生器。 LED与散热结构热连通并且包括流路表面。 流体流动发生器设置在壳体中以在流路表面上产生电流。

公开(公告)号：US07095110B2

公开(公告)日：2006-08-22

申请号：US10851273

申请日：2004-05-21

申请人： Mehmet Arik ,  Stanton Earl Weaver, Jr. ,  Charles Becker

发明人： Mehmet Arik ,  Stanton Earl Weaver, Jr. ,  Charles Becker

IPC分类号： H01L23/10

CPC分类号： F21V29/51 ,  F21K9/00 ,  H01L25/0753 ,  H01L33/648 ,  H01L2224/16 ,  H01L2224/48091 ,  H01L2924/00014

摘要： A light emitting apparatus (10, 110, 210, 310, 410) includes one or more light emitting diode chips (12, 112, 212, 312, 412) disposed on a chip support wall (16, 116, 216) including printed circuitry (34, 134, 234, 360, 362, 460, 462) connecting with the light emitting diode chips. A heat pipe (24, 124, 224, 324, 424) has a sealed volume (22, 122, 222, 322, 422) defined by walls including the chip support wall and at least one additional wall (18, 20, 118, 120, 218). The heat pipe further includes a heat transfer fluid (26, 226, 326, 426) disposed in the sealed volume.

摘要翻译： 发光设备（10,110,210,310,410）包括设置在芯片支撑壁（16,116,216）上的一个或多个发光二极管芯片（12,112,212,312,412），其包括印刷电路 （34,134,234,360,362,460,462），与发光二极管芯片连接。 热管（24,124,224,324,424）具有由包括芯片支撑壁和至少一个附加壁（18,20,28）的壁限定的密封体积（22,122,222,322,422） 120,218）。 热管还包括设置在密封体积中的传热流体（26,226,326,426）。

公开(公告)号：US20050258438A1

公开(公告)日：2005-11-24

申请号：US10851273

申请日：2004-05-21

申请人： Mehmet Arik ,  Stanton Weaver ,  Charles Becker

发明人： Mehmet Arik ,  Stanton Weaver ,  Charles Becker

IPC分类号： F21K99/00 ,  H01L21/00 ,  H01L25/075 ,  H01L33/64 ,  H01L33/00

CPC分类号： F21V29/51 ,  F21K9/00 ,  H01L25/0753 ,  H01L33/648 ,  H01L2224/16 ,  H01L2224/48091 ,  H01L2924/00014

摘要： A light emitting apparatus (10, 110, 210, 310, 410) includes one or more light emitting diode chips (12, 112, 212, 312, 412) disposed on a chip support wall (16, 116, 216) including printed circuitry (34, 134, 234, 360, 362, 460, 462) connecting with the light emitting diode chips. A heat pipe (24, 124, 224, 324, 424) has a sealed volume (22, 122, 222, 322, 422) defined by walls including the chip support wall and at least one additional wall (18, 20, 118, 120, 218). The heat pipe further includes a heat transfer fluid (26, 226, 326, 426) disposed in the sealed volume.

摘要翻译： 发光设备（10,110,210,310,410）包括设置在芯片支撑壁（16,116,216）上的一个或多个发光二极管芯片（12,112,212,312,412），其包括印刷电路 （34,134,234,360,362,460,462），与发光二极管芯片连接。 热管（24,124,224,324,424）具有由包括芯片支撑壁和至少一个附加壁（18,20,28）的壁限定的密封体积（22,122,222,322,422） 120,218）。 热管还包括设置在密封体积中的传热流体（26,226,326,426）。

公开(公告)号：US10274263B2

公开(公告)日：2019-04-30

申请号：US13074700

申请日：2011-03-29

申请人： Mehmet Arik ,  Yogen Vishwas Utturkar

发明人： Mehmet Arik ,  Yogen Vishwas Utturkar

IPC分类号： F28F3/02 ,  H01L23/467

摘要： A system for cooling a device includes a heat sink comprising a substrate having a plurality of fins arranged thereon, a fan positioned to direct an ambient fluid in a first direction across the heat sink, and a first synthetic jet assembly comprising one of a multi-orifice synthetic jet and a plurality of single orifice synthetic jets. The first synthetic jet assembly is configured to direct the ambient fluid in a second direction across the heat sink, wherein the second direction is approximately perpendicular to the first direction.

公开(公告)号：US20160186979A1

公开(公告)日：2016-06-30

申请号：US15062823

申请日：2016-03-07

申请人： Mehmet Arik ,  Stanton Earl Weaver, JR.

发明人： Mehmet Arik ,  Stanton Earl Weaver, JR.

IPC分类号： F21V29/58 ,  H01L33/48 ,  H01L33/50 ,  H01L33/62 ,  F21V29/74 ,  H01L33/64

CPC分类号： F21V29/59 ,  C09K5/10 ,  F21K9/23 ,  F21V29/58 ,  F21V29/74 ,  F21Y2101/02 ,  F21Y2115/10 ,  F21Y2115/30 ,  F28D15/00 ,  H01L33/486 ,  H01L33/507 ,  H01L33/56 ,  H01L33/62 ,  H01L33/644 ,  H01L33/648 ,  H01L2224/48091 ,  H01L2933/0075 ,  Y02P20/124 ,  H01L2924/00014

摘要： The present invention provides an optoelectronic device comprising a heat source and a heat transfer fluid. The present invention also provides a method of preparing an optoelectronic device, which comprises (i) providing a heat source, and (ii) filling a space in the vicinity of the heat source with a heat transfer liquid. The optoelectronic device has gained technical merits such as improved heat removing efficiency, lower chip/junction temperature, increased lumen output, longer operational lifetime, and better reliability, among others.

摘要翻译： 本发明提供一种包括热源和传热流体的光电子器件。 本发明还提供一种制备光电子器件的方法，其包括（i）提供热源，和（ii）用热传递液体填充热源附近的空间。 光电子器件获得了诸如提高散热效率，降低芯片/结温，增加流明输出，延长使用寿命和更好的可靠性等技术优点。

公开(公告)号：US08602607B2

公开(公告)日：2013-12-10

申请号：US12908948

申请日：2010-10-21

申请人： Mehmet Arik ,  Stanton Earl Weaver ,  Glenn Howard Kuenzler ,  Charles Franklin Wolfe, Jr. ,  Rajdeep Sharma

发明人： Mehmet Arik ,  Stanton Earl Weaver ,  Glenn Howard Kuenzler ,  Charles Franklin Wolfe, Jr. ,  Rajdeep Sharma

IPC分类号： B60Q1/06

CPC分类号： F21V15/012 ,  F21K9/23 ,  F21S8/02 ,  F21V23/006 ,  F21V29/507 ,  F21V29/63 ,  F21V29/763 ,  F21Y2101/00 ,  F21Y2105/10 ,  F21Y2115/10 ,  Y10T29/49826

摘要： Lighting systems having unique configurations are provided. For instance, the lighting system may include a light source, a thermal management system and driver electronics, each contained within a housing structure. The light source is configured to provide illumination visible through an opening in the housing structure. The thermal management system includes a plurality of synthetic jets. The synthetic jets are arranged within the lighting system such that they are secured at contact points.

摘要翻译： 提供具有独特配置的照明系统。 例如，照明系统可以包括光源，热管理系统和驱动器电子器件，每个都包含在外壳结构内。 光源构造成通过壳体结构中的开口提供可见的照明。 热管理系统包括多个合成射流。 合成射流被布置在照明系统内，使得它们固定在接触点处。

公开(公告)号：US08564217B2

公开(公告)日：2013-10-22

申请号：US12822485

申请日：2010-06-24

申请人： Fei Han ,  Mehmet Arik ,  Trevor Wood ,  Charles Franklin Wolfe, Jr.

发明人： Fei Han ,  Mehmet Arik ,  Trevor Wood ,  Charles Franklin Wolfe, Jr.

IPC分类号： H01K1/62 ,  H05B1/00

CPC分类号： H01L23/467 ,  F21K9/23 ,  F21V29/63 ,  F21Y2105/10 ,  F21Y2115/10 ,  H01L2924/0002 ,  H01L2924/00

摘要： Apparatus and method are provided for reducing acoustical noise when cooling a device, such as a lamp system. The apparatus includes at least a set of a first synthetic jet and a second synthetic jet. The first and second synthetic jets are responsive to respective actuating signals having a phase difference (e.g., 180°) between one another chosen to reduce acoustic noise produced by the first and second synthetic jets when cooling the device.

摘要翻译： 提供了用于在冷却诸如灯系统的装置时降低声学噪声的装置和方法。 该装置至少包括一组第一合成射流和第二合成射流。 第一和第二合成射流响应于相应的致动信号，其具有彼此之间的相位差（例如，180°），其被选择为在冷却装置时减少由第一和第二合成射流产生的声音噪声。

公开(公告)号：US08496049B2

公开(公告)日：2013-07-30

申请号：US12421068

申请日：2009-04-09

申请人： Mehmet Arik ,  Tunc Icoz ,  Juan Manuel Rivas Davila ,  Charles Erklin Seeley ,  Yogen Vishwas Utturkar ,  Stanton Earl Weaver, Jr.

发明人： Mehmet Arik ,  Tunc Icoz ,  Juan Manuel Rivas Davila ,  Charles Erklin Seeley ,  Yogen Vishwas Utturkar ,  Stanton Earl Weaver, Jr.

IPC分类号： H05K7/20

CPC分类号： H01L23/467 ,  H01L2924/0002 ,  H01L2924/00

摘要： A heat sink with distributed jet cooling is provided. The heat sink includes a base for thermal connection to at least one heated object, an array of fins thermally coupled to the base, and at least one multi-orifice synthetic jet or multiple single orifice jets disposed on a side of the array of fins. A heat sink with distributed and integrated jet cooling is also provided and includes a base and an array of fins. Respective ones of at least a subset of the fins comprise a synthetic jet configured to eject an ambient fluid into an ambient environment of the fins and base. Another heat sink with distributed and integrated jet cooling is provided and includes a base, an array of fins and multiple synthetic jets coupled to respective ones of the fins. The synthetic jets are provided for at least a subset of the fins.

摘要翻译： 提供分布式喷射冷却的散热器。 散热器包括用于热连接到至少一个被加热物体的基座，热耦合到基座的翅片阵列，以及设置在翅片阵列侧面的至少一个多孔合成射流或多个单孔射流。 还提供了具有分布式和集成式射流冷却的散热器，并且包括底座和翅片阵列。 翅片的至少一个子集中的各个翼片包括配置成将周围流体喷射到翅片和底座的周围环境中的合成射流。 提供了具有分布式和集成的喷射式冷却的另一散热器，并且包括底座，翅片阵列和耦合到相应散热片的多个合成射流。 合成射流被提供用于鳍的至少一个子集。

公开(公告)号：US20130104595A1

公开(公告)日：2013-05-02

申请号：US13285375

申请日：2011-10-31

申请人： Jalal Hunain Zia ,  Douglas Carl Hofer ,  Vitali Victor Lissianski ,  Stephen Duane Sanborn ,  Mehmet Arik ,  Roger Allen Shisler ,  Paul Brian Wickersham

发明人： Jalal Hunain Zia ,  Douglas Carl Hofer ,  Vitali Victor Lissianski ,  Stephen Duane Sanborn ,  Mehmet Arik ,  Roger Allen Shisler ,  Paul Brian Wickersham

IPC分类号： F25J1/00

CPC分类号： F25J1/0027 ,  B01D53/002 ,  B01D2257/504 ,  B01D2258/0283 ,  F28D7/082 ,  F28D7/16 ,  F28F1/24

摘要： A heat exchange assembly for treating carbon dioxide (CO2) is described. The heat exchange assembly includes a housing that includes an inlet, an outlet, and an inner surface that defines a cavity extending between the inlet and the outlet. The housing is configured to receive solid CO2 through the inlet. At least one heat exchange tube extends through the housing. The heat exchange tube is oriented to contact solid CO2 to facilitate transferring heat from solid CO2 to a heat exchanger fluid being channeled through the heat exchange tube to facilitate converting at least a portion of solid CO2 into liquid CO2. The heat exchange assembly is configured to recover a refrigeration value from the solid CO2 and transfer at least a portion of the recovered refrigeration value to a flue gas.