公开(公告)号：US08605499B2

公开(公告)日：2013-12-10

申请号：US13092247

申请日：2011-04-22

申请人： Leland Chang ,  Michael A. Guillorn ,  Dechao Guo ,  Fei Liu ,  Keith Kwong Hon Wong

发明人： Leland Chang ,  Michael A. Guillorn ,  Dechao Guo ,  Fei Liu ,  Keith Kwong Hon Wong

IPC分类号： G11C11/50

CPC分类号： H03H9/2457 ,  G11C11/404 ,  G11C23/00 ,  H03H2009/02314

摘要： Systems and methods for operating a nanometer-scale cantilever beam with a gate electrode. An example system includes a drive circuit coupled to the gate electrode where a drive signal from the circuit may cause the beam to oscillate at or near the beam's resonance frequency. The drive signal includes an AC component, and may include a DC component as well. An alternative example system includes a nanometer-scale cantilever beam, where the beam oscillates to contact a plurality of drain regions.

摘要翻译： 用栅电极操作纳米级悬臂梁的系统和方法。 示例性系统包括耦合到栅电极的驱动电路，其中来自电路的驱动信号可以使光束在光束的共振频率处或其附近振荡。 驱动信号包括AC分量，并且还可以包括DC分量。 替代示例系统包括纳米级悬臂梁，其中光束振荡以接触多个漏极区域。

公开(公告)号：US08466443B2

公开(公告)日：2013-06-18

申请号：US12827197

申请日：2010-06-30

申请人： Terence L. Kane ,  Yun-Yu Wang ,  Keith Kwong Hon Wong

发明人： Terence L. Kane ,  Yun-Yu Wang ,  Keith Kwong Hon Wong

IPC分类号： H01L29/02

CPC分类号： H01L45/1616 ,  G11C17/14 ,  H01C7/1013 ,  H01C7/105 ,  H01L23/5256 ,  H01L2924/0002 ,  H01L2924/00

摘要： Disclosed is a voltage sensitive resistor (VSR) write once (WO) read only memory (ROM) device which includes a semiconductor device and a VSR connected to the semiconductor device. The VSR WO ROM device is a write once read only device. The VSR includes a CVD titanium nitride layer having residual titanium-carbon bonding such that the VSR is resistive as formed and can become less resistive by an order of 102, more preferably 103 and most preferably 104 when a predetermined voltage and current are applied to the VSR. A plurality of the VSR WO ROM devices may be arranged to form a high density programmable logic circuit in a 3-D stack. Also disclosed are methods to form the VSR WO ROM device.

摘要翻译： 公开了一种包括半导体器件和连接到半导体器件的VSR的一次（WO）只读存储器（ROM）器件的电压敏感电阻器（VSR）。 VSR WO ROM设备是一次写入只读设备。 VSR包括具有残留钛 - 碳键合的CVD氮化钛层，使得VSR是形成的电阻的，并且当预定的电压和电流被施加到电阻时，可以变得更小的电阻性为102，更优选为103，最优选为104。 VSR。 多个VSR WO ROM器件可以被布置成在3-D堆栈中形成高密度可编程逻辑电路。 还公开了形成VSR WO ROM器件的方法。

公开(公告)号：US08421228B2

公开(公告)日：2013-04-16

申请号：US13405443

申请日：2012-02-27

申请人： Ying Li ,  Keith Kwong Hon Wong ,  Chih-Chao Yang

发明人： Ying Li ,  Keith Kwong Hon Wong ,  Chih-Chao Yang

IPC分类号： H01L23/48 ,  H01L23/52 ,  H01L29/40

CPC分类号： H01L21/76844 ,  H01L21/76846 ,  H01L23/53223 ,  H01L2924/0002 ,  H01L2924/00

摘要： A contact structure and a method of forming the contact structure. The structure includes: a silicide layer on and in direct physical contact with a top substrate surface of a substrate; an electrically insulating layer on the substrate; and an aluminum plug within the insulating layer. The aluminum plug has a thickness not exceeding 25 nanometers in a direction perpendicular to the top substrate surface. The aluminum plug extends from a top surface of the silicide layer to a top surface of the insulating layer. The aluminum plug is in direct physical contact with the top surface of the silicide layer and is in direct physical contact with the silicide layer. The method includes: forming the silicide layer on and in direct physical contact with the top substrate surface of the substrate; forming the electrically insulating layer on the substrate; and forming the aluminum plug within the insulating layer.

摘要翻译： 接触结构和形成接触结构的方法。 该结构包括：与衬底的顶部衬底表面直接物理接触的硅化物层; 基板上的电绝缘层; 和绝缘层内的铝塞。 该铝塞的垂直于顶部基板表面的方向的厚度不超过25纳米。 铝塞从硅化物层的顶表面延伸到绝缘层的顶表面。 铝插塞与硅化物层的顶表面直接物理接触并与硅化物层直接物理接触。 该方法包括：在衬底的顶部衬底表面上直接物理接触形成硅化物层; 在基板上形成电绝缘层; 以及在所述绝缘层内形成所述铝塞。

公开(公告)号：US20120280322A1

公开(公告)日：2012-11-08

申请号：US13554305

申请日：2012-07-20

申请人： Dechao Guo ,  Wilfried E. Haensch ,  Xinhui Wang ,  Keith Kwong Hon Wong

发明人： Dechao Guo ,  Wilfried E. Haensch ,  Xinhui Wang ,  Keith Kwong Hon Wong

IPC分类号： H01L29/78

CPC分类号： H01L29/665 ,  H01L21/28088 ,  H01L21/28114 ,  H01L21/28525 ,  H01L21/76897 ,  H01L21/78 ,  H01L29/66545

摘要： A field effect transistor device includes a gate stack disposed on a substrate a first contact portion disposed on a first distal end of the gate stack, a second contact portion disposed on a second distal end of the gate stack, the first contact portion disposed a distance (d) from the second contact portion, and a third contact portion having a width (w) disposed in a source region of the device, the distance (d) is greater than the width (w).

摘要翻译： 场效应晶体管器件包括设置在基板上的栅极堆叠，设置在栅极堆叠的第一远端上的第一接触部分，设置在栅极堆叠的第二远端上的第二接触部分，第一接触部分设置距离 （d）从所述第二接触部分和具有设置在所述器件的源极区域中的宽度（w）的第三接触部分，所述距离（d）大于所述宽度（w）。

公开(公告)号：US08298882B2

公开(公告)日：2012-10-30

申请号：US12563032

申请日：2009-09-18

申请人： Kangguo Cheng ,  Bruce B. Doris ,  Keith Kwong Hon Wong

发明人： Kangguo Cheng ,  Bruce B. Doris ,  Keith Kwong Hon Wong

IPC分类号： H01L21/00

CPC分类号： H01L21/823807 ,  H01L21/823842 ,  H01L21/823857

摘要： Fabricating of semiconductor devices includes: depositing epitaxially a SiGe layer onto both NFET and PFET portions of a Si surface; blanket disposing a first sequence of layers over the SiGe layer including a high-k dielectric and a metal, incorporating the first sequence of layers into the gatestacks and gate insulators of both NFET devices and PFET devices; the first sequence of layers is selected to yield desired device parameter values for the PFET devices; removing the gatestack, the gate dielectric, and the SiGe layer for the NFET devices, re-forming the NFET devices by deploying a second sequence of layers that include a second high-k dielectric and a second metal; the second sequence of layers is selected to yield desired device parameter values for the NFET devices.

摘要翻译： 半导体器件的制造包括：在Si表面的NFET和PFET部分上外延沉积SiGe层; 在包括高k电介质和金属的SiGe层上布置第一层序列，将第一层序列结合到两个NFET器件和PFET器件的栅极绝缘体和栅极绝缘体中; 选择层的第一序列以产生PFET器件的期望的器件参数值; 去除用于NFET器件的盖板，栅极电介质和SiGe层，通过布置包括第二高k电介质和第二金属的第二层序列来重新形成NFET器件; 选择第二层次序列以产生NFET器件的期望的器件参数值。

公开(公告)号：US08288217B2

公开(公告)日：2012-10-16

申请号：US12945026

申请日：2010-11-12

申请人： Dechao Guo ,  Pranita Kulkarni ,  Philip J. Oldiges ,  Alexander Reznicek ,  Keith Kwong Hon Wong

发明人： Dechao Guo ,  Pranita Kulkarni ,  Philip J. Oldiges ,  Alexander Reznicek ,  Keith Kwong Hon Wong

IPC分类号： H01L21/338

CPC分类号： H01L29/66545 ,  H01L29/1054 ,  H01L29/66477 ,  H01L29/66651 ,  H01L29/7843 ,  H01L29/7848

摘要： A field effect transistor device includes a gate stack portion disposed on a substrate, and a channel region in the substrate having a depth partially defined by the gate stack portion and a silicon region of the substrate, the silicon region having a sloped profile such that a distal regions of the channel region have greater depth than a medial region of the channel region.

摘要翻译： 场效应晶体管器件包括设置在衬底上的栅极堆叠部分和衬底中的沟道区域，其具有由栅极堆叠部分和衬底的硅区域部分地限定的深度，所述硅区域具有倾斜轮廓，使得 沟道区域的远侧区域具有比沟道区域的中间区域更深的深度。

公开(公告)号：US20120256277A1

公开(公告)日：2012-10-11

申请号：US13083893

申请日：2011-04-11

申请人： Bruce B. Doris ,  Kangguo Cheng ,  Keith Kwong Hon Wong

发明人： Bruce B. Doris ,  Kangguo Cheng ,  Keith Kwong Hon Wong

IPC分类号： H01L29/772 ,  H01L21/28

CPC分类号： H01L29/518 ,  H01L27/24 ,  H01L29/41775 ,  H01L29/42376 ,  H01L29/495 ,  H01L29/4966 ,  H01L29/517 ,  H01L29/665 ,  H01L29/6653 ,  H01L29/66545 ,  H01L29/6659 ,  H01L29/7833 ,  H01L29/7843

摘要： A semiconductor device includes a substrate and a gate stack disposed on the substrate. An upper layer of the gate stack is a metal gate conductor and a lower layer of the gate stack is a gate dielectric. A gate contact is in direct contact with the metal gate conductor.

摘要翻译： 半导体器件包括衬底和设置在衬底上的栅极堆叠。 栅极堆叠的上层是金属栅极导体，栅极叠层的下层是栅极电介质。 栅极触点与金属栅极导体直接接触。

公开(公告)号：US08268689B2

公开(公告)日：2012-09-18

申请号：US12860979

申请日：2010-08-23

申请人： Dechao Guo ,  Keith Kwong Hon Wong

发明人： Dechao Guo ,  Keith Kwong Hon Wong

IPC分类号： H01L27/088

CPC分类号： H01L29/78696 ,  H01L21/845 ,  H01L27/1211 ,  H01L29/42392 ,  H01L29/66795

摘要： A method for fabricating a field effect transistor device includes forming a first conducting channel and a second conducting channel, forming a first gate stack on the first conducting channel to partially define a first device, forming second gate stack on the second conducting channel to partially define a second device, implanting ions to form a source region and a drain region connected to the first conducting channel and the second conducting channel, forming a masking layer over second device, a portion of the source region and a portion of the drain region, performing a first annealing process operative to change a threshold voltage of the first device, removing a portion of the masking layer to expose the second device, and performing a second annealing process operative to change the threshold voltage of the first device and a threshold voltage of the second device.

摘要翻译： 一种用于制造场效应晶体管器件的方法包括形成第一导电沟道和第二导电沟道，在第一导电沟道上形成第一栅极叠层以部分地限定第一器件，在第二导电沟道上形成第二栅极堆叠以部分地限定 第二装置，注入离子以形成连接到第一导电沟道和第二导电沟道的源极区域和漏极区域，在第二器件上形成掩模层，源极区域的一部分和漏极区域的一部分，执行 第一退火处理，其可操作以改变第一器件的阈值电压，去除掩模层的一部分以暴露第二器件，以及执行可操作以改变第一器件的阈值电压的第二退火处理和第二器件的阈值电压 第二设备

公开(公告)号：US08237457B2

公开(公告)日：2012-08-07

申请号：US12503116

申请日：2009-07-15

申请人： Satya N. Chakravarti ,  Dechao Guo ,  Chuck T. Le ,  Byoung W. Min ,  Thekkemadathil V. Rajeevakumar ,  Keith Kwong Hon Wong

发明人： Satya N. Chakravarti ,  Dechao Guo ,  Chuck T. Le ,  Byoung W. Min ,  Thekkemadathil V. Rajeevakumar ,  Keith Kwong Hon Wong

IPC分类号： G01R27/08 ,  H01L23/52 ,  H01L29/10

CPC分类号： H01L27/0617 ,  H01L23/5252 ,  H01L27/112 ,  H01L27/11206 ,  H01L29/4966 ,  H01L29/66545 ,  H01L29/7833 ,  H01L2924/0002 ,  H01L2924/00

摘要： After planarization of a gate level dielectric layer, a dummy structure is removed to form a recess. A first conductive material layer and an amorphous metal oxide are deposited into the recess area. A second conduct material layer fills the recess. After planarization, an electrical antifuse is formed within the filled recess area, which includes a first conductive material portion, an amorphous metal oxide portion, and a second conductive material portion. To program the electrical antifuse, current is passed between the two terminals in the pair of the conductive contacts to transform the amorphous metal oxide portion into a crystallized metal oxide portion, which has a lower resistance. A sensing circuit determines whether the metal oxide portion is in an amorphous state (high resistance state) or in a crystalline state (low resistance state).

摘要翻译： 在栅极级介电层平坦化之后，去除虚拟结构以形成凹陷。 第一导电材料层和无定形金属氧化物沉积到凹陷区域中。 第二导电材料层填充凹部。 在平坦化之后，在填充的凹陷区域内形成电反熔丝，其包括第一导电材料部分，非晶金属氧化物部分和第二导电材料部分。 为了编程电反熔丝，电流在一对导电触头中的两个端子之间通过，以将非晶金属氧化物部分转变成具有较低电阻的结晶化金属氧化物部分。 感测电路确定金属氧化物部分是非晶态（高电阻状态）还是结晶态（低电阻状态）。

公开(公告)号：US20120129340A1

公开(公告)日：2012-05-24

申请号：US13360248

申请日：2012-01-27

申请人： Terence L. Kane ,  Michael P. Tenney ,  Yun-Yu Wang ,  Keith Kwong Hon Wong

发明人： Terence L. Kane ,  Michael P. Tenney ,  Yun-Yu Wang ,  Keith Kwong Hon Wong

IPC分类号： H01L21/283

CPC分类号： H01L23/5252 ,  H01L21/76823 ,  H01L21/76843 ,  H01L2924/0002 ,  H01L2924/00

摘要： An antifuse structure and methods of forming contacts within the antifuse structure. The antifuse structure includes a substrate having an overlying metal layer, a dielectric layer formed on an upper surface of the metal layer, and a contact formed of contact material within a contact via etched through the dielectric layer into the metal layer. The contact via includes a metal material at a bottom surface of the contact via and an untreated or partially treated metal precursor on top of the metal material.