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126 条记录 (耗时 0.056 秒)

    MEMS devices with multi-component sacrificial layers
    31.
    发明授权
    MEMS devices with multi-component sacrificial layers 有权
    具有多组分牺牲层的MEMS器件

    公开(公告)号：US07952789B2

    公开(公告)日：2011-05-31

    申请号：US12719751

    申请日：2010-03-08

    申请人： Ming-Hau Tung ,  Lior Kogut

    发明人： Ming-Hau Tung ,  Lior Kogut

    IPC分类号： G02B26/00 ,  G02F1/03

    CPC分类号： B81C1/00801 ,  B81B3/001 ,  B81B3/0072 ,  B81B2201/042 ,  B81C2201/0109 ,  B81C2201/017 ,  B81C2201/112 ,  B81C2201/115 ,  G02B26/001 ,  Y10T428/30 ,  Y10T428/31678 ,  Y10T428/31935

    摘要： Methods of forming a protective coating on one or more surfaces of a microelectromechanical device are disclosed comprising the steps of forming a composite layer of a sacrificial material and a protective material, and selectively etching the sacrificial material to form a protective coating. The protective coatings of the invention preferably improve one or more aspects of the performance of the microelectromechanical devices in which they are incorporated. Also disclosed are microelectromechanical devices formed by methods of the invention, and visual display devices incorporating such devices.

    摘要翻译： 公开了在微机电装置的一个或多个表面上形成保护涂层的方法，其包括以下步骤：形成牺牲材料和保护材料的复合层，并选择性地蚀刻牺牲材料以形成保护涂层。 本发明的保护性涂层优选地改进了其中并入其中的微机电装置的性能的一个或多个方面。 还公开了通过本发明的方法形成的微机电装置以及包括这种装置的视觉显示装置。

    Method of fabricating interferometric devices using lift-off processing techniques
    33.
    发明授权
    Method of fabricating interferometric devices using lift-off processing techniques 有权
    使用剥离处理技术制造干涉仪的方法

    公开(公告)号：US07906353B2

    公开(公告)日：2011-03-15

    申请号：US12494032

    申请日：2009-06-29

    申请人： Clarence Chui ,  Ming-Hau Tung

    发明人： Clarence Chui ,  Ming-Hau Tung

    IPC分类号： H01L21/00

    CPC分类号： G02B26/001

    摘要： Embodiments of the present disclosure include a method of fabricating interferometric devices using lift-off processing techniques. Use of lift-off processing in the fabrication of various layers of interferometric modulators, such as an optical stack or a flex layer, advantageously avoids individualized chemistries associated with the plurality of materials associated with each layer thereof. Moreover, use of lift-off processing allows much greater selection in both materials and facilities available for fabrication of interferometric modulators.

    摘要翻译： 本公开的实施例包括使用剥离处理技术制造干涉仪的方法。 在诸如光学堆叠或柔性层的各种干涉式调制器的制造中使用剥离处理有利地避免了与与其每层相关联的多种材料相关联的个体化化学物质。 此外，使用剥离处理可以在可用于制造干涉式调制器的材料和设备中进行更大的选择。

    Selective etching of MEMS using gaseous halides and reactive co-etchants
    35.
    发明授权
    Selective etching of MEMS using gaseous halides and reactive co-etchants 失效
    使用气态卤化物和反应性辅助蚀刻剂选择性蚀刻MEMS

    公开(公告)号：US07566664B2

    公开(公告)日：2009-07-28

    申请号：US11497726

    申请日：2006-08-02

    申请人： Xiaoming Yan ,  Brian Arbuckle ,  Evgeni Gousev ,  Ming-Hau Tung

    发明人： Xiaoming Yan ,  Brian Arbuckle ,  Evgeni Gousev ,  Ming-Hau Tung

    IPC分类号： H01L21/20

    CPC分类号： G02B26/001 ,  B81B2201/047 ,  B81C1/00595 ,  B81C2201/0132

    摘要： A method for etching a target material in the presence of a structural material with improved selectivity uses a vapor phase etchant and a co-etchant. Embodiments of the method exhibit improved selectivities of from at least about 2-times to at least about 100-times compared with a similar etching process not using a co-etchant. In some embodiments, the target material comprises a metal etchable by the vapor phase etchant. Embodiments of the method are particularly useful in the manufacture of MEMS devices, for example, interferometric modulators. In some embodiments, the target material comprises a metal etchable by the vapor phase etchant, for example, molybdenum and the structural material comprises a dielectric, for example silicon dioxide.

    摘要翻译： 在具有改进的选择性的结构材料存在下蚀刻靶材料的方法使用气相蚀刻剂和共蚀刻剂。 与不使用共蚀刻剂的类似蚀刻工艺相比，该方法的实施例表现出从至少约2倍至至少约100倍的改进的选择性。 在一些实施例中，靶材料包括可由气相蚀刻剂蚀刻的金属。 该方法的实施例在MEMS器件（例如干涉式调制器）的制造中特别有用。 在一些实施例中，靶材料包括可由气相蚀刻剂（例如，钼）蚀刻的金属，并且结构材料包括电介质，例如二氧化硅。

    METHOD OF MANUFACTURE FOR MICROELECTROMECHANICAL DEVICES
    36.
    发明申请
    METHOD OF MANUFACTURE FOR MICROELECTROMECHANICAL DEVICES 有权
    微电子设备制造方法

    公开(公告)号：US20090068781A1

    公开(公告)日：2009-03-12

    申请号：US12271793

    申请日：2008-11-14

    申请人： Ming-Hau Tung ,  Brian James Gally ,  Manish Kothari ,  Clarence Chui ,  John Batey

    发明人： Ming-Hau Tung ,  Brian James Gally ,  Manish Kothari ,  Clarence Chui ,  John Batey

    IPC分类号： H01L21/00

    CPC分类号： B81C1/00579 ,  B81B3/0008 ,  Y10T428/12542

    摘要： A method of manufacturing a microelectromechanical device includes forming at least two conductive layers on a substrate. An isolation layer is formed between the two conductive layers. The conductive layers are electrically coupled together and then the isolation layer is removed to form a gap between the conductive layers. The electrical coupling of the layers mitigates or eliminates the effects of electrostatic charge build up on the device during the removal process.

    摘要翻译： 一种制造微机电装置的方法包括在基板上形成至少两个导电层。 在两个导电层之间形成隔离层。 导电层电耦合在一起，然后去除隔离层以在导电层之间形成间隙。 这些层的电耦合可减轻或消除在去除过程中静电积累在器件上的影响。

    SYSTEM AND METHOD FOR MEASURING ADHESION FORCES IN MEMS DEVICES
    37.
    发明申请
    SYSTEM AND METHOD FOR MEASURING ADHESION FORCES IN MEMS DEVICES 审中-公开
    用于测量MEMS器件中粘合力的系统和方法

    公开(公告)号：US20090051369A1

    公开(公告)日：2009-02-26

    申请号：US11842914

    申请日：2007-08-21

    申请人： Lior Kogut ,  Ming-Hau Tung ,  Sauri Gudlavalleti

    发明人： Lior Kogut ,  Ming-Hau Tung ,  Sauri Gudlavalleti

    IPC分类号： G01R27/26 ,  G01J3/46 ,  G02B5/08 ,  G06F19/00 ,  G01N27/00

    CPC分类号： G02B26/0841 ,  B81B2201/047 ,  B81C99/0045 ,  G02B26/001

    摘要： A MEMS test device comprises a flexible beam spaced apart from an optical stack. The MEMS test device includes a reflective layer and a partially reflective layer, such that a change in the position of the MEMS test device can be observed without the use of an external interferometer. The flexible beam may be cantilevered or fixed at each end. The flexible beam may include a shoe suspended from the side of the beam facing the optical stack, to provide a fixed contact area. An array of MEMS test devices may be used to determine compliance, or to calculate adhesion forces.

    摘要翻译： MEMS测试装置包括与光学堆叠间隔开的柔性梁。 MEMS测试装置包括反射层和部分反射层，使得可以在不使用外部干涉仪的情况下观察MEMS测试装置的位置的改变。 柔性梁可以在每一端悬臂或固定。 柔性梁可以包括从面向光学堆叠的梁的侧面悬挂的鞋，以提供固定的接触面积。 可以使用一系列MEMS测试装置来确定柔量，或计算附着力。

    SYSTEM AND METHOD FOR MICRO-ELECTROMECHANICAL OPERATION OF AN INTERFEROMETRIC MODULATOR
    38.
    发明申请
    SYSTEM AND METHOD FOR MICRO-ELECTROMECHANICAL OPERATION OF AN INTERFEROMETRIC MODULATOR 失效
    一种干涉式调制器的微机电操作系统与方法

    公开(公告)号：US20090022884A1

    公开(公告)日：2009-01-22

    申请号：US12241600

    申请日：2008-09-30

    申请人： Clarence Chui ,  William J. Cummings ,  Brian J. Gally ,  Ming-Hau Tung

    发明人： Clarence Chui ,  William J. Cummings ,  Brian J. Gally ,  Ming-Hau Tung

    IPC分类号： B81C5/00 ,  B05D5/12

    CPC分类号： B81B3/001 ,  B81B2201/042 ,  G02B26/001

    摘要： An interferometric modulator is formed by a stationary layer and a mirror facing the stationary layer. The mirror is movable between the undriven and driven positions. Landing pads, bumps or spring clips are formed on at least one of the stationary layer and the mirror. The landing pads, bumps or spring clips can prevent the stationary layer and the mirror from contacting each other when the mirror is in the driven position. The spring clips exert force on the mirror toward the undriven position when the mirror is in the driven position and in contact with the spring clips.

    摘要翻译： 干涉式调制器由固定层和面向固定层的反射镜形成。 镜子可以在未驱动和被驱动位置之间移动。 在固定层和反射镜中的至少一个上形成着陆垫，凸块或弹簧夹。 当反射镜处于驱动位置时，着陆垫，凸块或弹簧夹可以防止固定层和反射镜彼此接触。 当镜子处于从动位置并与弹簧夹接触时，弹簧夹在镜子上朝着未驱动的位置施加力。

    Method of manufacture for microelectromechanical devices
    39.
    发明授权
    Method of manufacture for microelectromechanical devices 有权
    微机电装置的制造方法

    公开(公告)号：US07476327B2

    公开(公告)日：2009-01-13

    申请号：US10839329

    申请日：2004-05-04

    申请人： Ming-Hau Tung ,  Brian James Gally ,  Manish Kothari ,  Clarence Chui ,  John Batey

    发明人： Ming-Hau Tung ,  Brian James Gally ,  Manish Kothari ,  Clarence Chui ,  John Batey

    IPC分类号： B21D39/00

    CPC分类号： B81C1/00579 ,  B81B3/0008 ,  Y10T428/12542

    摘要： A method of manufacturing a microelectromechanical device includes forming at least two conductive layers on a substrate. An isolation layer is formed between the two conductive layers. The conductive layers are electrically coupled together and then the isolation layer is removed to form a gap between the conductive layers. The electrical coupling of the layers mitigates or eliminates the effects of electrostatic charge build up on the device during the removal process.

    摘要翻译： 一种制造微机电装置的方法包括在基板上形成至少两个导电层。 在两个导电层之间形成隔离层。 导电层电耦合在一起，然后去除隔离层以在导电层之间形成间隙。 这些层的电耦合可减轻或消除在去除过程中静电积累在器件上的影响。

    Methods of fabricating interferometric modulators by selectively removing a material
    40.
    发明授权
    Methods of fabricating interferometric modulators by selectively removing a material 失效
    通过选择性去除材料制造干涉式调制器的方法

    公开(公告)号：US07429334B2

    公开(公告)日：2008-09-30

    申请号：US11090778

    申请日：2005-03-25

    申请人： Ming-Hau Tung ,  Manish Kothari ,  William J. Cummings

    发明人： Ming-Hau Tung ,  Manish Kothari ,  William J. Cummings

    IPC分类号： B29D11/00

    CPC分类号： B81C1/00174 ,  B81B2201/047 ,  B81B2203/0181 ,  B81C1/00182 ,  B81C2201/0109 ,  G02B26/001

    摘要： Methods for making MEMS devices such as interferometric modulators involve selectively removing a sacrificial portion of a material to form an internal cavity, leaving behind a remaining portion of the material to form a post structure. The material may be blanket deposited and selectively altered to define sacrificial portions that are selectively removable relative to the remaining portions. Alternatively, a material layer can be laterally recessed away from openings in a covering layer. These methods may be used to make unreleased and released interferometric modulators.

    摘要翻译： 用于制造诸如干涉式调制器的MEMS器件的方法包括选择性地去除材料的牺牲部分以形成内部空腔，留下材料的剩余部分以形成柱状结构。 该材料可以被毯式沉积并选择性地改变以限定相对于其余部分可选择性地移除的牺牲部分。 或者，材料层可以横向凹入远离覆盖层中的开口。 这些方法可用于制造未释放和释放的干涉式调制器。