公开(公告)号：US08696161B2

公开(公告)日：2014-04-15

申请号：US13314352

申请日：2011-12-08

申请人： Ching-Jen Pan ,  Cheng-Wei Chan ,  Ming-Hung Chen

发明人： Ching-Jen Pan ,  Cheng-Wei Chan ,  Ming-Hung Chen

IPC分类号： F21V21/00 ,  F26B19/00

CPC分类号： F26B19/00 ,  A45D29/00 ,  A45D2200/205

摘要： A high-luminance ultraviolet (UV) light-emitting diode (LED) nail lamp structure and an LED light source module thereof are provided. The LED nail lamp structure includes a housing and an LED light source module. The LED light source module is provided in the housing and has a plurality of UV LEDs, wherein each UV LED has an LED chip disposed in a concave lamp cup. The LED nail lamp structure features high luminance and good lighting effect.

摘要翻译： 提供了高亮度紫外（UV）发光二极管（LED）指甲灯结构及其LED光源模块。 LED指甲灯结构包括壳体和LED光源模块。 LED光源模块设置在壳体中并具有多个UV LED，其中每个UV LED具有设置在凹灯杯中的LED芯片。 LED指甲灯结构具有高亮度和良好的照明效果。

公开(公告)号：US20130109001A1

公开(公告)日：2013-05-02

申请号：US13314352

申请日：2011-12-08

申请人： Ching-Jen PAN ,  Cheng-Wei Chan ,  Ming-Hung Chen

发明人： Ching-Jen PAN ,  Cheng-Wei Chan ,  Ming-Hung Chen

IPC分类号： F26B3/34

CPC分类号： F26B19/00 ,  A45D29/00 ,  A45D2200/205

摘要： A high-luminance ultraviolet (UV) light-emitting diode (LED) nail lamp structure and an LED light source module thereof are provided. The LED nail lamp structure includes a housing and an LED light source module. The LED light source module is provided in the housing and has a plurality of UV LEDs, wherein each UV LED has an LED chip disposed in a concave lamp cup. The LED nail lamp structure features high luminance and good lighting effect.

摘要翻译： 提供了高亮度紫外（UV）发光二极管（LED）指甲灯结构及其LED光源模块。 LED指甲灯结构包括壳体和LED光源模块。 LED光源模块设置在壳体中并具有多个UV LED，其中每个UV LED具有设置在凹灯杯中的LED芯片。 LED指甲灯结构具有高亮度和良好的照明效果。

公开(公告)号：US20130067703A1

公开(公告)日：2013-03-21

申请号：US13236747

申请日：2011-09-20

申请人： Ming-Hung Chen

发明人： Ming-Hung Chen

IPC分类号： A44B11/25

CPC分类号： A44B11/2588 ,  Y10T24/45267

摘要： A safety connector assembly for a lanyard having a first end portion and a second end portion includes a first connecting portion and a second connecting portion. The first connecting portion included a first surface, a second surface, an accommodating space, and a ring protrusion. The first surface is connected to the first end portion. The accommodating space is on the second surface. The ring protrusion extends from the accommodating space. The second connecting portion includes a third surface, a fourth surface, and a protruding portion. The third surface is connected to the second end portion. The protruding portion includes a protrusion and extends from the fourth surface. The protrusion is spaced apart from the fourth surface to form a space therebetween. When the first connecting portion interconnects with the second connecting portion, the protruding portion extends into the accommodating space and the ring protrusion abuts against the protrusion.

摘要翻译： 一种用于具有第一端部和第二端部的系绳的安全连接器组件包括第一连接部分和第二连接部分。 第一连接部分包括第一表面，第二表面，容纳空间和环形突起。 第一表面连接到第一端部。 容纳空间在第二表面上。 环形突起从容纳空间延伸。 第二连接部分包括第三表面，第四表面和突出部分。 第三表面连接到第二端部。 突出部分包括突起并且从第四表面延伸。 突起与第四表面间隔开，以在它们之间形成空间。 当第一连接部分与第二连接部分互连时，突出部分延伸到容纳空间中，并且环形突起抵靠突起。

公开(公告)号：US20120018773A1

公开(公告)日：2012-01-26

申请号：US13258627

申请日：2009-04-07

申请人： Jing-Yi Chen ,  Shih-Yi Wen ,  Ching-Jen Pan ,  Ming-Hung Chen

发明人： Jing-Yi Chen ,  Shih-Yi Wen ,  Ching-Jen Pan ,  Ming-Hung Chen

IPC分类号： H01L33/64

CPC分类号： H05B33/0821 ,  H01L2224/48091 ,  H01L2224/73265 ,  H05B33/0803 ,  H05B33/089 ,  Y02B20/341 ,  H01L2924/00014

摘要： The present invention relates to an alternating current (AC) light emitting diode (LED) structure with overload protection, which comprises an AC LED, a heat dissipating unit and an overload protecting unit. The AC LED is thermally connected with the heat dissipating unit, and the overload protecting unit is connected in series between the AC LED and a power source. Thus, when an overload current is inputted to the AC LED structure, the temperature of the overload protecting unit will rise to disconnect the AC LED from the power source. In this way, an open-circuit status can be produced timely in the AC LED structure to block the power input into the AC LED for purpose of protection against overload.

摘要翻译： 本发明涉及具有过载保护的交流（AC）发光二极管（LED）结构，其包括AC LED，散热单元和过载保护单元。 交流LED与散热单元热连接，过载保护单元串联连接在交流LED和电源之间。 因此，当过载电流被输入到AC LED结构时，过载保护单元的温度将升高以将AC LED与电源断开。 以这种方式，可以在AC LED结构中及时产生开路状态，以阻断AC LED的电力输入，以防止过载。

公开(公告)号：US20110121723A1

公开(公告)日：2011-05-26

申请号：US13003702

申请日：2008-08-12

申请人： Ming-Hung Chen ,  Shih-Yi Wen ,  Jing-Yi Chen

发明人： Ming-Hung Chen ,  Shih-Yi Wen ,  Jing-Yi Chen

IPC分类号： H01J1/62

CPC分类号： H01L33/486 ,  H01L25/0753 ,  H01L25/167 ,  H01L33/62 ,  H01L2924/0002 ,  H05B33/0821 ,  H01L2924/00

摘要： An LED base structure with an embedded capacitor includes a body, at least one pair of metal layers, at least one dielectric layer, and at least two conductive channels. The body is an insulating base. The metal layers are disposed in the body, and the dielectric layer is disposed between the metal layers, so as to form an embedded capacitor. The conductive channels are electrically connected to the metal layers, respectively. The LED base structure is further electrically connected to a resistor for forming a resistor-capacitor delay circuit whereby a phase delay is effectuated whenever AC power is supplied to the LED base structure, so as to control the time for switching on one of two parallel-connected LEDs and, as a result, prevent the LEDs from flashing which might otherwise arise when the LEDs are supplied with AC power.

摘要翻译： 具有嵌入式电容器的LED基座结构包括主体，至少一对金属层，至少一个电介质层和至少两个导电沟道。 身体是绝缘基座。 金属层设置在主体中，并且电介质层设置在金属层之间，以便形成嵌入式电容器。 导电通道分别电连接到金属层。 LED基座结构进一步电连接到用于形成电阻器 - 电容器延迟电路的电阻器，由此每当向LED基座结构提供AC电力时，实现相位延迟，以便控制用于切换两个并联 - 连接的LED，从而防止LED闪烁，否则当LED被提供交流电源时可能会发生。

公开(公告)号：US20110090713A1

公开(公告)日：2011-04-21

申请号：US12990068

申请日：2008-07-08

申请人： Ming-Hung Chen ,  Jing-Yi Chen

发明人： Ming-Hung Chen ,  Jing-Yi Chen

IPC分类号： F21V8/00 ,  F21V7/04

CPC分类号： G02F1/133608 ,  G02B6/0021 ,  G02B6/0036 ,  G02B6/0068 ,  G02F1/133615

摘要： A flexible backlight module includes a light source module and a flexible light guide panel, wherein the flexible light guide panel has a light incident surface, a light reflecting surface, and a light outgoing surface. The light incident surface of the flexible light guide panel is directly connected and thereby optically coupled to the light source module so that the light emitted by the light source module can be completely coupled to the flexible light guide panel. Consequently, the loss of light is reduced while the luminous efficiency of light is increased. Light entering the flexible light guide panel is reflected by the light reflecting surface to the light outgoing surface and then projected outward. The flexible light guide panel can be curved as needed thanks to its flexibility and thus features a wide application range.

摘要翻译： 柔性背光模块包括光源模块和柔性导光板，其中柔性导光板具有光入射表面，光反射表面和光出射表面。 柔性导光板的光入射表面直接连接，从而光耦合到光源模块，使得由光源模块发射的光可以完全耦合到柔性导光板。 因此，光的损失降低，同时光的发光效率增加。 进入柔性导光板的光被光反射面反射到光出射面，然后向外突出。 柔性导光板由于其灵活性而可以根据需要弯曲，因此具有广泛的应用范围。

公开(公告)号：US20110044035A1

公开(公告)日：2011-02-24

申请号：US12937784

申请日：2008-04-16

申请人： Ming-Hung Chen ,  Shih-Yi Wen ,  Hsin-Tai Lin ,  Jing-Yi Chen

发明人： Ming-Hung Chen ,  Shih-Yi Wen ,  Hsin-Tai Lin ,  Jing-Yi Chen

IPC分类号： F21V33/00 ,  H02M7/06

CPC分类号： H02M7/08 ,  H02M7/10

摘要： A parallel bridge circuit structure and a high-voltage parallel bridge circuit structure are disclosed. The parallel bridge circuit structure includes a first bridge circuit and a second bridge circuit. The first bridge circuit includes a plurality of first diodes, and the second bridge circuit includes a plurality of second diodes. Each of the second diodes is exclusively connected to one of the first diodes in parallel. With the design of the parallel connection between the first bridge circuit and the second bridge circuit, break of the entire circuit caused by a damaged diode is prevented. Moreover, with the aid of the AC signal phase delay circuit structure, the output voltage of the parallel bridge circuit structure can be stable and continuous voltage, while the high-voltage parallel bridge circuit structure includes a plurality of parallel bridge circuit structures so as to endure a high voltage input.

摘要翻译： 公开了并联桥式电路结构和高压并联桥式电路结构。 并联电路电路结构包括第一桥接电路和第二桥接电路。 第一桥接电路包括多个第一二极管，第二桥接电路包括多个第二二极管。 每个第二二极管并联地独立地连接到第一二极管之一。 通过设计第一桥接电路和第二桥接电路之间的并联连接，可以防止由损坏的二极管引起的整个电路的断开。 此外，借助于交流信号相位延迟电路结构，并联桥式电路结构的输出电压可以稳定和连续的电压，而高压并联桥电路结构包括多个并联桥电路结构，以便 忍受高电压输入。

公开(公告)号：US20100163909A1

公开(公告)日：2010-07-01

申请号：US12664061

申请日：2007-09-27

申请人： Ming-Hung Chen ,  Shih-Yi Wen ,  Hsin-Tai Lin

发明人： Ming-Hung Chen ,  Shih-Yi Wen ,  Hsin-Tai Lin

IPC分类号： H01L33/00

CPC分类号： H01L33/56 ,  H01L33/54 ,  H01L2224/48091 ,  H01L2224/8592 ,  H01L2924/00014

摘要： A manufacturing method and a structure of a light-emitting diode (LED) with a multilayered optical lens are provided. The manufacturing method includes the steps of: providing an LED chip; forming at least one inner protective layer covering the LED chip and its wire connecting points; and forming an outer protective layer covering the inner protective layer. Both the inner and outer protective layers are optical resin layers while the inner protective layer is harder than the outer protective layer. The structure of the LED includes: an LED chip; at least one inner protective layer covering the LED chip and its wire connecting points; and an outer protective layer covering the said inner protective layer. The relatively hard said inner protective layer can resist external force transmitted by the outer protective layer and protect the LED chip and its wire connecting points from damage by the external force.

摘要翻译： 提供具有多层光学透镜的发光二极管（LED）的制造方法和结构。 该制造方法包括以下步骤：提供LED芯片; 形成覆盖LED芯片及其导线连接点的至少一个内部保护层; 以及形成覆盖所述内保护层的外保护层。 内保护层和外保护层都是光学树脂层，而内保护层比外保护层更硬。 LED的结构包括：LED芯片; 覆盖LED芯片及其导线连接点的至少一个内部保护层; 以及覆盖所述内保护层的外保护层。 相对较硬的内保护层可以抵抗由外保护层传递的外力，并保护LED芯片及其导线连接点免受外力损坏。

公开(公告)号：US20100060131A1

公开(公告)日：2010-03-11

申请号：US12441214

申请日：2006-09-13

申请人： Cheng-Wei Chan ,  Ming-Hung Chen ,  Shih-Yi Wen ,  Chun-Che Lee

发明人： Cheng-Wei Chan ,  Ming-Hung Chen ,  Shih-Yi Wen ,  Chun-Che Lee

IPC分类号： H01J61/52 ,  H01J5/50

CPC分类号： H01L33/647 ,  F21K9/00 ,  F21V19/0025 ,  F21V29/773 ,  F21Y2115/10 ,  H01L33/62 ,  H01L33/642 ,  H01L2224/48091 ,  H01L2924/3011 ,  H01L2924/00014

摘要： An LED bulb structure having an insertion end includes a first electrically conducting pin, a second electrically conducting pin having a die pad at an end thereof, and an LED unit electrically connected to the first electrically conducting pin and the second electrically conducting pin through a first leading wire and a second leading wire, respectively, and a cap enclosing the above-mentioned components and leaving part of the first electrically conducting pin and the second electrically conducting pin exposed thereoutside. The first and second electrically conducting pins are adapted to form bayonet connections. An LED bulb structure having a heat dissipation element has the heat dissipation element attached to the pin portions of the electrically conducting pins. An LED bulb structure having a heat-and-electricity separated element further has a thermally conducting pin.

摘要翻译： 具有插入端的LED灯泡结构包括第一导电销，在其一端具有芯片焊盘的第二导电销以及通过第一导电销与第一导电销和第二导电销电连接的LED单元 引线和第二引线，以及封闭上述部件的盖，并使第一导电销和第二导电销的一部分露出在外侧。 第一和第二导电销适于形成卡口连接。 具有散热元件的LED灯泡结构具有安装在导电销的销部分上的散热元件。 具有热电分离元件的LED灯泡结构还具有导热销。

公开(公告)号：US07521724B2

公开(公告)日：2009-04-21

申请号：US11147185

申请日：2005-06-08

申请人： Ming-Hung Chen ,  Shih-Yi Wen ,  Wu-Cheng Kuo ,  Bing-Ru Chen ,  Jui-Ping Weng ,  Hsiao-Wen Lee

发明人： Ming-Hung Chen ,  Shih-Yi Wen ,  Wu-Cheng Kuo ,  Bing-Ru Chen ,  Jui-Ping Weng ,  Hsiao-Wen Lee

IPC分类号： H01L29/06 ,  H01L31/00 ,  H01L29/26 ,  H01L33/00 ,  H01L31/12 ,  H01L21/00 ,  H01L21/76

CPC分类号： H01L33/486 ,  H01L33/60 ,  H01L33/62 ,  H01L33/641 ,  H01L2224/16225 ,  H01L2224/48227 ,  H01L2924/00011 ,  H01L2924/00014 ,  H01L2924/3011 ,  H01L2924/3025 ,  H01L2224/48091 ,  H01L2924/00 ,  H01L2224/0401

摘要： A light emitting diode (LED) package and process of making the same includes a silicon-on-insulator (SOI) substrate that is composed of two silicon based materials and an insulation layer interposed therebetween. The two silicon based materials of silicon-on-insulator substrate are etched to form a reflective cavity and an insulation trench, respectively, for dividing the silicon-on-insulator substrate into contact surfaces of positive and negative electrodes. A plurality of metal lines are then formed to electrically connect the two silicon based materials such that the LED chip can be mounted on the reflective cavity and electrically connected to the corresponding electrodes of the silicon-on-insulator substrate by the metal lines. Thus the properties of heat resistance and heat dispersal can be improved and the process can be simplified.

摘要翻译： 发光二极管（LED）封装及其制造方法包括由两个硅基材料和介于其间的绝缘层组成的绝缘体上硅（SOI）衬底。 蚀刻绝缘体上硅衬底的两种硅基材料，以分别形成反射腔和绝缘沟槽，以将绝缘体上硅衬底分成阳极和负电极的接触表面。 然后形成多个金属线以电连接两个硅基材料，使得LED芯片可以安装在反射腔上并且通过金属线电连接到绝缘体上硅衬底的相应电极。 因此，可以提高耐热性和热分散性，并且可以简化工艺。