公开(公告)号：US20240142122A1

公开(公告)日：2024-05-02

申请号：US18279705

申请日：2022-03-02

Applicant: NEC Corporation

Inventor： Yoshinori MIYAMOTO ,  Minoru YOSHIKAWA ,  Koichi TODOROKI

IPC: F24F7/06 ,  F24F13/10

CPC classification number: F24F7/06 ,  F24F13/10 ,  F24F2110/10

Abstract: The cooling system includes a duct that draws in air that is drawn in from an intake side of a cooling target, which is disposed in a room adjusted to a predetermined temperature, that absorbs the heat of the cooling target, and that is exhausted from an exhaust side of the cooling target, and that guides the air to the intake side; a cooler that is provided in the duct and that cools the air; a monitoring device that monitors a cooling state of at least one of the cooling target and the cooler; and a duct adjustment device that operates the duct to guide the air in the duct in a direction different from a direction toward the intake side when the monitoring device detects an abnormality in the cooling state.

公开(公告)号：US20230221084A1

公开(公告)日：2023-07-13

申请号：US18116622

申请日：2023-03-02

Applicant: NEC Corporation

Inventor： Koichi TODOROKI ,  Minoru YOSHIKAWA ,  Masaki CHIBA

IPC: F28F9/02 ,  F28F1/10 ,  H05K7/20 ,  F24F13/30 ,  F24F1/0063 ,  F24F1/0323

CPC classification number: F28F9/02 ,  F28F1/10 ,  H05K7/208 ,  F24F13/30 ,  F24F1/0063 ,  F24F1/0323

Abstract: A heat exchanger has a structure in which a heat exchanger main body through which coolant flows is obliquely installed in a box-shaped enclosure, the heat exchanger main body is constituted by a header pipe and a plurality of heat transfer pipes connected to the header pipe and disposed at predetermined intervals along a surface of a part of the header pipe, the header pipe has an area adjacent to an inner surface of the enclosure, and a seal section is provided between the inner surface of the enclosure and the area of the header pipe adjacent to the enclosure.

公开(公告)号：US20220377944A1

公开(公告)日：2022-11-24

申请号：US17764293

申请日：2019-10-02

Applicant: NEC Corporation

Inventor： Nirmal Singh RAJPUT ,  Masaki CHIBA ,  Mahiro HACHIYA ,  Takafumi NATSUMEDA ,  Yoshinori MIYAMOTO ,  Minoru YOSHIKAWA

IPC: H05K7/20 ,  F28D15/06 ,  F28D15/02

Abstract: The present invention provides an attachment for a server rack cooling system having at least one heat exchange condenser, the attachment includes: a pipe extension configured to connect to a portion of the server rack cooling system at which air and refrigerant are able to be transferred into the attachment from the at least one heat exchange condenser; a valve on the pipe extension configured to allow exhaust to the outside through the pipe extension at an open position and to block exhaust to the outside at a closed position; and an sensor disposed at a position inside of the pipe extension between the at least one heat exchange condenser and the valve and configured to provide a detection signal determined by a presence of fluid at the position of the sensor; wherein, the valve is opened and closed based on the detection signal from the sensor.

公开(公告)号：US20220141993A1

公开(公告)日：2022-05-05

申请号：US17505805

申请日：2021-10-20

Applicant: NEC Corporation

Inventor： Kenji KOBAYASHI ,  Kunihiko ISHIHARA ,  Koichi TODOROKI ,  Yoshinori MIYAMOTO ,  Minoru YOSHIKAWA

IPC: H05K7/20

Abstract: A cooling apparatus includes a duct provided above a cooling target and configured to guide an air discharged after absorbing heat generated inside the cooling target to the cooling target, a cooler provided in the duct and configured to cool the air flowing in the duct, and an adjusting mechanism provided downstream of the cooler and configured to adjust the air discharged from the duct to the cooling target, and the duct receives the air discharged from one side of the cooling target and directed upward, guides the air to another side of the cooling target, and discharges the air downward on the other side, and the adjusting mechanism changes a position of an opening at a discharge port of the duct.

公开(公告)号：US20220074607A1

公开(公告)日：2022-03-10

申请号：US17464907

申请日：2021-09-02

Applicant: NEC Corporation

Inventor： Mahiro HACHIYA ,  Minoru YOSHIKAWA

IPC: F24F1/38

Abstract: An outdoor unit in which, by installing small fans near the ventilation surface of a heat exchanger so as to be parallel with the ventilation surface of the heat exchanger and arranging the small fans so that the ventilation areas of the small fans and the heat exchanger are equivalent, the number of small fans that can be installed is maximized while reducing power consumption.

公开(公告)号：US20210003327A1

公开(公告)日：2021-01-07

申请号：US16982790

申请日：2019-03-20

Applicant: NEC Corporation

Inventor： Koichi TODOROKI ,  Minoru YOSHIKAWA ,  Kunihiko ISHIHARA ,  Masaki CHIBA ,  Yoshinori MIYAMOTO ,  Takafumi NATSUMEDA ,  Nirmal Singh RAJPUT

IPC: F25B41/00

Abstract: In order to efficiently distribute a heat medium at a low heat medium pressure, a heat exchange apparatus includes a heat exchange pipe 2 configured to accommodate a heat medium L to be evaporated by heat absorption from a gas to be cooled, the heat exchange pipe being disposed in an inclined state, a supply pipe 1 configured to supply the heat medium L in a liquid-phase state, the supply pipe being placed in a vicinity of a lower part of the heat exchange pipe 2, a discharge pipe 3 configured to receive a heat medium L to be evaporated in the heat exchange pipe 2 and discharged from an upper part of the heat exchange pipe, and a connecting pipe 4 placed, directing downward, between an upper part of the heat exchange pipe 2 and the discharge pipe 3.

公开(公告)号：US20180266744A1

公开(公告)日：2018-09-20

申请号：US15761150

申请日：2016-09-21

Applicant: NEC CORPORATION

Inventor： Hisato SAKUMA ,  Minoru YOSHIKAWA ,  Masaki CHIBA

IPC: F25B49/02 ,  F25B5/02 ,  F25B41/04

CPC classification number: F25B49/02 ,  F25B5/02 ,  F25B23/006 ,  F25B41/04 ,  H01L23/427 ,  H05K7/2029

Abstract: A cooling performance of a phase-change cooling system that circulates a refrigerant liquid using a driving source is remarkably lowered immediately after the startup. Thus, the phase-change cooling system according to the present invention includes: an evaporator that contains the refrigerant liquid for receiving the heat from the heating source; a condenser that releases the heat of the refrigerant vapor generated by the vaporization of the refrigerant liquid at the evaporator and generates the refrigerant liquid; the refrigerant liquid driving means for circulating the refrigerant liquid; the first piping unit for connecting the evaporator with the condenser; the second piping unit for connecting the condenser with the refrigerant liquid driving means; the third piping unit for connecting the refrigerant liquid driving means with the evaporator; and the fourth piping unit that has one end, at the first connection point, connected with the first piping unit and the other end, at the second connection point, connected with the second piping unit, in which the first connection point is positioned at a lower place than a position of an interface between the refrigerant liquid and the refrigerant vapor within the first piping unit when the refrigerant liquid driving means is started up.

公开(公告)号：US20180059746A1

公开(公告)日：2018-03-01

申请号：US15559885

申请日：2016-03-17

Applicant: NEC CORPORATION

Inventor： Masanori SATO ,  Minoru YOSHIKAWA ,  Akira SHOUJGUCHI ,  Arhiro MATSUNAGA

IPC: G06F1/20 ,  G05D7/06 ,  G05B15/02 ,  F28D15/06 ,  F28D15/02

CPC classification number: G06F1/206 ,  F28D15/0266 ,  F28D15/06 ,  F28D2021/0028 ,  G05B15/02 ,  G05D7/0676 ,  G06F1/20 ,  H05K7/20827 ,  H05K7/20836 ,  Y02D10/16

Abstract: With a phase change cooling device, it is difficult to obtain reliable high-efficiency cooling performance due to a change in heat exchange performance. Thus, a phase change cooling device according to the present invention includes: a heat receiving apparatus that houses a coolant; a sensor that acquires heat receiving apparatus coolant information that is information relating to a liquid-gas two-phase flow interface of the coolant housed in the heat receiving apparatus; a radiator that radiates heat of coolant vapor of the coolant heat-received and evaporated in the heat receiving apparatus, and recirculates liquefied coolant liquid to the heat receiving apparatus; a valve that controls a flow rate of the coolant liquid; and a control unit that controls a degree of opening of the valve, wherein the control unit controls, based on the heat receiving apparatus coolant information, a degree of opening of the valve in such a way that a liquid-gas two-phase flow interface of the coolant is located at an end part of the heat receiving apparatus in a vertical direction.

公开(公告)号：US20170125323A1

公开(公告)日：2017-05-04

申请号：US15128354

申请日：2015-03-20

Applicant: NEC Corporation

Inventor： Hitoshi SAKAMOTO ,  Minoru YOSHIKAWA ,  Mahiro HACHIYA

IPC: H01L23/427 ,  H01L23/40 ,  H05K7/20

CPC classification number: H01L23/427 ,  F28D15/0266 ,  H01L23/4006 ,  H01L2023/4056 ,  H01L2023/4062 ,  H01L2023/4068 ,  H01L2924/0002 ,  H05K7/20318 ,  H01L2924/00

Abstract: A cooler grows in size and its structure becomes complicated in a phase-change cooler if it is intended to cool a plurality of heating elements; therefore, a phase-change cooler according to an exemplary aspect of the present invention includes a heat-conducting board configured to be thermally connected to a cooling object; heat receiving means for storing a refrigerant and receiving heat of the cooling object through the heat-conducting board; radiation means for radiating heat, condensing and devolatilizing a vapor-phase refrigerant arising from vaporization of the refrigerant in the heat receiving means; and connection means for connecting the heat receiving means and the radiation means.

公开(公告)号：US20160295749A1

公开(公告)日：2016-10-06

申请号：US15037859

申请日：2014-11-14

Applicant: NEC Corporation

Inventor： Minoru YOSHIKAWA ,  Kenichi INABA ,  Masanori SATO ,  Akira SHOUJIGUCHI ,  Arihiro MATSUNAGA ,  Masaki CHIBA

IPC: H05K7/20 ,  G06F1/20

CPC classification number: H05K7/20818 ,  F28D15/0266 ,  F28D15/0275 ,  F28D2015/0216 ,  F28F2250/06 ,  G06F1/20

Abstract: A vapor pipe 103 connects a heat dissipation portion 200 and each of a plurality of heat receiving portions 102. A liquid pipe 104 connects the heat dissipation portion 200 and each of a plurality of the heat receiving portions 102. A bypass pipe 105 connects the vapor pipe 103 and the liquid pipe 104. A valve 106 opens and closes a flow path of the bypass pipe 105. A first connection portion 107 connects the vapor pipe 103 and the bypass pipe 105. A second connection portion 108 connects the liquid pipe 103 and the bypass pipe 105. The first connection portion 107 is disposed at a position higher than that of the second connection portion 108. As a result, refrigerant can be efficiently transported in a short time.

Abstract translation: 蒸气管103将散热部200与多个受热部102中的每一个连接。液体管104将散热部200与多个受热部102连接。旁通管105将蒸气 管道103和液体管道104.阀门106打开和关闭旁通管道105的流路。第一连接部分107连接蒸汽管道103和旁路管道105.第二连接部分108将液体管道103和 旁通管105.第一连接部107设置在比第二连接部108高的位置。结果，可以在短时间内有效地输送制冷剂。