Abstract:
An image sensor package with a folded cover-glass sealing interface includes (a) an image sensor with a light-receiving surface, (b) a substrate having (i) a recessed surface to which the image sensor is bonded, (ii) a second surface facing in a direction parallel to optical axis of the image sensor, surrounding the recessed surface, and being further than the light-receiving surface from the recessed surface, and (iii) a third surface facing the optical axis, and adjoining and surrounding the second surface, and (c) a cover glass bonded to the substrate with a folded sealing-interface at the second surface and the third surface.
Abstract:
A novel multi-display projection box includes a housing that is short and wide, a set of display panels, a set of projectors, and a controller. In a particular embodiment the set of display panels includes two display panels, each coupled to opposite sides of the housing. The set of projectors includes two projectors placed adjacent opposite side walls of the housing. One of the projectors projects a first image onto one of the display panels and the other projector projects a second image onto the other display panel. The first and second image can include product information corresponding to goods placed atop the projection box in a retail store.
Abstract:
A liquid-crystal-on-silicon (LCOS) panel includes a wafer having bond pads thereon, a liquid crystal layer, and a conductive layer. The panel carrier for the LCOS panel includes a conductive-layer electrode for electrically connecting the conductive layer to a printed circuit assembly (PCA), address electrodes for electrically connecting the bond pads to the PCA, and a cavity for holding the LCOS panel. The cavity includes a conductive pad for electrically connecting the conductive layer to the conductive-layer electrode, and bond-pad electrodes for electrically connecting each bond pad to a respective address electrode. A method for electrically connecting an LCOS panel to a panel carrier includes a step of electrically connecting each bond pad to a respective address electrode, and a step of electrically connecting the conductive layer to the conductive pad.
Abstract:
An imaging package includes an image sensor package formed with a semiconductor substrate. A removable transparent cover is bonded over the image sensor package to cover a first side the image sensor package. A lateral dimension of the removable transparent cover along a first direction is larger than a lateral dimension of the image sensor package along the first direction. An overhang portion of the removable transparent cover is defined by an exposed portion of the removable transparent cover that extends beyond a lateral side of the image sensor package along the first direction.
Abstract:
A liquid crystal on silicon (LCOS) panel is provided that includes an electrical contact layer deposited in a pattern on a portion of a transparent conductive layer. An alignment layer protects the conductive layer and electrical contact layer during LCOS panel assembly. The alignment layer is etched away to expose the electrical contact, which protects the underlying conductive layer from the etching process. The resulting LCOS panel has more reliably formed electrical contacts for improved stability of electrical connections to the conductive layer. A method for forming an electrical contact layer on a conductive layer of a LCOS panel includes steps for depositing a patterned layer on a portion of the conductive layer. The method is compatible with microfabrication techniques for scalable manufacturing. The resulting LCOS panel includes a pattern of one or more electrical contacts exposed on a portion of the conductive layer.
Abstract:
An image sensor includes a photosensing element for receiving infrared (IR) radiation and detecting the IR radiation and generating an electrical signal indicative of the IR radiation. A redistribution layer (RDL) is disposed under the photosensing element, the RDL comprising pattern of conductors for receiving the electrical signal. An IR reflection layer, an IR absorption layer or an isolation layer is disposed between the photosensing element and the RDL. The IR reflection layer, IR absorption layer or isolation layer provides a barrier to IR radiation such that the IR radiation does not impinge upon the RDL. As a result, a ghost image of the RDL is not generated, resulting in reduced noise and improved sensitivity and performance of the image sensor.
Abstract:
An image sensor includes a photosensing element for receiving infrared (IR) radiation and detecting the IR radiation and generating an electrical signal indicative of the IR radiation. A redistribution layer (RDL) is disposed under the photosensing element, the RDL comprising pattern of conductors for receiving the electrical signal. An IR reflection layer, an IR absorption layer or an isolation layer is disposed between the photosensing element and the RDL. The IR reflection layer, IR absorption layer or isolation layer provides a barrier to IR radiation such that the IR radiation does not impinge upon the RDL. As a result, a ghost image of the RDL is not generated, resulting in reduced noise and improved sensitivity and performance of the image sensor.
Abstract:
A thermal carrier and method control a temperature of an LCOS display panel. The temperature of the LCOS display panel is determined. Electrical power to a heating element within a thermal carrier carrying the LCOS display panel is increased when the temperature of the LCOS display panel is below a first temperature threshold and electrical power to the heating element is decreased when the temperature of the LCOS display panel is above a second temperature threshold.
Abstract:
A thermal carrier and method control a temperature of an LCOS display panel. The temperature of the LCOS display panel is determined Electrical power to a heating element within a thermal carrier carrying the LCOS display panel is increased when the temperature of the LCOS display panel is below a first temperature threshold and electrical power to the heating element is decreased when the temperature of the LCOS display panel is above a second temperature threshold.
Abstract:
An image sensor package with a multi-step cavity formed in or on a substrate, which includes an image sensor bonded onto bottom of the multi-step cavity, and a cover glass placed and sealed on a lower portion of the multi-step cavity. Lower portion of the multi-step cavity includes at least a first and a second raised-step structures protruding from the bottom of the multi-step cavity, and the cover glass is placed and sealed over the first raised-step structure.