公开(公告)号：US07160432B2

公开(公告)日：2007-01-09

申请号：US10608404

申请日：2003-06-26

申请人： Feng Q. Liu ,  Liang-Yuh Chen ,  Stan D. Tsai ,  Alain Duboust ,  Siew S. Neo ,  Yongqi Hu ,  Yan Wang ,  Paul D. Butterfield

发明人： Feng Q. Liu ,  Liang-Yuh Chen ,  Stan D. Tsai ,  Alain Duboust ,  Siew S. Neo ,  Yongqi Hu ,  Yan Wang ,  Paul D. Butterfield

IPC分类号： B23H5/08

CPC分类号： B23H3/08 ,  B23H5/08 ,  B24B37/0056 ,  B24B37/044 ,  B24B37/046 ,  C09G1/04 ,  C25F3/02 ,  H01L21/3212 ,  H01L21/32125 ,  H01L21/32134 ,  H01L21/7684

摘要： Polishing compositions and methods for removing conductive materials from a substrate surface are provided. In one aspect, a method is provided for processing a substrate to remove conductive material disposed over narrow feature definitions formed in a substrate at a higher removal rate than conductive material disposed over wide feature definitions formed in a substrate by an electrochemical mechanical polishing technique. The electrochemical mechanical polishing technique may include a polishing composition comprising an acid based electrolyte system, one or more chelating agents, one or more corrosion inhibitors, one or more inorganic or organic acid salts, one or more pH adjusting agents to provide a pH between about 2 and about 10, and a solvent.

摘要翻译： 提供了抛光组合物和从衬底表面去除导电材料的方法。 在一个方面，提供了一种处理衬底以除去布置在形成于衬底中的窄特征定义之上的导电材料的方法，该导电材料以比通过电化学机械抛光技术在衬底中形成的宽特征定义上布置的导电材料更高的去除速率。 电化学机械抛光技术可以包括抛光组合物，其包含酸性电解质体系，一种或多种螯合剂，一种或多种腐蚀抑制剂，一种或多种无机或有机酸盐，一种或多种pH调节剂，以提供约 2和约10，和溶剂。

公开(公告)号：US20060231414A1

公开(公告)日：2006-10-19

申请号：US11424170

申请日：2006-06-14

申请人： Paul Butterfield ,  Liang-Yuh Chen ,  Yongqi Hu ,  Antoine Manens ,  Rashid Mavliev ,  Stan Tsai

发明人： Paul Butterfield ,  Liang-Yuh Chen ,  Yongqi Hu ,  Antoine Manens ,  Rashid Mavliev ,  Stan Tsai

IPC分类号： B23H5/06

CPC分类号： H01L21/32125 ,  B23H5/08 ,  B24B37/046 ,  B24B37/24 ,  B24B53/017

摘要： Systems and methods for electrochemically processing a substrate. A contact element defines a substrate contact surface positionable in contact a substrate during processing. In one embodiment, the contact element comprises a wire element. In another embodiment the contact element is a rotating member. In one embodiment, the contact element comprises a noble metal.

摘要翻译： 用于电化学处理衬底的系统和方法。 接触元件限定在处理期间可定位成接触衬底的衬底接触表面。 在一个实施例中，接触元件包括线元件。 在另一个实施例中，接触元件是旋转构件。 在一个实施例中，接触元件包括贵金属。

公开(公告)号：US07077721B2

公开(公告)日：2006-07-18

申请号：US10727724

申请日：2003-12-03

申请人： Yongqi Hu ,  Stan D. Tsai ,  Yan Wang ,  Feng Q. Liu ,  Shou-Sung Chang ,  Liang-Yuh Chen

发明人： Yongqi Hu ,  Stan D. Tsai ,  Yan Wang ,  Feng Q. Liu ,  Shou-Sung Chang ,  Liang-Yuh Chen

IPC分类号： B24D11/00 ,  C25D17/10 ,  B23H5/08

CPC分类号： B24B37/26 ,  B23H5/06 ,  B23H5/08 ,  B23H5/10 ,  B24B37/042 ,  B24B37/046 ,  B24B37/22 ,  B24B37/24 ,  B24B49/16 ,  B24B53/017 ,  C25D17/14 ,  H01L21/32125

摘要： Embodiments of a processing pad assembly for processing a substrate are provided. The processing pad assembly includes an upper layer having a processing surface and an electrode having a top side coupled to the upper layer and a bottom side opposite the top side. A first set of holes is formed through the upper layer for exposing the electrode to the processing surface. At least one aperture is formed through the upper layer and the electrode.

摘要翻译： 提供了用于处理衬底的处理衬垫组件的实施例。 处理垫组件包括具有处理表面的上层和具有联接到上层的顶侧和与顶侧相对的底侧的电极。 通过上层形成第一组孔，用于将电极暴露于处理表面。 通过上层和电极形成至少一个孔。

公开(公告)号：US20060144825A1

公开(公告)日：2006-07-06

申请号：US11368839

申请日：2006-03-06

申请人： Stand Tsai ,  Shijian Li ,  Feng Liu ,  Lizhong Sun ,  Liang-Yuh Chen

发明人： Stand Tsai ,  Shijian Li ,  Feng Liu ,  Lizhong Sun ,  Liang-Yuh Chen

IPC分类号： C09K13/00 ,  C03C15/00 ,  H01L21/302 ,  B44C1/22 ,  C23F1/00

CPC分类号： B24B37/0056 ,  B24B37/044 ,  C09G1/02 ,  C09K3/1463 ,  H01L21/3212

摘要： Compositions and methods for removal of barrier layer materials by a chemical mechanical polishing technique are provided. In one aspect, the invention provides a composition adapted for removing a barrier layer material in a chemical mechanical polishing technique including at least one reducing agent selected from the group of bicarboxylic acids, tricarboxylic acids, and combinations thereof, at least one reducing agent selected from the group of glucose, hydroxylamine, and combinations thereof, and deionized water, wherein the composition has a pH of about 7 or less. The composition may be used in a method for removing the barrier layer material including applying the composition to a polishing pad and polishing the substrate in the presence of the composition to remove the barrier layer.

公开(公告)号：US06988942B2

公开(公告)日：2006-01-24

申请号：US10894756

申请日：2004-07-20

申请人： Liang-Yuh Chen ,  Yuchun Wang ,  Yan Wang ,  Alain Duboust ,  Daniel A. Carl ,  Ralph Wadensweiler ,  Manoocher Birang ,  Paul D. Butterfield ,  Rashid Mavliev ,  Stan D. Tsai

发明人： Liang-Yuh Chen ,  Yuchun Wang ,  Yan Wang ,  Alain Duboust ,  Daniel A. Carl ,  Ralph Wadensweiler ,  Manoocher Birang ,  Paul D. Butterfield ,  Rashid Mavliev ,  Stan D. Tsai

IPC分类号： B24D11/00

CPC分类号： H01L21/32125 ,  B23H5/08 ,  B24B37/22 ,  B24B37/24 ,  B24B37/26 ,  B24B53/017 ,  B24B57/02 ,  B82Y30/00 ,  Y10T428/24273 ,  Y10T428/24355 ,  Y10T428/24628 ,  Y10T428/24917

摘要： An article of manufacture and apparatus are provided for planarizing a substrate surface. In one aspect, an article of manufacture is provided for polishing a substrate including polishing article comprising a body having at least a partially conductive surface adapted to polish the substrate and a mounting surface. A plurality of perforations may be formed in the polishing article for flow of material therethrough. In another aspect, a polishing article for polishing a substrate includes a body having a polishing surface and a conductive element disposed therein. The conductive element may have a contact surface that extends beyond a plane defined by the polishing surface. The polishing surface may have one or more pockets formed therein. The conductive element may be disposed in each of the polishing pockets.

公开(公告)号：US20050284770A1

公开(公告)日：2005-12-29

申请号：US11215254

申请日：2005-08-30

申请人： Paul Butterfield ,  Liang-Yuh Chen ,  Yonqi Hu ,  Antoine Manens ,  Rashid Mavliev ,  Stan Tsai ,  Feng Liu ,  Ralph Wadensweiler ,  Lizhong Sun ,  Siew Neo ,  Alain Duboust

发明人： Paul Butterfield ,  Liang-Yuh Chen ,  Yonqi Hu ,  Antoine Manens ,  Rashid Mavliev ,  Stan Tsai ,  Feng Liu ,  Ralph Wadensweiler ,  Lizhong Sun ,  Siew Neo ,  Alain Duboust

IPC分类号： B23H5/00 ,  B23H5/06 ,  B23H5/08 ,  B23H5/10 ,  B24B37/04 ,  B24B49/16 ,  B24B53/007 ,  B24D13/14 ,  C25D17/00 ,  C25D17/10 ,  H01L21/321

CPC分类号： B23H5/06 ,  B23H5/08 ,  B23H5/10 ,  B24B37/046 ,  B24B37/11 ,  B24B37/22 ,  B24B37/24 ,  B24B37/26 ,  B24B49/16 ,  B24B53/017 ,  C25D17/10 ,  H01L21/32125

摘要： Embodiments of a polishing article for polishing a substrate are provided. In one embodiment, the polishing article includes a ring-shaped upper layer having a polishing surface, and a conductive layer coupled to the upper layer and forming a replaceable assembly therewith.

摘要翻译： 提供了用于研磨衬底的抛光制品的实施例。 在一个实施例中，抛光制品包括具有抛光表面的环形上层，以及耦合到上层并与其形成可更换组件的导电层。

公开(公告)号：US06977036B2

公开(公告)日：2005-12-20

申请号：US10837955

申请日：2004-05-03

申请人： Ralph Wadensweiler ,  Alain Duboust ,  Liang-Yuh Chen ,  Manoocher Birang ,  Ratson Morad ,  Paul D. Butterfield

发明人： Ralph Wadensweiler ,  Alain Duboust ,  Liang-Yuh Chen ,  Manoocher Birang ,  Ratson Morad ,  Paul D. Butterfield

IPC分类号： B23H5/08 ,  C25F7/00 ,  C25F3/00 ,  C25C7/04 ,  C25D17/00

CPC分类号： B23H5/08 ,  C25F7/00

摘要： A method and apparatus are provided for polishing a substrate surface. In one aspect, an apparatus for polishing a substrate includes a conductive polishing pad and an electrode having a membrane disposed therebetween. The membrane is orientated relative the conductive pad in a manner that facilitates removal of entrained gas from electrolyte flowing towards the conductive pad. The apparatus may be part of an electro-chemical polishing station that may optionally be part of a system that includes chemical mechanical polishing stations.

公开(公告)号：US20050202677A1

公开(公告)日：2005-09-15

申请号：US11114936

申请日：2005-04-25

申请人： Wei-Yung Hsu ,  Liang-Yuh Chen ,  Ratson Morad ,  Daniel Carl

发明人： Wei-Yung Hsu ,  Liang-Yuh Chen ,  Ratson Morad ,  Daniel Carl

IPC分类号： H01L21/288 ,  H01L21/321 ,  C25C3/00

CPC分类号： H01L21/7684 ,  H01L21/3212

摘要： Methods and apparatus for planarizing a substrate surface are provided. In one aspect, a method is provided for planarizing a substrate surface including polishing a first conductive material to a barrier layer material, depositing a second conductive material on the first conductive material by an electrochemical deposition technique, and polishing the second conductive material and the barrier layer material to a dielectric layer. In another aspect, a processing system is provided for forming a planarized layer on a substrate, the processing system including a computer based controller configured to cause the system to polish a first conductive material to a barrier layer material, deposit a second conductive material on the first conductive material by an electrochemical deposition technique, and polish the second conductive material and the barrier layer material to a dielectric layer.

摘要翻译： 提供了用于平坦化基板表面的方法和装置。 在一个方面，提供了一种用于平坦化衬底表面的方法，包括将第一导电材料抛光到阻挡层材料，通过电化学沉积技术在第一导电材料上沉积第二导电材料，以及抛光第二导电材料和屏障 层材料到介电层。 在另一方面，提供一种用于在衬底上形成平坦化层的处理系统，所述处理系统包括基于计算机的控制器，所述计算机控制器被配置为使所述系统将第一导电材料抛光至阻挡层材料，将第二导电材料沉积在所述第二导电材料上 通过电化学沉积技术的第一导电材料，并将第二导电材料和阻挡层材料抛光到介电层。

公开(公告)号：US20050194681A1

公开(公告)日：2005-09-08

申请号：US11066599

申请日：2005-02-25

申请人： Yongqi Hu ,  Stan Tsai ,  Martin Wohlert ,  Feng Liu ,  Liang-Yuh Chen

发明人： Yongqi Hu ,  Stan Tsai ,  Martin Wohlert ,  Feng Liu ,  Liang-Yuh Chen

IPC分类号： H01L23/48

CPC分类号： B24B37/22 ,  B23H5/08 ,  H01L21/67155

摘要： A method and apparatus for a planarizing or polishing article for Electrochemical Mechanical Planarization (ECMP) is disclosed. The polishing article is a pad assembly having a plurality of conductive domains and a plurality of abrasive domains on a processing surface. The abrasive domains and the conductive domains comprise a plurality of contact elements that are adapted to bias a semiconductor substrate while also providing abrasive qualities to enhance removal of material deposited on the substrate.

摘要翻译： 公开了一种用于电化学机械平面化（ECMP）的平面化或抛光制品的方法和装置。 抛光制品是在处理表面上具有多个导电区域和多个磨料区域的垫组件。 研磨区域和导电区域包括适于偏置半导体衬底的多个接触元件，同时还提供磨料质量以增强沉积在衬底上的材料的去除。

公开(公告)号：US20050178666A1

公开(公告)日：2005-08-18

申请号：US11034225

申请日：2005-01-12

申请人： Stan Tsai ,  Ralph Waldensweiler ,  Yongqi Hu ,  Liang-Yuh Chen ,  Donald Olgado

发明人： Stan Tsai ,  Ralph Waldensweiler ,  Yongqi Hu ,  Liang-Yuh Chen ,  Donald Olgado

IPC分类号： B23K5/08 ,  C25D5/02 ,  C25D5/34 ,  C25D7/00 ,  C25D7/12 ,  C25D17/14 ,  C25F7/00

CPC分类号： C25F7/00 ,  B23K5/08 ,  C25D7/123 ,  C25D17/14

摘要： Methods are provided for forming a conductor for use in electrochemical mechanical polishing. In one aspect a method is provided for processing a substrate including providing a substrate having a conductive surface, depositing a resist material on the conductive surface, patterning the resist layer to expose portions of the conductive surface, and depositing a metal layer on the exposed portions of the conductive surface by an electrochemical deposition technique.

摘要翻译： 提供了用于形成用于电化学机械抛光的导体的方法。 在一个方面，提供了一种用于处理衬底的方法，包括提供具有导电表面的衬底，在导电表面上沉积抗蚀剂材料，图案化抗蚀剂层以暴露导电表面的部分，以及在暴露部分上沉积金属层 的导电表面。