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公开(公告)号：US08647174B2
公开(公告)日：2014-02-11
申请号：US13262855
申请日：2010-04-26
申请人： Hiroshi Takai
发明人： Hiroshi Takai
IPC分类号： B24B1/00
CPC分类号： B24B53/017 , B24B37/042 , B24B37/08 , B24B53/07 , B24B53/12 , H01L21/02024
摘要： Disclosed is a semiconductor wafer polishing method for polishing the surfaces to be polished of semiconductor wafers by use of polishing pads (16, 17) provided on fixing plates by relative movement of the polishing pads and the semiconductor wafers held by carriers. The shaping surfaces (25) of a polishing pad shaping jig (21) are shaped by inverting, with respect to ideal shapes, the shapes of the surfaces to be polished of each semiconductor wafer when the surfaces are polished by use of the polishing pads (16, 17) before shaping, and the shapes of the shaping surfaces of the polishing pad shaping jig are transferred to the pad surfaces (16A and 17A) of the respective polishing pads (16, 17). The surfaces to be polished of each semiconductor wafer are polished by use of the pad surfaces.
摘要翻译： 公开了一种半导体晶片抛光方法，其通过抛光垫和由载体保持的半导体晶片的相对运动，通过使用设置在固定板上的抛光垫（16,17）来研磨半导体晶片的抛光表面。 抛光垫成形夹具（21）的成形表面（25）通过使用抛光垫（表面抛光）来抛光每个半导体晶片的待抛光表面的形状，相对于理想形状成形 16,17），并且抛光垫成形夹具的成形表面的形状被传送到各个抛光垫（16,17）的焊盘表面（16A和17A）。 通过使用焊盘表面来抛光每个半导体晶片被抛光的表面。
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公开(公告)号：US20110171885A1
公开(公告)日：2011-07-14
申请号：US12981305
申请日：2010-12-29
申请人： Hiroshi Takai , Yuichi Nakayoshi
发明人： Hiroshi Takai , Yuichi Nakayoshi
IPC分类号： B24B1/00
CPC分类号： B24B49/18 , B24B27/0076 , B24B37/042 , B24B53/017
摘要： A polishing pad shape measured by a polishing pad shape measuring apparatus is modified into a target shape of a polishing pad by using a dressing tool so that a wafer has a desired surface shape. The invention is a method for shape modification of a polishing pad 14 for polishing a workpiece into a desired surface shape, comprising: a measurement step S9 of measuring a polishing pad shape in a state of being attached to a plate 12 by using a polishing pad shape measuring apparatus 10; a condition determination step S10 of selecting a dressing recipe capable of polishing the workpiece into a desired surface shape from a plurality of pre-provided dressing recipes based on the measurement result in the measurement step S9; and a shape modification step S11 of dressing the polishing pad 14 by using the dressing recipe determined in the condition determination step S10.
摘要翻译： 通过使用修整工具将由研磨垫形状测量装置测量的抛光垫形状修改为抛光垫的目标形状，使得晶片具有期望的表面形状。 本发明是一种用于将工件抛光成所需表面形状的抛光垫14的形状修改方法，包括：测量步骤S9，其通过使用抛光垫测量安装在板12上的状态下的抛光垫形状 形状测量装置10; 条件确定步骤S10，基于测量步骤S9中的测量结果，从多个预先提供的敷料配方中选择能够将工件抛光成所需表面形状的修整配方; 以及通过使用在条件判定步骤S10中确定的敷料配方来修整抛光垫14的形状修改步骤S11。
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公开(公告)号：US20100285665A1
公开(公告)日：2010-11-11
申请号：US12679731
申请日：2008-09-11
IPC分类号： H01L21/306
CPC分类号： H01L21/02024 , B24B37/08
摘要： In a method of manufacturing semiconductor wafers, front and hack surfaces of the semiconductor wafers are simultaneously polished with a double-side polishing machine that includes: a carrier for accommodating the semiconductor wafer; and an upper press platen and a lower press platen for sandwiching the carrier. The method includes: accommodating the semiconductor wafer in the carrier while a thickness of the semiconductor wafer is set to be larger than a thickness of the carrier by 0 μm to 5 μm; and polishing the semiconductor wafer while feeding a polishing slurry to between the surfaces of the semiconductor wafer and surfaces of the press platens. In the polishing, an allowance of both surfaces of the semiconductor wafer is set at 5 μm or less in total.
摘要翻译： 在制造半导体晶片的方法中，用双面抛光机同时对半导体晶片的前面和后表面进行抛光，所述双面抛光机包括：用于容纳半导体晶片的载体; 以及用于夹持载体的上压板和下压板。 该方法包括：将半导体晶片容纳在载体中，同时将半导体晶片的厚度设定为大于载体厚度0μm至5μm; 并且在将半导体晶片的表面和压板的表面之间进行抛光浆料的同时抛光半导体晶片。 在研磨中，半导体晶片的两面的余量总计为5μm以下。
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34.发明授权Resin-made shock absorbing member for a vehicle and method for producing the same 失效用于车辆的树脂制减震构件及其制造方法
公开(公告)号：US5788297A
公开(公告)日：1998-08-04
申请号：US628629
申请日：1996-07-01
申请人： Minoru Sugawara , Tetsuya Nakamura , Katsuhiko Tada , Hiroshi Takai , Hiroshi Jounishi , Yoshihide Endou , Ken Fukuda
发明人： Minoru Sugawara , Tetsuya Nakamura , Katsuhiko Tada , Hiroshi Takai , Hiroshi Jounishi , Yoshihide Endou , Ken Fukuda
CPC分类号： B60R19/18 , B60R19/24 , B29C49/04 , B29K2023/12 , B29L2031/3044 , B29L2031/721 , B60R2019/184
摘要： A resin-made shock absorbing member for a vehicle used as a bumper bean of the vehicle and the like and the method for producing the same. The resin-made shock absorbing member for the vehicle is structured to include an elongated curved portion (20) having a hollow portion, and an attachment portion (30) for fixing to a vehicle body (11) to be united and thus continuously formed with the curved portion (20) at both ends in the longitudinal direction of the curved portion (20). By structuring the attachment portions (30) to have a hollow portion and a solid portion, at least extending in the longitudinal direction of the curved portion (20), attachment work can be carried out from the outer side of the vehicle, and the shock absorbing function can be ensured along the whole length of the member (10).
摘要翻译： PCT No.PCT / JP95 / 01590 Sec。 371日期：1996年7月1日 102（e）日期1996年7月1日PCT提交1995年8月10日PCT公布。 公开号WO96 / 05044 日期1996年2月22日一种用作车辆用保险杠等的车辆用树脂制减震部件及其制造方法。 该车辆用树脂制减震部件构成为包括具有中空部的细长弯曲部（20）和用于固定在车身（11）上的连结部（30），该连接部（30）连续地形成有 弯曲部分（20）在弯曲部分（20）的纵向方向上的两端处的弯曲部分（20）。 通过构造安装部分（30）以具有至少在弯曲部分（20）的纵向方向上延伸的中空部分和实心部分，可以从车辆的外侧执行附接作业，并且冲击 可以沿着构件（10）的整个长度确保吸收功能。
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公开(公告)号：US5777473A
公开(公告)日：1998-07-07
申请号：US637550
申请日：1996-04-25
申请人： Hiroshi Takai , Yoshimori Kassai
发明人： Hiroshi Takai , Yoshimori Kassai
IPC分类号： A61B5/055 , G01R33/54 , G01R33/561 , G01V3/00
CPC分类号： G01R33/54 , G01R33/543 , G01R33/561
摘要： In specific magnetic resonance imaging, magnetization spins are repeatedly excited by excitation pulses, and echoes are repeatedly generated after each of the excitation pulses. The echoes so generated are acquired as echo signals. Based on these echo signals, image data is reconstructed. According to the present invention, the number of times the magnetization spins are excited by the excitation pulses is input by an operator and, based on this input number, the number of echoes generated by one excitation is determined. Image-pickup time can easily be computed on the basis of the number of times of excitation and the time required for repeating fixed excitation pulses. The operator is able to easily control the image-pickup time by controlling the input number of times of excitation.
摘要翻译： 在特定的磁共振成像中，磁化自旋被激发脉冲重复地激发，并且在每个激励脉冲之后重复产生回波。 如此生成的回波作为回波信号获取。 基于这些回波信号，重建图像数据。 根据本发明，由激励脉冲激励的磁化次数由操作者输入，并且基于该输入数，确定由一个激励产生的回波的数量。 可以根据激发次数和重复固定激励脉冲所需的时间容易地计算摄像时间。 通过控制输入激励次数，操作者能够容易地控制摄像时间。
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36.发明授权Joining method for joining electrically ceramic bodies and a joining apparatus and joining agent for use in the joining method 失效用于接合电陶瓷体的接合方法和用于接合方法的接合装置和接合剂
公开(公告)号：US5368673A
公开(公告)日：1994-11-29
申请号：US836305
申请日：1992-02-28
CPC分类号： C04B37/006 , C04B37/005 , C04B2237/06 , C04B2237/062 , C04B2237/064 , C04B2237/066 , C04B2237/086 , C04B2237/127 , C04B2237/343 , C04B2237/348 , C04B2237/365 , C04B2237/368 , C04B2237/56 , C04B2237/708 , C04B2237/765 , C04B2237/80
摘要： The present invention relates to a joining method, a joining apparatus and a joining agent capable of joining two bodies to be jointed in a large size or in a complicated shape in a good joining condition. Specially, the present invention is to provide an improvement in a control of the current supplying method applicable for the electrically heating of the ceramic bodies or a joining agent in an electric conduction (a elecrode switching type due to a plurality of fixed electrodes and a switching control type between two kinds of the electric power sources), a control method of a auxiliary heating, a control of the holding apparatus (the control by the free thermal expansion at the pre-heating, a adaption of a balance mechanism and a measurement of the displacement), the adjustment of the shape at the butted portion (improvement of the pipe joint structure) and a joining agent superior in the joining strength.
摘要翻译： PCT No.PCT / JP91 / 00560 Sec。 一九九二年二月二十八日 102（e）日期1992年2月28日PCT 1991年4月25日PCT PCT。 公开号WO92 / 00257 本发明涉及一种接合方法，接合装置和接合剂，其能够以良好的接合条件将要接合的大体形状或复杂形状的两个体接合。 特别地，本发明是提供一种适用于陶瓷体或导电时的接合剂的电加热的电流供给方法的控制（由多个固定电极引起的电气开关型和开关 两种电源之间的控制方式），辅助加热的控制方法，保持装置的控制（通过预热时的自由热膨胀的控制，平衡机构的适应和测量 位移），对接部分的形状调整（管接头结构的改善）和接合强度优异的接合剂。
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37.发明授权
公开(公告)号：US5113635A
公开(公告)日：1992-05-19
申请号：US632682
申请日：1990-12-24
申请人： Hiroshi Takai , Sachio Ishida
发明人： Hiroshi Takai , Sachio Ishida
摘要： An apparatus for automatically feeding and packing surimi of fish or shellfish, including a feed hopper having a top inlet for feeding the surimi therefrom and a bottom outlet for discharging the surimi therefrom. A screw feeder connected to the bottom outlet of the fed hopper has two screws for passing the surimi through the screw feeder. A feed pump feeds a predetermined quantity of the surimi flowing out from an exit of the screw feeder in which the predetermined quantity of the surimi is formed into a desired shape by a forming tube. A wrapping tube forming device forms a plastic film into a continuous wrapping tube to be packed with the surimi.
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公开(公告)号：US4563569A
公开(公告)日：1986-01-07
申请号：US498853
申请日：1983-05-27
CPC分类号： B23K9/295
摘要： A gas shielded arc welding torch is described which uses a consumable electrode wire. A cylindrical support member carries a guide tube for guiding the electrode wire through the torch. An electrical contact member is pivotably mounted at the end of the torch and includes a bore through which the wire passes. A spring biases the contact member into constant engagement with the electrode wire. A gas nozzle is mounted on the cylindrical support member and is movable with the contact member to provide a uniform, constant-dimensioned shielding gas passage around the contact member regardless of the movement thereof.
摘要翻译： 描述了一种使用消耗电极线的气体保护电弧焊炬。 圆柱形支撑构件承载用于引导电极线通过手电筒的引导管。 电接触构件可枢转地安装在割炬的端部处，并且包括孔，通过该孔通过该线。 弹簧将接触构件偏置成与电极线恒定接合。 气体喷嘴安装在圆柱形支撑构件上并且可与接触构件一起移动，以提供围绕接触构件的均匀的恒定尺寸的保护气体通道，而与其运动无关。
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