公开(公告)号：US10763223B2

公开(公告)日：2020-09-01

申请号：US15494034

申请日：2017-04-21

Applicant: Siliconware Precision Industries Co., Ltd.

Inventor： Po-Hao Wang ,  Chang-Fu Lin ,  Chun-Tang Lin ,  Bo-Hao Chang

IPC: H01L23/00 ,  H01L23/31 ,  H01L23/498

Abstract: Provided is a substrate structure, including a substrate having at least one chamfer formed on a surface thereof, and a plurality of conductive bodies formed to the substrate. Therefore, a stress generated during the packaging process is alleviated through the chamfer, and the substrate structure is prevented from being cracked. An electronic package employing the substrate structure is also provided.

公开(公告)号：US10741500B2

公开(公告)日：2020-08-11

申请号：US15971534

申请日：2018-05-04

Applicant: Siliconware Precision Industries Co., Ltd.

Inventor： Chen-Yu Huang ,  Chee-Key Chung ,  Chang-Fu Lin ,  Kong-Toon Ng ,  Rui-Feng Tai ,  Bo-Hao Ma

IPC: H01L23/48 ,  H01L23/538 ,  H01L23/31 ,  H01L23/522 ,  H01L25/065 ,  H01L23/00 ,  H01L25/16

Abstract: An electronic package and a method for fabricating the same are provided. The method includes: forming a circuit structure on an encapsulant; embedding a first electronic component and a plurality of conductive posts in the encapsulant; and disposing a second electronic component on the circuit structure. Since the first and second electronic components are arranged on opposite sides of the circuit structure, the electronic package can provide multi-function and high efficiency.

公开(公告)号：US20200168523A1

公开(公告)日：2020-05-28

申请号：US16533716

申请日：2019-08-06

Applicant: Siliconware Precision Industries Co., Ltd.

Inventor： Yu-Lung Huang ,  Chee-Key Chung ,  Chang-Fu Lin ,  Kuo-Hua Yu ,  Wen-Shan Tsai ,  En-Li Lin ,  Kaun-I Cheng ,  Wei-Ping Wang

IPC: H01L23/367 ,  H01L23/00 ,  H01L21/48 ,  F28F13/18

Abstract: An electronic package is provided. A heat dissipator is bonded via a thermal interface layer to an electronic component disposed on a carrier. The heat dissipator has a concave-convex structure to increase a heat-dissipating area of the thermal interface layer. Therefore, the heat dissipator has a better heat-dissipating effect.

公开(公告)号：US20200093006A1

公开(公告)日：2020-03-19

申请号：US16201239

申请日：2018-11-27

Applicant: Siliconware Precision Industries Co., Ltd.

Inventor： Ying-Chang Tseng ,  Yuan-Hung Hsu ,  Chang-Fu Lin

IPC: H05K3/34 ,  H05K1/18 ,  H01Q1/22 ,  H01Q1/38

Abstract: This present disclosure provides an electronic package and a method for manufacturing the same. An antenna board with a limiter is stacked on a circuit board. A support body for holding the antenna board and the circuit board in place is provided between the antenna board and the circuit board, such that in the process of forming the support body, the limiter stops the flow of an adhesive material of the support body, and the adhesive material of the support body is prevented from overflowing onto an antenna structure of the antenna board to make sure that the antenna of the antenna board functions properly.

公开(公告)号：US20200091109A1

公开(公告)日：2020-03-19

申请号：US16691477

申请日：2019-11-21

Applicant: Siliconware Precision Industries Co., Ltd.

Inventor： Yu-Min Lo ,  Chee-Key Chung ,  Chang-Fu Lin ,  Kuo-Hua Yu ,  Hsiang-Hua Huang

IPC: H01L23/00 ,  H01L21/48

Abstract: The present disclosure provides a method for manufacturing an electronic package, with an electronic component bonded to a carrier structure by means of solder tips formed on conductive bumps, wherein the solder tips do not require a reflow process to be in contact with the carrier structure, thereby allowing the conductive bumps to have an adequate amount of solder tips formed thereon and thus precluding problems such as cracking and collapsing of the solder tips.

公开(公告)号：US20190237374A1

公开(公告)日：2019-08-01

申请号：US15971534

申请日：2018-05-04

Applicant: Siliconware Precision Industries Co., Ltd.

Inventor： Chen-Yu Huang ,  Chee-Key Chung ,  Chang-Fu Lin ,  Kong-Toon Ng ,  Rui-Feng Tai ,  Bo-Hao Ma

IPC: H01L23/31 ,  H01L23/522 ,  H01L23/00 ,  H01L25/065

Abstract: An electronic package and a method for fabricating the same are provided. The method includes: forming a circuit structure on an encapsulant; embedding a first electronic component and a plurality of conductive posts in the encapsulant; and disposing a second electronic component on the circuit structure. Since the first and second electronic components are arranged on opposite sides of the circuit structure, the electronic package can provide multi-function and high efficiency.

公开(公告)号：US10361150B2

公开(公告)日：2019-07-23

申请号：US15590111

申请日：2017-05-09

Applicant: Siliconware Precision Industries Co., Ltd.

Inventor： Chee-Key Chung ,  Yu-Min Lo ,  Han-Hung Chen ,  Chang-Fu Lin ,  Fu-Tang Huang

IPC: H01L23/14 ,  H01L23/28 ,  H01L23/31 ,  H01L23/498

Abstract: The disclosure provides a substrate construction applicable to a 3D package, including a silicon substrate for carrying a chip on an upper side thereof, and a circuit structure formed underneath the silicon substrate for being connected to solder balls via conductive pads of the circuit structure, thereby obtaining the same specification of the conductive pads as ball-planting pads of conventional package substrates and avoiding the manufacturing and use of conventional package substrates.

公开(公告)号：US20190123424A1

公开(公告)日：2019-04-25

申请号：US15961103

申请日：2018-04-24

Applicant: Siliconware Precision Industries Co., Ltd.

Inventor： Shi-Min Zhou ,  Han-Hung Chen ,  Rung-Jeng Lin ,  Kuo-Hua Yu ,  Chang-Fu Lin

IPC: H01Q1/22 ,  H05K1/14 ,  H05K1/18 ,  H05K3/36 ,  H05K3/34 ,  H05K3/28

Abstract: An electronic package and a method for fabricating the same are provided. The method includes stacking an antenna board on a circuit board, and disposing between the antenna board and the circuit board a supporting body securing the antenna board and the circuit board. As such, during a packaging process, the distance between the antenna board and the circuit board is kept unchanged due to the supporting body, thus ensuring that the antenna board operates properly and improving the product yield.

公开(公告)号：US20170294371A1

公开(公告)日：2017-10-12

申请号：US15499446

申请日：2017-04-27

Applicant: Siliconware Precision Industries Co., Ltd.

Inventor： Chang-Fu Lin ,  Ho-Yi Tsai ,  Chin-Tsai Yao

IPC: H01L23/498 ,  H01L23/29 ,  H01L23/367 ,  H01L23/00 ,  H01L23/31

Abstract: A semiconductor package is provided, which includes: a substrate having a metal pattern layer; a semiconductor die formed on the substrate; and an underfill filled between the substrate and the semiconductor die. At least an opening is formed in the metal pattern layer to reduce the area of the metal pattern layer on the substrate, thereby reducing the contact area between the underfill and the metal pattern layer, hence eliminating the underfill delamination.

公开(公告)号：US20170148679A1

公开(公告)日：2017-05-25

申请号：US15424116

申请日：2017-02-03

Applicant: Siliconware Precision Industries Co., Ltd.

Inventor： Chang-Fu Lin ,  Chin-Tsai Yao ,  Ming-Chin Chuang ,  Keng-Hung Liu ,  Fu-Tang Huang

IPC: H01L21/78 ,  H01L21/56 ,  H01L23/00 ,  H01L23/31 ,  H01L23/544

CPC classification number: H01L21/78 ,  H01L21/561 ,  H01L23/3178 ,  H01L23/544 ,  H01L24/06 ,  H01L24/17 ,  H01L2223/54453 ,  H01L2224/0401 ,  H01L2224/13022 ,  H01L2224/16225 ,  H01L2224/32225 ,  H01L2224/73204 ,  H01L2224/94 ,  H01L2924/15311 ,  H01L2224/03 ,  H01L2224/11 ,  H01L2924/00

Abstract: A semiconductor package is disclosed, which includes: a packaging substrate; a semiconductor element disposed on the packaging substrate in a flip-chip manner; a stopping portion formed at edges of the semiconductor element; an insulating layer formed on an active surface of the semiconductor element and the stopping portion; and an encapsulant formed between the packaging substrate and the insulating layer. The insulating layer has a recessed portion formed on the stopping portion and facing the packaging substrate such that during a reliability test, the recessed portion can prevent delamination occurring between the insulating layer and the stopping portion from extending to the active surface of the semiconductor element.