公开(公告)号：US20130075899A1

公开(公告)日：2013-03-28

申请号：US13682281

申请日：2012-11-20

Applicant: STATS ChipPAC, Ltd.

Inventor： Rui Huang ,  Il Kwon Shim ,  Seng Guan Chow ,  Heap Hoe Kuan

IPC: H01L23/498 ,  H01L21/56

CPC classification number: H01L23/49811 ,  H01L21/56 ,  H01L21/561 ,  H01L21/568 ,  H01L21/6835 ,  H01L23/3128 ,  H01L23/49816 ,  H01L23/49833 ,  H01L23/5389 ,  H01L24/19 ,  H01L24/20 ,  H01L24/48 ,  H01L24/96 ,  H01L24/97 ,  H01L25/105 ,  H01L2221/68345 ,  H01L2224/0401 ,  H01L2224/04105 ,  H01L2224/12105 ,  H01L2224/16225 ,  H01L2224/48091 ,  H01L2224/73265 ,  H01L2224/97 ,  H01L2225/1035 ,  H01L2225/1058 ,  H01L2924/00014 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/01029 ,  H01L2924/0103 ,  H01L2924/01033 ,  H01L2924/01047 ,  H01L2924/01073 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/01322 ,  H01L2924/014 ,  H01L2924/09701 ,  H01L2924/12041 ,  H01L2924/12042 ,  H01L2924/1306 ,  H01L2924/13091 ,  H01L2924/14 ,  H01L2924/1433 ,  H01L2924/15174 ,  H01L2924/15311 ,  H01L2924/15331 ,  H01L2924/181 ,  H01L2924/18161 ,  H01L2924/19041 ,  H01L2924/19042 ,  H01L2924/19043 ,  H01L2924/30105 ,  H01L2924/3511 ,  H01L2924/00 ,  H01L2924/00012 ,  H01L2224/45099 ,  H01L2224/45015 ,  H01L2924/207

Abstract: A semiconductor package is made using a prefabricated post carrier including a base plate and plurality of conductive posts. A film encapsulant is disposed over the base plate of the post carrier and around the conductive posts. A semiconductor die is mounted to a temporary carrier. The post carrier and temporary carrier are pressed together to embed the semiconductor die in the film encapsulant. The semiconductor die is disposed between the conductive posts in the film encapsulant. The temporary carrier and base plate of the post carrier are removed. A first circuit build-up layer is formed over a first side of the film encapsulant. The first circuit build-up layer is electrically connected to the conductive posts. A second circuit build-up layer is formed over a second side of the film encapsulant opposite the first side. The second circuit build-up layer is electrically connected to the conductive posts.

Abstract translation: 使用包括基板和多个导电柱的预制柱载体制成半导体封装。 胶片密封剂设置在柱载体的基板上并且在导电柱周围。 半导体管芯安装到临时载体上。 将载体和临时载体压在一起以将半导体管芯嵌入膜密封剂中。 半导体管芯设置在膜密封剂中的导电柱之间。 卸载载体的临时载体和基板。 在膜密封剂的第一侧上形成第一电路堆积层。 第一电路堆积层电连接到导电柱。 第二电路堆积层形成在与第一侧相对的膜密封剂的第二侧上。 第二电路堆积层电连接到导电柱。