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    ELECTRONIC DEVICE COMPRISING AN OPTICAL SENSOR CHIP
    33.
    发明申请
    ELECTRONIC DEVICE COMPRISING AN OPTICAL SENSOR CHIP 有权
    包含光传感器芯片的电子设备

    公开(公告)号：US20150357484A1

    公开(公告)日：2015-12-10

    申请号：US14723993

    申请日：2015-05-28

    Applicant: STMicroelectronics (Grenoble 2) SAS

    Inventor： Julien Pruvost ,  Romain Coffy

    IPC: H01L31/0203 ,  H01L31/18 ,  H01L31/02 ,  H01L31/0232

    CPC classification number: H01L31/0203 ,  H01L27/14618 ,  H01L27/14621 ,  H01L27/14623 ,  H01L27/1464 ,  H01L27/14683 ,  H01L31/02002 ,  H01L31/02327 ,  H01L31/18 ,  H01L2224/16225 ,  H01L2224/73253 ,  H01L2924/15174 ,  H01L2924/16235

    Abstract: An electronic device includes a substrate plate with a traversing passage. An electronic component, mounted to the substrate plate, includes an integrated circuit chip with an optical sensor and an opaque protective plate mounted above the sensor. The electronic component is mounted with the chip facing the substrate plate such that the protective plate is engaged with the traversing passage. Electrical connection elements extend between the chip and the substrate plate. An internal block of encapsulation material extends into the traversing passage of the substrate plate between the chip and the substrate plate so as to embed the electrical connection elements.

    Abstract translation: 电子设备包括具有横向通道的基板。 安装到基板的电子部件包括具有安装在传感器上方的光学传感器和不透明保护板的集成电路芯片。 电子部件安装有芯片面向衬底板，使得保护板与横向通道接合。 电连接元件在芯片和基板之间延伸。 封装材料的内部块在芯片和衬底板之间延伸到衬底板的横向通道中，以嵌入电连接元件。

    ELECTRONIC DEVICE COMPRISING A CHIP OF INTEGRATED CIRCUITS STACKED WITH AN OPTICAL PLATE
    34.
    发明申请
    ELECTRONIC DEVICE COMPRISING A CHIP OF INTEGRATED CIRCUITS STACKED WITH AN OPTICAL PLATE 有权
    包含用光学板堆叠的集成电路芯片的电子设备

    公开(公告)号：US20150155324A1

    公开(公告)日：2015-06-04

    申请号：US14552800

    申请日：2014-11-25

    Applicant: STMicroelectronics (Grenoble 2) SAS

    Inventor： Olivier Le-Briz ,  Romain Coffy

    IPC: H01L27/146 ,  H01L31/0203

    CPC classification number: H01L27/14636 ,  H01L27/14618 ,  H01L31/0203 ,  H01L2224/11

    Abstract: An electronic device is formed by a stack of an integrated circuit chip and an optical plate. The integrated circuit chip includes integrated circuits (such as optical circuits) formed on or in a semiconductor substrate plate. The optical integrated circuits may form an optical sensor. An electrical connection network is provided on the top side of the semiconductor substrate plate. Electrical connection lugs, which are connected to the electrical connection network through electrical connection vias, are mounted on the back side of the semiconductor substrate plate. The vias are through silicon vias situated at a distance from the periphery of the semiconductor substrate plate. The optical plate is configured to allow light radiation to pass to the optical integrated circuits.

    Abstract translation: 电子器件由集成电路芯片和光学板的堆叠形成。 集成电路芯片包括形成在半导体衬底板上或其中的集成电路（例如光电路）。 光学集成电路可以形成光学传感器。 电连接网络设置在半导体衬底板的顶侧上。 通过电气连接通孔连接到电气连接网络的电连接凸耳安装在半导体衬底板的背面。 通孔通过位于距离半导体衬底板的周边一定距离的硅通孔。 光学板被配置为允许光辐射传递到光学集成电路。

    Optical electronic package with an optically isolated chamber
    35.
    发明授权
    Optical electronic package with an optically isolated chamber 有权
    具有光隔离室的光电子封装

    公开(公告)号：US08716739B2

    公开(公告)日：2014-05-06

    申请号：US13629872

    申请日：2012-09-28

    Applicant: STMicroelectronics (Grenoble 2) SAS

    Inventor： Romain Coffy ,  Julien Vittu

    IPC: H01L33/00 ,  H01L27/15 ,  H01L31/12

    CPC classification number: H01L25/167 ,  G01S7/4813 ,  G01S17/026 ,  H01L31/0203 ,  H01L31/02325 ,  H01L2224/48227 ,  H01L2224/73265 ,  H01L2224/48091 ,  H01L2924/00014

    Abstract: A package includes a substrate with an attached emitting IC chip and receiving IC chip. The emitting IC chip includes an optical emitter, and the receiving IC chip includes a main optical sensor and a secondary optical sensor. A case is provided with a bottom portion and a peripheral wall portion to cover the IC chips, wherein the edge of the peripheral wall portion is mounted to the substrate. The bottom portion of the case includes a main opening above the main optical sensor and a secondary opening above the optical emitter. An opaque material is interposed between the case and the receiving IC chip to isolate the main optical sensor from the secondary optical sensor and delimiting a chamber containing the secondary optical sensor and the optical emitter. The chamber is optically isolated from the main optical sensor and main opening, and may be filled with a transparent material.

    Abstract translation: 封装包括具有附接的发射IC芯片并接收IC芯片的基板。 发光IC芯片包括光发射器，并且接收IC芯片包括主光学传感器和次级光学传感器。 壳体设置有覆盖IC芯片的底部部分和周壁部分，其中周壁部分的边缘安装到基板。 壳体的底部包括在主光学传感器上方的主开口和在光发射器上方的次级开口。 在外壳和接收IC芯片之间插入不透明材料，以将主光学传感器与次级光学传感器隔离，并且限定包含第二光学传感器和光学发射器的室。 该室与主光学传感器和主开口光学隔离，并且可以填充有透明材料。

    Antenna package
    36.
    发明授权
    Antenna package 有权

    公开(公告)号：US12009572B2

    公开(公告)日：2024-06-11

    申请号：US17742039

    申请日：2022-05-11

    Applicant: STMicroelectronics (Grenoble 2) SAS ,  STMicroelectronics (Alps) SAS

    Inventor： Romain Coffy ,  Georg Kimmich

    IPC: H01Q1/22 ,  H01Q1/38 ,  H01Q1/42 ,  H01Q13/18

    CPC classification number: H01Q1/2283 ,  H01Q1/38 ,  H01Q1/422 ,  H01Q13/18

    Abstract: A package includes an upper level mounted to a lower level. The upper level includes a stack formed by insulating layers and conductive elements and includes a first conductive track of an antenna. A plastic element rests on the stack. A first cavity is defined in the plastic element. A second conductive track of the antenna is located on a wall of the plastic element (for example, in or adjacent to the first cavity). A second cavity is also defined in the plastic element surrounding the first cavity. A third conductive track of the antenna is located on a wall of the plastic element (for example, in the second cavity). A third cavity is delimited between the upper and lower levels and an integrated circuit chip is mounted within the third cavity and electrically connected to the antenna.

    Optical package of an integrated circuit
    37.
    发明授权
    Optical package of an integrated circuit 有权

    公开(公告)号：US11656121B2

    公开(公告)日：2023-05-23

    申请号：US17545369

    申请日：2021-12-08

    Applicant: STMicroelectronics (Grenoble 2) SAS

    Inventor： Romain Coffy ,  Younes Boutaleb

    IPC: G01J1/42 ,  H01L31/18

    CPC classification number: G01J1/4204 ,  H01L31/18

    Abstract: An electronic chip supports an optical device and electric connection zones. An insulating coating coats the electronic chip, covers the electric connection zones and exposes the optical device. An optical plugging element is at least partly fastened onto a first face of the insulating coating and is optically coupled to the optical device. Vias pass through the insulating coating from its first face to a second face opposite to the first face. Inner walls of the vias support electrically conductive paths connected to the electric connection zones of the electronic chip by electrically conductive tracks arranged on the first face of the insulating coating. The electrically conductive paths of the vias further have ends protruding onto the second face of the insulating coating.

    Optoelectronic device
    40.
    发明授权
    Optoelectronic device 有权

    公开(公告)号：US11322666B2

    公开(公告)日：2022-05-03

    申请号：US17071603

    申请日：2020-10-15

    Applicant: STMicroelectronics (Grenoble 2) SAS

    Inventor： Romain Coffy ,  Remi Brechignac ,  Jean-Michel Riviere

    IPC: H01L33/54 ,  H01L33/00

    Abstract: An optoelectronic device includes an emitter of light rays and a receiver of light rays. The emitter is encapsulated within a first encapsulation layer, and the receiver is encapsulated within a second encapsulation layer. An opaque layer covers the first encapsulation layer (encapsulating the receiver) and covers the second encapsulation layer (encapsulating the emitter). The first and second encapsulation layers are separated by a region of opaque material. This opaque material may be provided by the opaque layer or an opaque fill.

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