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    EMBEDDED DEVICE, AND PRINTED CIRCUIT BOARD HAVING THE SAME
    32.
    发明申请
    EMBEDDED DEVICE, AND PRINTED CIRCUIT BOARD HAVING THE SAME 有权
    嵌入式设备和具有该嵌入式设备的印刷电路板

    公开(公告)号：US20160174380A1

    公开(公告)日：2016-06-16

    申请号：US14920735

    申请日：2015-10-22

    Applicant: SAMSUNG ELECTRO-MECHANICS CO., LTD.

    Inventor： Hye Seong KIM ,  Eun Sang NA ,  Jin Sung KIM ,  Ok Nam KIM ,  Tae Hyeok KIM ,  Jin Man JUNG

    IPC: H05K1/18 ,  H05K1/11 ,  H01G4/248 ,  H01G4/30 ,  H01G4/012 ,  H01G4/12

    CPC classification number: H01G4/232 ,  H01G4/12 ,  H01G4/30

    Abstract: An embedded device includes a multilayer body including dielectric layers and internal electrode layers interposed between adjacent dielectric layers; external electrodes disposed on external surfaces of the multilayer body to apply electric charges having different polarities to adjacent internal electrode layers, the external electrodes containing a conductive material; first copper layers disposed on external surfaces of the external electrodes to cover the external electrodes; and second copper layers disposed on the first copper layers to cover the first copper layers. An average particle diameter of powder particles of the first copper layers is greater than an average particle diameter of powder particles of the second copper layers.

    Abstract translation: 嵌入式装置包括：多层体，其包括插入在相邻介电层之间的电介质层和内部电极层; 外部电极设置在所述多层体的外表面上，以向相邻的内部电极层施加具有不同极性的电荷，所述外部电极包含导电材料; 第一铜层设置在外部电极的外表面上以覆盖外部电极; 以及设置在第一铜层上以覆盖第一铜层的第二铜层。 第一铜层的粉末颗粒的平均粒径大于第二铜层的粉末颗粒的平均粒径。

    EMBEDDED MULTILAYER CERAMIC ELECTRONIC COMPONENT AND PRINTED CIRCUIT BOARD HAVING THE SAME
    34.
    发明申请
    EMBEDDED MULTILAYER CERAMIC ELECTRONIC COMPONENT AND PRINTED CIRCUIT BOARD HAVING THE SAME 审中-公开
    嵌入式多层陶瓷电子元件及其印刷电路板

    公开(公告)号：US20150098202A1

    公开(公告)日：2015-04-09

    申请号：US14269074

    申请日：2014-05-02

    Applicant: SAMSUNG ELECTRO-MECHANICS CO., LTD.

    Inventor： Byoung Hwa LEE ,  Hai Joon LEE ,  Eun Hyuk CHAE ,  Bae Gen LEE ,  Jin Man JUNG

    IPC: H05K1/02 ,  H05K1/03 ,  H01G4/12 ,  H05K1/18

    CPC classification number: H01G4/30 ,  H01G4/12 ,  H01G4/1227 ,  H01G4/232 ,  H05K1/185 ,  H05K2201/10636 ,  Y02P70/611

    Abstract: A multilayer ceramic electronic component embedded in a board may include: a ceramic body including dielectric layers; a plurality of first and second internal electrodes alternately exposed through both end surfaces of the ceramic body; and first and second external electrodes formed on both end portions of the ceramic body, respectively. The first external electrode may include a first base electrode and a first terminal electrode, the second external electrode may include a second base electrode and a second terminal electrode, 400 nm≦Ra≦600 nm may be satisfied when a surface roughness in a region of 50 μm×50 μm in the first and second terminal electrodes is defined as Ra, and 130 nm≦Ra′≦400 nm may be satisfied when a surface roughness in a region of 10 μm×10 μm in the first and second terminal electrodes is defined as Ra′.

    Abstract translation: 嵌入板中的多层陶瓷电子部件可以包括：包括电介质层的陶瓷体; 多个第一和第二内部电极通过陶瓷体的两个端面交替地暴露; 以及分别形成在陶瓷体的两端部的第一外部电极和第二外部电极。 第一外部电极可以包括第一基极电极和第一端子电极，第二外部电极可以包括第二基极和第二端子电极，当第一外部电极的区域中的表面粗糙度为400nm时，可以满足Ra＆ 第一和第二端子电极中的50μm×50μm的面积被定义为Ra，当在第一和第二端子电极中的10μm×10μm的区域中的表面粗糙度时，可以满足130nm＆nlE; Ra'＆nlE; 400nm 被定义为Ra'。

    MULTILAYER CERAMIC ELECTRONIC COMPONENT TO BE EMBEDDED IN BOARD AND PRINTED CIRCUIT BOARD HAVING MULTILAYER CERAMIC ELECTRONIC COMPONENT EMBEDDED THEREIN
    35.
    发明申请
    MULTILAYER CERAMIC ELECTRONIC COMPONENT TO BE EMBEDDED IN BOARD AND PRINTED CIRCUIT BOARD HAVING MULTILAYER CERAMIC ELECTRONIC COMPONENT EMBEDDED THEREIN 审中-公开
    多层陶瓷电子元件嵌入板和印刷电路板上嵌有多层陶瓷电子元件

    公开(公告)号：US20150060122A1

    公开(公告)日：2015-03-05

    申请号：US14135560

    申请日：2013-12-19

    Applicant: SAMSUNG ELECTRO-MECHANICS CO., LTD.

    Inventor： Jin Woo LEE ,  Jin Man JUNG

    IPC: H05K1/18 ,  H01G4/008 ,  H01G4/30

    CPC classification number: H05K1/185 ,  H01G4/12 ,  H01G4/232 ,  H01G4/30 ,  H05K1/0231 ,  H05K1/09 ,  H05K1/115 ,  H05K2201/10015 ,  H05K2201/10636 ,  Y02P70/611

    Abstract: There is provided a multilayer ceramic electronic component embedded in a board including: a ceramic body including dielectric layers; first and second internal electrodes; and first and second external electrodes formed on first and second side surfaces of the ceramic body, respectively, wherein the first external electrode includes a first electrode layer and a first metal layer formed on the first electrode layer, the second external electrode includes a second electrode layer and a second metal layer formed on the second electrode layer, the first and second external electrodes are formed to be extended to first main surface of the ceramic body, and when a maximum width and a minimum width of at least one of the first and second external electrodes formed on the first main surface are defined as BWmax and BWmin, respectively, 0≦BWmax−BWmin≦100 μm is satisfied.

    Abstract translation: 提供了一种嵌入板中的多层陶瓷电子部件，包括：包括电介质层的陶瓷体; 第一和第二内部电极; 以及分别形成在陶瓷体的第一和第二侧面上的第一外部电极和第二外部电极，其中第一外部电极包括形成在第一电极层上的第一电极层和第一金属层，第二外部电极包括第二电极 层和形成在第二电极层上的第二金属层，第一和第二外部电极形成为延伸到陶瓷体的第一主表面，并且当第一和第二外部电极的第一和第二外部电极的最大宽度和最小宽度 形成在第一主表面上的第二外部电极分别被定义为BWmax和BWmin，满足0≤n1E; BWmax-BWmin＆nlE;满足100μm。

    EMBEDDED MULTILAYER CERAMIC ELECTRONIC COMPONENT AND PRINTED CIRCUIT BOARD HAVING THE SAME
    36.
    发明申请
    EMBEDDED MULTILAYER CERAMIC ELECTRONIC COMPONENT AND PRINTED CIRCUIT BOARD HAVING THE SAME 有权
    嵌入式多层陶瓷电子元件及其印刷电路板

    公开(公告)号：US20150053472A1

    公开(公告)日：2015-02-26

    申请号：US14135220

    申请日：2013-12-19

    Applicant: Samsung Electro-Mechanics Co., Ltd.

    Inventor： Jin Woo LEE ,  Hai Joon LEE ,  Byoung Hwa LEE ,  Jin Man JUNG

    IPC: H01G4/005 ,  H05K1/18

    CPC classification number: H05K1/185 ,  H01G2/06 ,  H01G4/232 ,  H05K3/3442 ,  H05K2201/10015

    Abstract: There is provided an embedded multilayer ceramic electronic component including: a ceramic body including a dielectric layer; a plurality of first and second internal electrodes; and first and second external electrodes formed on both end portions of the ceramic body, wherein the first and second external electrodes are extended to first and second main surfaces of the ceramic body, and when a thickness of the ceramic body is defined as ts, a maximum thickness of the first and second external electrodes formed on the first and second main surfaces of the ceramic body is defined as tb, a minimum distance of the first and second external electrodes formed on first and second end surfaces of the ceramic body in a length direction of the ceramic body is defined as ta, tb/ts and ta/tb satisfy the following Equations, respectively: 0.1≦tb/ts≦1.0 and 0.5≦ta/tb≦2.0.

    Abstract translation: 提供了一种嵌入式多层陶瓷电子部件，包括：包括电介质层的陶瓷体; 多个第一和第二内部电极; 以及形成在所述陶瓷体的两端部的第一外部电极和第二外部电极，其中，所述第一外部电极和所述第二外部电极延伸到所述陶瓷体的第一和第二主面，并且当所述陶瓷体的厚度被定义为ts时， 形成在陶瓷体的第一和第二主表面上的第一和第二外部电极的最大厚度被定义为tb，在陶瓷体的第一和第二端面上形成的第一和第二外部电极的最小距离为一定长度 陶瓷体的方向被定义为ta，tb / ts和ta / tb分别满足以下等式：0.1＆nlE; tb / ts＆nlE; 1.0和0.5＆nlE; ta / tb＆nlE; 2.0。

    MULTILAYER CERAMIC CAPACITOR TO BE EMBEDDED IN BOARD, METHOD OF MANUFACTURING THE SAME, AND METHOD OF MANUFACTURING BOARD HAVING MULTILAYER CERAMIC CAPACITOR EMBEDDED THEREIN
    37.
    发明申请
    MULTILAYER CERAMIC CAPACITOR TO BE EMBEDDED IN BOARD, METHOD OF MANUFACTURING THE SAME, AND METHOD OF MANUFACTURING BOARD HAVING MULTILAYER CERAMIC CAPACITOR EMBEDDED THEREIN 有权
    嵌入板中的多层陶瓷电容器及其制造方法以及嵌入式多层陶瓷电容器的制造方法

    公开(公告)号：US20150022943A1

    公开(公告)日：2015-01-22

    申请号：US14067912

    申请日：2013-10-30

    Applicant: SAMSUNG ELECTRO-MECHANICS CO., LTD.

    Inventor： Eun Hyuk CHAE ,  Jin Man JUNG ,  Byoung Hwa LEE ,  Jin Woo LEE ,  Kyu Ree KIM

    IPC: H01G4/30

    CPC classification number: H01G4/30 ,  H01G4/232

    Abstract: There is provided a multilayer ceramic capacitor to be embedded in a board, including: a ceramic body; first and second internal electrodes alternately exposed through end surfaces of the ceramic body; first and second external electrodes formed on end surfaces of the ceramic body; and first and second plating layers enclosing the first and second external electrodes, wherein when distance from one end of bands of the first or second external electrode to the other end thereof is ‘A’ and distance between points at which a virtual line drawn from a point vertically spaced apart from a surface of the first or second plating layer at a point ½×A from one end of the bands inwardly of the ceramic body by 3 μm in length direction of the ceramic body intersects points on the surface of the first or second plating layer is ‘B,’ B/A≧0.6.

    Abstract translation: 提供一种嵌入板的多层陶瓷电容器，包括：陶瓷体; 第一和第二内部电极通过陶瓷体的端面交替地暴露; 形成在陶瓷体的端面上的第一外部电极和第二外部电极; 以及包围第一外部电极和第二外部电极的第一和第二电镀层，其中当从第一或第二外部电极的另一端的带的一端到另一端的距离为“A”时， 从第一或第二镀层的表面垂直间隔开的距离陶瓷体内部的带的一端的距离陶瓷体的长度方向3μm的点的1/2×A与陶瓷体的长度方向相交， 第二镀层为“B”，B /A≥0.6。

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