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    Method for processing data using neural network and electronic device for supporting the same
    33.
    发明授权
    Method for processing data using neural network and electronic device for supporting the same 有权

    公开(公告)号：US11561516B2

    公开(公告)日：2023-01-24

    申请号：US16682243

    申请日：2019-11-13

    Applicant: Samsung Electronics Co., Ltd.

    Inventor： Sunghyun Kim ,  Ohsang Kwon ,  Minjung Kim

    IPC: G05B13/02 ,  G06N3/063

    Abstract: An electronic device is provided. The electronic device includes a switch configured to select a mode of the electronic device, a multiply and accumulate (MAC) array configured to include a plurality of MAC units, and at least one processor configured to include a zero weight skip unit for confirming a first weight having a value of ‘0’ among weights related with input data, and for forwarding a second weight not having a value of ‘0’ among the weights, to the MAC array. The at least one processor is configured to acquire the input data, acquire the weights, select the mode of the electronic device by using the switch, in response to a first mode of the electronic device being selected, perform convolution operations between the input data and the second weight forwarded to the MAC array through the zero weight skip unit, and, in response to a second mode of the electronic device being selected, perform convolution operations between the input data and the weights forwarded to the MAC array.

    SEMICONDUCTOR PACKAGE
    34.
    发明申请
    SEMICONDUCTOR PACKAGE 有权

    公开(公告)号：US20220375829A1

    公开(公告)日：2022-11-24

    申请号：US17533606

    申请日：2021-11-23

    Applicant: Samsung Electronics Co., Ltd.

    Inventor： Hyeonjeong Hwang ,  Minjung Kim ,  Dongkyu Kim ,  Taewon Yoo

    IPC: H01L23/49 ,  H01L23/498 ,  H01L23/31

    Abstract: Disclosed is a semiconductor package comprising a first redistribution substrate; a solder ball on a bottom surface of the first redistribution substrate; a second redistribution substrate; a semiconductor chip between a top surface of the first redistribution substrate and a bottom surface of the second redistribution substrate; a conductive structure electrically connecting the first redistribution substrate and the second redistribution substrate, the conductive structure laterally spaced apart from the semiconductor chip and including a first conductive structure and a second conductive structure in direct contact with a top surface of the first conductive structure; and a conductive seed pattern between the first redistribution substrate and the first conductive structure. A material of first conductive structure and a material of the second conductive structure may be different from a material of the solder ball.

    Electronic device and method for providing information in virtual reality
    35.
    发明授权
    Electronic device and method for providing information in virtual reality 有权

    公开(公告)号：US11463486B2

    公开(公告)日：2022-10-04

    申请号：US17272275

    申请日：2019-08-13

    Applicant: Samsung Electronics Co., Ltd.

    Inventor： Minjung Kim ,  Woojun Choi ,  Ilhoe Jung

    IPC: G06F15/173 ,  H04L65/1016 ,  H04N13/194 ,  G02B27/00 ,  G06F3/01 ,  H04L65/1104 ,  H04L67/54 ,  G06F15/16

    Abstract: According to various embodiments of the present invention, an electronic device may comprise an IMS framework for communicating with an IMS server, a display, a memory, and a processor, wherein the processor is configured to: control the display to display a VR image in response to an activation state of a virtual reality mode; receive presence information including information on an activation state of the VR mode of at least one external electronic device from the IMS server; include, in the VR image, the received presence information about the at least one external electronic device, using a 3D application, and render the VR image; and control the display to display the rendered VR image including the presence information about the at least one external electronic device. Various other embodiments, in addition to various embodiments disclosed in the present invention, are possible.

    Electronic device and tethering method thereof
    36.
    发明授权
    Electronic device and tethering method thereof 有权

    公开(公告)号：US11068185B2

    公开(公告)日：2021-07-20

    申请号：US15938604

    申请日：2018-03-28

    Applicant: Samsung Electronics Co., Ltd.

    Inventor： Hyuk Kang ,  Youngjin Park ,  Wookwang Lee ,  Minjung Kim

    IPC: G06F3/06 ,  G06F12/10 ,  G06F13/16 ,  G06F9/50 ,  G06F12/14 ,  G06F13/42 ,  H04B1/3827 ,  H04L12/879

    Abstract: An electronic device and a tethering method are disclosed. The electronic device includes a housing, and a display exposed through a first portion of the housing. The electronic device also includes an electrical connector exposed through a second portion of the housing, and a wireless communication circuit. The electronic device further includes a first processor operably coupled to the display and the electrical connector and configured to use a first memory address region including a first plurality of addresses. The electronic device also includes a second processor operably coupled to the wireless communication circuit and configured to use a second memory address region including a second plurality of virtual addresses. The electronic device also include an electric circuitry operably coupled to the first processor and the second processor and configured to provide relations between the first plurality of addresses and the second plurality of virtual addresses.

    Electronic device and method for processing input on view layers
    37.
    发明授权
    Electronic device and method for processing input on view layers 有权

    公开(公告)号：US10691335B2

    公开(公告)日：2020-06-23

    申请号：US15418087

    申请日：2017-01-27

    Applicant: Samsung Electronics Co., Ltd.

    Inventor： Sungjun Lee ,  Seungjin Kim ,  Heesoo Son ,  Jaemin Lee ,  Minjung Kim

    IPC: G06F3/0488 ,  G06F9/451 ,  G06F3/0482 ,  G06F3/0485 ,  G06F3/041 ,  G06F3/0481

    Abstract: An electronic device and method are provided for processing an input using view layers. The electronic device includes a memory, a display, and a processor. The memory stores a first predetermined condition and a second predetermined condition both of which are used for determining whether an input for one or more displayed view objects is valid. The processor displays the view objects using a first view layer and a second view layer at least partially overlapping with the first view layer, and obtains a user input regarding the displayed view object. If a movement of the user input satisfies the first predetermined condition, the processor processes the user input by using the first view layer. If the movement of the user input satisfies the second predetermined condition, the processor processes the user input by using the second view layer.

    SEMICONDUCTOR PACKAGE
    39.
    发明申请
    SEMICONDUCTOR PACKAGE 有权

    公开(公告)号：US20250167084A1

    公开(公告)日：2025-05-22

    申请号：US19024689

    申请日：2025-01-16

    Applicant: Samsung Electronics Co., Ltd.

    Inventor： Dongkyu Kim ,  Minjung Kim ,  Kyounglim Suk ,  Seokhyun Lee

    IPC: H01L23/498 ,  H01L23/00 ,  H01L23/29 ,  H01L23/538 ,  H01L25/065 ,  H01L25/10

    Abstract: A semiconductor package includes a redistribution substrate having first and second surfaces opposing one another, a first semiconductor chip on the first surface of the redistribution substrate, a passive device and a metal post on the second surface of the redistribution substrate and electrically connected to the redistribution pattern, a second encapsulant encapsulating at least side surfaces of the passive device and the metal post, a second insulating layer on a lower surface of the metal post and a lower surface of the second encapsulant, and having an opening exposing at least a portion of the lower surface of the metal post, and a connection bump filling the opening of the second insulating layer and in direct contact with the lower surface of the exposed metal post, wherein the metal post has a height greater than a height of each of the redistribution pattern and the redistribution via.

    Semiconductor package
    40.
    发明授权
    Semiconductor package 有权

    公开(公告)号：US12191236B2

    公开(公告)日：2025-01-07

    申请号：US17533606

    申请日：2021-11-23

    Applicant: Samsung Electronics Co., Ltd.

    Inventor： Hyeonjeong Hwang ,  Minjung Kim ,  Dongkyu Kim ,  Taewon Yoo

    IPC: H01L23/495 ,  H01L23/31 ,  H01L23/49 ,  H01L23/498 ,  H01L23/00 ,  H01L25/18

    Abstract: Disclosed is a semiconductor package comprising a first redistribution substrate; a solder ball on a bottom surface of the first redistribution substrate; a second redistribution substrate; a semiconductor chip between a top surface of the first redistribution substrate and a bottom surface of the second redistribution substrate; a conductive structure electrically connecting the first redistribution substrate and the second redistribution substrate, the conductive structure laterally spaced apart from the semiconductor chip and including a first conductive structure and a second conductive structure in direct contact with a top surface of the first conductive structure; and a conductive seed pattern between the first redistribution substrate and the first conductive structure. A material of first conductive structure and a material of the second conductive structure may be different from a material of the solder ball.

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