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    METHOD AND APPARATUS FOR COMMUNICATING CHANNEL STATE INFORMATION IN FULL-DIMENSIONAL MIMO SYSTEM
    31.
    发明申请
    METHOD AND APPARATUS FOR COMMUNICATING CHANNEL STATE INFORMATION IN FULL-DIMENSIONAL MIMO SYSTEM 审中-公开
    用于在全尺寸MIMO系统中通信信道状态信息的方法和装置

    公开(公告)号：US20170019162A1

    公开(公告)日：2017-01-19

    申请号：US15213312

    申请日：2016-07-18

    Applicant: Samsung Electronics Co., Ltd

    Inventor： Suryong Jeong ,  Taeyoung Kim ,  Keonkook Lee ,  Jiyun Seol

    IPC: H04B7/06 ,  H04B7/04 ,  H04L5/00

    CPC classification number: H04B7/0626 ,  H04B7/0413 ,  H04B7/0478 ,  H04B7/0632 ,  H04B17/318 ,  H04B17/345 ,  H04L5/0023 ,  H04L5/0051 ,  H04L5/0055 ,  H04L5/0057

    Abstract: The present disclosure relates to a communication method and system for converging a 5th-Generation (5G) communication system for supporting higher data rates beyond a 4th-Generation (4G) system with a technology for Internet of Things (IoT). The present disclosure may be applied to intelligent services based on the 5G communication technology and the IoT-related technology, such as smart home, smart building, smart city, smart car, connected car, health care, digital education, smart retail, security and safety services. A method and apparatus for transmitting/receiving Channel State Information (CSI) is provided for use in a Full Dimensional Multiple Input Multiple Output (FD-MIMO) system. A channel state information (CSI) reception for a base station according to the present disclosure for use in a wireless communication system includes transmitting CSI process configuration information to a terminal, transmitting a CSI Reference Signal (CSI-RS) to the terminal based on the CSI process configuration information, and receiving the CSI generated based on CSI-RS measurement result from the terminal, wherein the CSI process configuration information is configured to measure channel states of horizontal and vertical antenna arrays, the CSI includes a joint Channel Quality Indicator (CQI), and the joint CQI is determined based on the CQIs for the horizontal and vertical antennas arrays.

    Abstract translation: 本公开涉及用于利用物联网（IoT）技术来融合第五代（5G）通信系统以用于支持超过第四代（4G）系统的更高数据速率的通信方法和系统。 本发明可以应用于基于5G通信技术和智能家居，智能建筑，智能城市，智能汽车，连接汽车，医疗保健，数字教育，智能零售，安全和智能汽车的IoT相关技术的智能服务， 安全服务。 提供了用于发送/接收信道状态信息（CSI）的方法和装置，用于全尺寸多输入多输出（FD-MIMO）系统。 根据本公开的用于无线通信系统的基站的信道状态信息（CSI）接收包括向终端发送CSI处理配置信息，基于所述终端向终端发送CSI参考信号（CSI-RS） CSI处理配置信息，以及接收基于来自终端的CSI-RS测量结果生成的CSI，其中CSI处理配置信息被配置为测量水平和垂直天线阵列的信道状态，CSI包括联合信道质量指示符（CQI） ），并且基于用于水平和垂直天线阵列的CQI来确定联合CQI。

    CODEBOOK DESIGN AND STRUCTURE FOR ADVANCED WIRELESS COMMUNICATION SYSTEMS
    33.
    发明申请
    CODEBOOK DESIGN AND STRUCTURE FOR ADVANCED WIRELESS COMMUNICATION SYSTEMS 有权
    高级无线通信系统的CODEBOOK设计与结构

    公开(公告)号：US20160119097A1

    公开(公告)日：2016-04-28

    申请号：US14874252

    申请日：2015-10-02

    Applicant: Samsung Electronics Co., Ltd.

    Inventor： Young-Han Nam ,  Yang Li ,  Eko Onggosanusi ,  Md. Saifur Rahman ,  Taeyoung Kim

    IPC: H04L5/00 ,  H04W72/04 ,  H04B7/06

    CPC classification number: H04M3/5125 ,  H04B7/0478 ,  H04B7/0639 ,  H04L1/00 ,  H04L5/0023 ,  H04L5/0048 ,  H04L65/1006 ,  H04L65/105 ,  H04L65/1073 ,  H04L65/80 ,  H04M3/5175 ,  H04M3/5191 ,  H04M2203/402 ,  H04W24/00 ,  H04W48/00 ,  H04W88/02 ,  H04W88/08

    Abstract: A base station capable of communicating with a user equipment (UE) includes a transceiver configured to transmit Channel State Information-Reference Signal (CSI-RS) according to a CSI-RS configuration comprising a number of antenna ports, and downlink signals containing the CSI-RS configuration and a precoding-matrix-construction configuration for precoding matrix indicator (PMI) reporting on physical downlink shared channels (PDSCH), the precoding-matrix-construction configuration comprising a first and second sampling factors, O1 and O2, and a first and second numbers, N1 and N2, receive, from the UE, uplink signals containing a precoding matrix indicator (PMI) derived using the CSI-RS according to the precoding-matrix-construction configuration, a controller configured to convert the PMI to one of predetermined precoding matrices. Other embodiments including UEs and methods are disclosed.

    Abstract translation: 能够与用户设备（UE）进行通信的基站包括：收发器，被配置为根据包括多个天线端口的CSI-RS配置发送信道状态信息参考信号（CSI-RS），以及包含CSI的下行链路信号 -RS配置和用于在物理下行链路共享信道（PDSCH）上报告的预编码矩阵指示符（PMI）的预编码矩阵构造配置，所述预编码矩阵构造配置包括第一和第二采样因子O1和O2，以及第一 并且第二数字N1和N2从UE接收包含根据预编码矩阵构造配置导出的使用CSI-RS导出的预编码矩阵指示符（PMI）的上行链路信号;控制器，被配置为将PMI转换为 预定预编码矩阵。 公开了包括UE和方法的其他实施例。

    METHOD AND APPARATUS FOR DETECTING INTER-CELL INTERFERENCE IN MOBILE COMMUNICATION SYSTEM
    34.
    发明申请
    METHOD AND APPARATUS FOR DETECTING INTER-CELL INTERFERENCE IN MOBILE COMMUNICATION SYSTEM 有权
    用于检测移动通信系统中的细胞间干扰的方法和装置

    公开(公告)号：US20160119071A1

    公开(公告)日：2016-04-28

    申请号：US14921830

    申请日：2015-10-23

    Applicant: Samsung Electronics Co., Ltd.

    Inventor： Min Sagong ,  Sungnam Hong ,  Taeyoung Kim ,  Jiyun Seol

    IPC: H04J11/00 ,  H04L5/00 ,  H04L1/20

    CPC classification number: H04J11/005 ,  H04L1/20 ,  H04L5/0032 ,  H04L5/0051 ,  H04L5/0073

    Abstract: A method and an apparatus for detecting inter-cell interference in a mobile communication system are provided. A base station receives a reference signal (RS) from a terminal, generate one or more interference candidate RSs, calculate a cross correlation of the one or more interference candidate RSs and the received RS, estimate at least one of a size of a Resource Block (RB) an offset of the RB, a group index (U), and a cyclic shift (CS) by using a preset number of interference candidate RSs in an order of the large cross correlation. The base station further removes an interference signal or performs a direct reduction by using at least one of the estimated RB size, the RB offset, the timing offset, and the group index (U). According to the present disclosure, it is beneficial to mitigate or cancel inter-cell interference problem on an uplink transmission without any assistance of neighbor base stations and/or adjacent cells in a wireless communication system.

    Abstract translation: 提供了一种用于检测移动通信系统中的小区间干扰的方法和装置。 基站从终端接收参考信号（RS），生成一个或多个干扰候选RS，计算一个或多个干扰候选RS和接收到的RS的互相关，估计资源块的大小 （RB）通过使用预设数量的干扰候选RS以大互相关的顺序，RB的偏移，组索引（U）和循环移位（CS）。 基站还通过使用估计的RB大小，RB偏移，定时偏移和组索引（U）中的至少一个来去除干扰信号或执行直接减少。 根据本公开，在无线通信系统中的相邻基站和/或相邻小区的任何辅助下，减轻或消除上行链路传输中的小区间干扰问题是有益的。

    APPARATUS AND METHOD OF TRANSMITTING AND RECEIVING REFERENCE SIGNAL IN WIRELESS COMMUNICATION SYSTEM USING MULTIPLE-INPUT AND MULTIPLE-OUTPUT
    36.
    发明申请
    APPARATUS AND METHOD OF TRANSMITTING AND RECEIVING REFERENCE SIGNAL IN WIRELESS COMMUNICATION SYSTEM USING MULTIPLE-INPUT AND MULTIPLE-OUTPUT 审中-公开
    使用多输入和多输出的无线通信系统中发送和接收参考信号的装置和方法

    公开(公告)号：US20150244509A1

    公开(公告)日：2015-08-27

    申请号：US14631613

    申请日：2015-02-25

    Applicant: Samsung Electronics Co., Ltd.

    Inventor： Keonkook Lee ,  Chanhong Kim ,  Taeyoung Kim ,  Jiyun Seol ,  Jaeseung Son

    IPC: H04L5/00 ,  H04B7/04 ,  H04L25/02 ,  H04W72/04

    CPC classification number: H04L5/0048 ,  H04B7/0417 ,  H04L5/0023 ,  H04L5/005 ,  H04L25/0204 ,  H04L25/0224 ,  H04L25/03949 ,  H04L27/2613

    Abstract: An apparatus and method is proved that transmits and receives Reference Signals (RSs) in a wireless communication system using Multiple-Input and Multiple-Output (MIMO). A system adapted to the method is provided. The method includes: determining the number of RS transmission to two or more antennas, respectively, as the number of antennas included in respective ports, wherein each port include one or more antennas; creating transmit patterns so that they cyclically differ from each other every the number of RS transmission to transmit the created transmit patterns the number of RS transmission times; and mapping the RSs to one or more antennas according to the created, respective patterns, and transmitting the RSs in order.

    Abstract translation: 证明了在使用多输入多输出（MIMO）的无线通信系统中发送和接收参考信号（RS）的装置和方法。 提供了适用于该方法的系统。 该方法包括：分别将两个或多个天线的RS传输次数确定为包括在相应端口中的天线的数量，其中每个端口包括一个或多个天线; 创建发送模式，使得它们在RS传输的数量周期性地周期性地不同，以将所发送的发送模式发送到RS传输时间的数量; 以及根据所创建的相应模式将RS映射到一个或多个天线，以及依次发送RS。

    Electronic device, method, non-transitory computer-readable storage media, and UFS card including UFS storage device
    37.
    发明授权
    Electronic device, method, non-transitory computer-readable storage media, and UFS card including UFS storage device 有权

    公开(公告)号：US12124730B2

    公开(公告)日：2024-10-22

    申请号：US17863401

    申请日：2022-07-13

    Applicant: SAMSUNG ELECTRONICS CO., LTD.

    Inventor： Wonsuk Jung ,  Taeyoung Kim

    IPC: G06F3/06

    CPC classification number: G06F3/0655 ,  G06F3/0604 ,  G06F3/0679

    Abstract: An electronic device includes at least one processor, a Universal Flash Storage (UFS) device controller operatively coupled with the at least one processor, a UFS interface including a plurality of downstream lanes for transmitting data and a plurality of upstream lanes for transmitting data and storage including a cache memory and a plurality of non-volatile memories. The at least one processor transmits a first control signal to instruct measuring a temperature of the storage and identifying of the measured temperature exceeding a threshold value to the UFS device controller, receives a status signal indicating that the measured temperature exceeds the threshold value from the UFS device controller, and based on the status signal, transmits, to the UFS device controller, a second control signal to instruct that deactivating at least some of the plurality of downstream lanes and upstream lanes, or deactivating the cache memory in the storage.

    SEMICONDUCTOR PACKAGE
    39.
    发明公开
    SEMICONDUCTOR PACKAGE 审中-公开

    公开(公告)号：US20240072007A1

    公开(公告)日：2024-02-29

    申请号：US18331973

    申请日：2023-06-09

    Applicant: Samsung Electronics Co., Ltd.

    Inventor： In Lee ,  Taeyoung Kim

    IPC: H01L25/065 ,  H01L23/00 ,  H01L23/498

    CPC classification number: H01L25/0657 ,  H01L23/49838 ,  H01L24/16 ,  H01L2224/16148 ,  H01L2224/16227 ,  H01L2225/06513 ,  H01L2225/06541 ,  H01L2225/06562 ,  H01L2924/381

    Abstract: A semiconductor package includes a base substrate, a first semiconductor chip mounted on the base substrate, and a second semiconductor chip mounted on the first semiconductor chip. The first semiconductor includes first conductive connection structures that have a first pitch interval in a first direction and a second pitch interval in a second direction, and the second semiconductor chip includes second conductive connection structures that have the first pitch interval in the first direction and the second pitch interval in the second direction. The first conductive connection structures include first power connection structures, first ground connection structures, and first dummy structures. The first ground connection structure or the first dummy structure is between two first power connection structures neighboring in the first direction and between two first power connection structures neighboring in the second direction among the first power connection structures.

    STACK SEMICONDUCTOR PACKAGE
    40.
    发明公开
    STACK SEMICONDUCTOR PACKAGE 审中-公开

    公开(公告)号：US20240063155A1

    公开(公告)日：2024-02-22

    申请号：US18296500

    申请日：2023-04-06

    Applicant: Samsung Electronics Co., Ltd.

    Inventor： Hyunsoo CHUNG ,  Joonghyun Baek ,  Hyungu Kang ,  Taeyoung Kim ,  Jaekyu Sung ,  Cheolwoo Lee

    IPC: H01L23/00 ,  H10B80/00

    CPC classification number: H01L24/06 ,  H10B80/00 ,  H01L2224/0401 ,  H01L2224/06519 ,  H01L2924/1431 ,  H01L2924/1434

    Abstract: A stack semiconductor package including a base chip, at least two semiconductor chips stacked on the base chip, and a sealing material sealing the at least two semiconductor chips on the base chip may be provided. The at least two semiconductor chips may include an uppermost semiconductor chip and at least one under the uppermost semiconductor chip, the first semiconductor chip includes through electrodes at a central portion thereof along a first direction, the through electrodes arranged along a second direction perpendicular to the first direction, upper dummy pads on outer portions of a back side of the first semiconductor chip, the outer portions being a non-active surface of the first semiconductor chip and being at both sides of the central portion in the first direction, and a dummy pattern connecting the upper dummy pads with each other on the back side.

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