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63 条记录 (耗时 0.033 秒)

    Stacked chip device and manufacturing method thereof
    31.
    发明授权
    Stacked chip device and manufacturing method thereof 有权
    堆叠芯片器件及其制造方法

    公开(公告)号：US08675342B2

    公开(公告)日：2014-03-18

    申请号：US13494544

    申请日：2012-06-12

    申请人： Jong Beom Shin ,  Hyun Woo Kim ,  Doo Young Kim ,  Hyung Kyu Shim ,  Hyun Kyu Im ,  Youn Sik Jin ,  Dong Gun Kim

    发明人： Jong Beom Shin ,  Hyun Woo Kim ,  Doo Young Kim ,  Hyung Kyu Shim ,  Hyun Kyu Im ,  Youn Sik Jin ,  Dong Gun Kim

    IPC分类号： H01G4/06

    CPC分类号： H01G4/30 ,  H01G4/005 ,  H01G4/12

    摘要： Disclosed herein are a stacked chip device including: a stacked body in which a plurality of sheets having an internal electrode made of a conductive material are stacked; external electrodes provided at both sides of the stacked body; and connection electrodes extending from the internal electrode and electrically connecting the internal electrode with the external electrodes, wherein the connection electrodes include: a plating solution permeation preventing section extending from the internal electrode, however, extending with a thickness smaller than the thickness of the internal electrode; and a contact reinforcement section extending from the plating solution permeation preventing section, however, extending in the form in which the thickness thereof is gradually extended toward the external electrode, and a manufacturing method thereof.

    摘要翻译： 这里公开了一种堆叠式芯片装置，包括：层叠体，其中堆叠具有由导电材料制成的内部电极的多个片材; 设置在层叠体的两侧的外部电极; 以及从内部电极延伸并将内部电极与外部电极电连接的连接电极，其中，连接电极包括：从内部电极延伸的电镀液渗透防止部，其厚度比内部电极的厚度 电极; 以及从电镀液渗透防止部延伸的接触加强部，其厚度以其厚度逐渐向外部电极延伸的形态及其制造方法延伸。

    MULTILAYER CERAMIC CAPACITOR
    35.
    发明申请
    MULTILAYER CERAMIC CAPACITOR 审中-公开
    多层陶瓷电容器

    公开(公告)号：US20110141658A1

    公开(公告)日：2011-06-16

    申请号：US12852254

    申请日：2010-08-06

    申请人： Eun Sang NA ,  Doo Young Kim ,  Byung Gyun Kim ,  Hyun Tae Kim ,  Kyoung Jin Jun ,  Mi Young Kim ,  Hye Young Choi

    发明人： Eun Sang NA ,  Doo Young Kim ,  Byung Gyun Kim ,  Hyun Tae Kim ,  Kyoung Jin Jun ,  Mi Young Kim ,  Hye Young Choi

    IPC分类号： H01G4/06

    CPC分类号： H01G4/2325 ,  H01G4/12 ,  H01G4/30

    摘要： Disclosed is a multilayer ceramic capacitor. The multilayer ceramic capacitor includes a sintered ceramic body, a plurality of first internal electrodes and a plurality of second internal electrodes formed inside the sintered ceramic body, the first and second internal electrodes having ends alternately and respectively exposed to side surfaces of the sintered ceramic body, and first and second external electrodes formed on the side surfaces of the ceramic body and electrically connected to the first and second internal electrodes, the first and second external electrodes each including a plurality of pores with an average pore size of 2 μm to 5 μm and having a porosity of 2% to 10%.

    摘要翻译： 公开了一种多层陶瓷电容器。 多层陶瓷电容器包括烧结陶瓷体，多个第一内部电极和形成在烧结陶瓷体内部的多个第二内部电极，第一和第二内部电极具有交替地并且分别暴露于烧结陶瓷体的侧表面的端部 以及形成在陶瓷体的侧面上并电连接到第一和第二内部电极的第一和第二外部电极，第一和第二外部电极各自包括平均孔径为2μm至5μm的多个孔 孔隙率为2％〜10％。

    Thin film type solar cell and method for manufacturing the same
    37.
    发明申请
    Thin film type solar cell and method for manufacturing the same 有权
    薄膜型太阳能电池及其制造方法

    公开(公告)号：US20100167458A1

    公开(公告)日：2010-07-01

    申请号：US12460005

    申请日：2009-07-10

    申请人： Yong Woo Shin ,  Woo-Hyun Kim ,  Dae Yup Na ,  Hyun Jun Cho ,  Dong Woo Kang ,  Doo Young Kim ,  Hyun Kyo Shin ,  Cheol Hoon Yang

    发明人： Yong Woo Shin ,  Woo-Hyun Kim ,  Dae Yup Na ,  Hyun Jun Cho ,  Dong Woo Kang ,  Doo Young Kim ,  Hyun Kyo Shin ,  Cheol Hoon Yang

    IPC分类号： H01L31/18

    CPC分类号： H01L31/022425 ,  H01L31/046 ,  H01L31/0468 ,  Y02B10/10 ,  Y02E10/50

    摘要： A thin film type solar cell and a method for manufacturing the same is disclosed, which is capable of providing a wide light-transmission area without lowering cell efficiency and increasing processing time, so that the solar cell can be used as a substitute for a glass window in a building. The thin film type solar cell generally comprises a substrate; a plurality of front electrodes at fixed intervals on the substrate; a plurality of semiconductor layers at fixed intervals with a contact portion or separating channel interposed in-between, the plurality of semiconductor layers on the plurality of front electrodes; and a plurality of rear electrodes at fixed intervals by the each separating channel interposed in-between, the each rear electrode being electrically connected with the each front electrode; wherein the each rear electrode is patterned in such a way that a light-transmitting portion is included in a predetermined portion of the rear electrode.

    摘要翻译： 公开了一种薄膜型太阳能电池及其制造方法，其能够提供宽的透光面积而不降低电池效率和增加处理时间，使得太阳能电池可用作玻璃的替代品 窗户在建筑物。 薄膜型太阳能电池通常包括基板; 在所述基板上以固定间隔的多个前电极; 以固定间隔的多个半导体层，其中插入有位于其间的接触部分或分离通道，所述多个前电极上的多个半导体层; 以及通过插入其间的每个分离通道以固定间隔的多个后电极，每个后电极与每个前电极电连接; 其中每个后电极被图案化，使得在后电极的预定部分中包括光透射部分。

    Semiconductor memory device adapted to communicate decoding signals in a word line direction
    38.
    发明授权
    Semiconductor memory device adapted to communicate decoding signals in a word line direction 有权
    适用于在字线方向上传送解码信号的半导体存储器件

    公开(公告)号：US07567481B2

    公开(公告)日：2009-07-28

    申请号：US11594894

    申请日：2006-11-09

    申请人： Doo Young Kim

    发明人： Doo Young Kim

    IPC分类号： G11C8/00

    CPC分类号： G11C8/10

    摘要： A semiconductor memory device comprising decoding signals communicated solely in a word line direction is provided. The semiconductor memory device comprises a sub-array comprising a plurality of memory cells, a plurality of enable signal generators adapted to generate word line enable signals, a plurality of decoding signal generators adapted to generate decoding signals, a plurality of inverted decoding signal generators adapted to generate inverted decoding signals, and a word line driver area comprising a plurality of sub-word line drivers. Each sub-word line driver is adapted to drive a word line in accordance with one of the word line enable signals and a pair of first signals comprising one of the decoding signals and one of the inverted decoding signals. The word line enable signals and the decoding signals are communicated to the sub-word line drivers solely in a word line direction.

    摘要翻译： 提供一种半导体存储器件，包括仅在字线方向上传送的信号。 半导体存储器件包括一个包括多个存储器单元的子阵列，适用于产生字线使能信号的多个使能信号发生器，适于产生解码信号的多个解码信号发生器，适于 以产生反转的解码信号，以及包括多个子字线驱动器的字线驱动器区域。 每个子字线驱动器适于根据字线使能信号之一和包括解码信号之一和反转解码信号之一的一对第一信号驱动字线。 字线使能信号和解码信号仅在字线方向上传送到子字线驱动器。

    Automated strobel printing
    39.
    发明授权
    Automated strobel printing 有权
    自动strobel打印

    公开(公告)号：US09155357B2

    公开(公告)日：2015-10-13

    申请号：US13610207

    申请日：2012-09-11

    申请人： Yong-Joo Chon ,  Doo Young Kim ,  Young Gwan Kim

    发明人： Yong-Joo Chon ,  Doo Young Kim ,  Young Gwan Kim

    IPC分类号： G06F19/00 ,  A43D1/00 ,  A43B13/38 ,  A43D8/22 ,  A43D8/26

    CPC分类号： A43D8/26 ,  A43B13/38 ,  A43D1/00 ,  A43D8/22 ,  A43D111/00 ,  A43D111/006 ,  A43D2200/50 ,  A43D2200/60

    摘要： A machine moves shoe strobels to a camera or scanner where images of the strobels are captured. Using the images, a computing device instructs a printer how to mark guidelines on the strobels that signify one or more strobel sewing lines for different shoes models and shoe sizes. Cross-sectional lines may also be printed on the strobels to aid in error-checking guideline marking. Unmarked strobels are stacked in a loading compartment, sometimes in pairs—e.g., right and left shoe strobels. The unmarked strobels are transferred to a conveyor that brings the strobels to the camera or scanner and the printer. After guidelines and/or cross-sectional lines are added to the strobels, the marked strobels are stacked in a compartments housing other marked strobels.

    摘要翻译： 机器将鞋带移动到摄像机或扫描仪，其中捕获闪光灯的图像。 使用图像，计算设备指示打印机如何标记针对不同鞋子模型和鞋子尺寸的一条或多条频道缝合线条的条纹。 横截面线也可以打印在偏光片上，以帮助错误检查指南标记。 未标记的频闪器件有时成对地堆叠在加载隔间中，例如左右滑靴。 未标记的闪光灯被转移到将闪光灯带到相机或扫描仪和打印机的传送带上。 在将指南和/或横截面线添加到闪光灯之后，标记的闪光灯被堆叠在容纳其它标记的闪光灯的隔间中。

    Laminated chip electronic component, board for mounting the same, and packing unit thereof
    40.
    发明授权
    Laminated chip electronic component, board for mounting the same, and packing unit thereof 有权
    层叠芯片电子部件，用于安装其的基板及其包装单元

    公开(公告)号：US08638543B2

    公开(公告)日：2014-01-28

    申请号：US13588876

    申请日：2012-08-17

    申请人： Young Ghyu Ahn ,  Min Cheol Park ,  Doo Young Kim ,  Sang Soo Park

    发明人： Young Ghyu Ahn ,  Min Cheol Park ,  Doo Young Kim ,  Sang Soo Park

    IPC分类号： H01G4/06 ,  H01G4/005

    CPC分类号： H01G4/30 ,  B65B9/04 ,  B65B15/04 ,  H01G2/065 ,  H01G4/012 ,  H01G4/12 ,  H05K1/181 ,  H05K2201/10015

    摘要： A laminated chip electronic component includes: a ceramic body including internal electrodes and dielectric layers; first and second external electrodes formed to cover both end portions of the ceramic body in a length direction; an active layer in which the internal electrodes are disposed in an opposing manner, while having the dielectric layers interposed therebetween, to form capacitance; upper and lower cover layers formed on upper and lower portions of the active layer in a thickness direction, the lower cover layer having a thickness greater than that of the upper cover layer; and additional electrode layers disposed irrespective of a formation of capacitance within the lower cover layer.

    摘要翻译： 层叠芯片电子部件包括：陶瓷体，其包括内部电极和电介质层; 形成为在长度方向上覆盖陶瓷体的两端部的第一外部电极和第二外部电极; 其中内部电极以相对的方式设置在其间插入电介质层的有源层以形成电容; 上下层形成在有源层的厚度方向的上部和下部上，下覆盖层的厚度大于上覆盖层的厚度; 以及与下覆盖层内的电容的形成无关地设置的附加电极层。