摘要:
An electrostatic discharge control system and circuit uses a voltage variable material to protect an electrical circuit, such as radio frequency identification (RFID) tag, from electrostatic damage, The circuit includes two separate electrical circuit traces with a gap between the traces. The circuit includes and protects an electrical device, such as an integrated circuit, connected between the traces. The circuit includes a voltage variable material disposed adjacent to the gap and configured to directly electrically couple the first circuit trace to the second circuit trace upon occurrence of an electrostatic discharge event. The voltage variable material may be anisotropic.
摘要:
An arrangement of voltage variable materials for the protection of electrical components from electrical overstress (EOS) transients. A device having a plurality of electrical leads, a ground plane and a layer of voltage variable material. The voltage variable material physically bonds the plurality of electrical leads to one another as well as provides an electrical connection between the plurality of electrical leads and the ground plane. A die having a circuit integrated therein is attached to the ground plane. Conductive members electrically connect the plurality of electrical leads to the integrated circuit. At normal operating voltages, the voltage variable material has a high resistance, thus channeling current from the electrical leads to the integrated circuit via the conductive members. In response to a high voltage EOS transient, the voltage variable material essentially instantaneously switches to a low resistance state, channeling the potentially harmful EOS transient to the ground plane and away from the integrated circuit.
摘要:
An integrated overvoltage and overcurrent circuit protection device for use in telecommunication circuits. The integrated circuit protection device combines a overcurrent device such as a fuse and a overvoltage protection device such as a thyristor to respectively protect against overcurrent conditions and transient overvoltages. Integration of multiple devices in a common package ensures proper coordination and matching of the components, reduces the final product cost and reduces the physical space required on a telecommunications circuit for overvoltage and overcurrent circuit protection.
摘要:
A fuse element partially encapsulated in an arc-suppression material which can, in turn, be integrated along with a semiconductor device into a semiconductor package to provide overcurrent protection, as well as a method of integrating such a fuse along with a semiconductor device into a semiconductor package wherein the semiconductor package has a standard form factor based on the semiconductor device integrated within.
摘要:
A number of integrated circuit dies having on board protection against electrical overstress (EOS) transients are provided. Generally, the devices have an integrated circuit die with an outer periphery and a functional die area. A plurality of conductive input/output pads are formed on the integrated circuit die. Typically, a first conductive guard rail is disposed on the integrated circuit die and forms a gap between each one of the input/output pads. A voltage variable material is disposed in the gaps between the conductive guard rail and the input/output pads. Typically, a plurality of electrical leads are electrically connected to a respective one of the plurality of conductive input/output pads. At normal operating voltages, the voltage variable material is non-conductive. However, in response to an EOS transient, the voltage variable material switches to a low resistance state, providing a conductive path between the conductive guard rail and the input/output pads.
摘要:
A transient voltage protection device is described wherein a gap between a ground conductor and another conductor is formed using a diamond dicing saw. Substrate material selection includes specific ceramic materials having a density of less than 3.8 gm/cm.sup.3 designed to optimize performance and manufacturability. An overlay layer can be provided to minimize burring of the conductors during formation of the gap.
摘要翻译:描述了一种瞬态电压保护装置,其中使用金刚石切割锯形成接地导体和另一导体之间的间隙。 基材选择包括密度小于3.8gm / cm 3的特定陶瓷材料,旨在优化性能和可制造性。 可以提供覆盖层以最小化间隙形成期间导体的毛刺。