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    Base station timing control using synchronous transport signals
    35.
    发明授权
    Base station timing control using synchronous transport signals 有权
    基站定时控制采用同步传输信号

    公开(公告)号：US09210674B2

    公开(公告)日：2015-12-08

    申请号：US13429606

    申请日：2012-03-26

    申请人： Yifan Lin ,  Ze Mian Huang ,  Tao Wang ,  Lin Sun ,  Hao Li

    发明人： Yifan Lin ,  Ze Mian Huang ,  Tao Wang ,  Lin Sun ,  Hao Li

    IPC分类号： H04W4/00 ,  H04W56/00 ,  H04W92/04

    CPC分类号： H04W56/001 ,  H04W92/045

    摘要： A base station of a wireless system comprises a local clock source and timing circuitry coupled to the local clock source. The timing circuitry is configured to adjust at least one parameter of the local clock source based at least in part on timing information extracted from designated portions of each of one or more frames of a synchronous transport signal received in the base station. The base station may further comprise a physical layer device, such as a mapper, configured to extract the timing information from the designated portions of each of the one or more frames of the synchronous transport signal. The designated portions of the one or more frames of the synchronous transport signal from which the timing information is extracted may comprise designated overhead bytes of the one or more frames, such as, for example, transport overhead (TOH) bytes.

    摘要翻译： 无线系统的基站包括耦合到本地时钟源的本地时钟源和定时电路。 定时电路被配置为至少部分地基于从在基站中接收的同步传输信号的一个或多个帧的每一个的指定部分提取的定时信息来调整本地时钟源的至少一个参数。 基站还可以包括诸如映射器的物理层设备，被配置为从同步传输信号的一个或多个帧中的每一个的指定部分提取定时信息。 提取定时信息的同步传输信号的一个或多个帧的指定部分可以包括一个或多个帧的指定的开销字节，例如传输开销（TOH）字节。

    ELECTRONIC MODULE, LIGHTING DEVICE AND MANUFACTURING METHOD OF THE ELECTRONIC MODULE
    37.
    发明申请
    ELECTRONIC MODULE, LIGHTING DEVICE AND MANUFACTURING METHOD OF THE ELECTRONIC MODULE 审中-公开
    电子模块，照明设备和电子模块的制造方法

    公开(公告)号：US20140362590A1

    公开(公告)日：2014-12-11

    申请号：US14238204

    申请日：2012-08-10

    申请人： Peng Chen ,  Xiaomian Chen ,  Yaojun Feng ,  Hao Li

    发明人： Peng Chen ,  Xiaomian Chen ,  Yaojun Feng ,  Hao Li

    IPC分类号： H05K1/02 ,  F21V29/00 ,  H05K3/28

    CPC分类号： H05K1/0206 ,  H05K3/0061 ,  H05K3/284 ,  H05K2201/10106 ,  H05K2203/10 ,  H05K2203/1147 ,  H05K2203/1316 ,  H05K2203/1327 ,  Y10T29/49146

    摘要： An electronic module to be mounted on a mounting surface may include: a circuit board provided with a heat source, wherein a thermal via is formed through the circuit board and is in thermal contact with the heat source; and a potting material packaging the circuit board at least at the other side opposite to one side of heat source, wherein the potting material has a recess formed in at least part of an area corresponding to the thermal via at the other side of the circuit board and a thermal conductive material, which is thermal-conductively connected to the mounting surface, is filled in the recess.

    摘要翻译： 安装在安装表面上的电子模块可以包括：设置有热源的电路板，其中热通孔通过电路板形成并与热源热接触; 以及灌封材料至少在与热源一侧相对的另一侧封装所述电路板，其中所述灌封材料具有形成在与所述电路板的另一侧上的热通孔对应的区域的至少一部分中的凹部 并且导热连接到安装表面的导热材料填充在凹部中。