公开(公告)号：US08927906B2

公开(公告)日：2015-01-06

申请号：US13018877

申请日：2011-02-01

申请人： Masahide Tadokoro ,  Yoshihiro Kondo ,  Takashi Saito

发明人： Masahide Tadokoro ,  Yoshihiro Kondo ,  Takashi Saito

IPC分类号： H05B11/00 ,  B05C21/00 ,  G03F7/20 ,  H05B3/20

CPC分类号： B05C21/00 ,  G03F7/20 ,  H05B3/20

摘要： The disclosed heating device is to perform a heating process on an exposed substrate formed with a resist film before a developing process, the device including a heating part to perform a heating process on the exposed substrate, the heating part including a plurality of two-dimensionally arranged heating elements; a seating part provided at an upper side of the heating part, on which the substrate is disposed; and a control part to correct a setting temperature of the heating part based on temperature correction values, and to control the heating part based on the corrected setting temperature, during the heating process on one substrate by the heating part, wherein the temperature correction values being previously obtained from measured critical dimensions of the resist pattern in another substrate formed with the resist pattern through the heating process by the heating part and then the developing process.

摘要翻译： 所公开的加热装置是在显影处理之前对形成有抗蚀剂膜的暴露的基板进行加热处理，该装置包括加热部分，以对暴露的基板进行加热处理，加热部分包括多个二维 布置加热元件; 设置在所述加热部的上侧的座部，所述基板设置在所述加热部的上侧; 以及控制部，其基于温度校正值校正加热部的设定温度，并且在由加热部在一个基板上的加热处理期间，基于校正的设定温度来控制加热部，其中，温度校正值为 先前由通过加热部分的加热处理形成的抗蚀剂图案的另一个衬底中的抗蚀剂图案的测量的临界尺寸获得，然后通过显影过程获得。

公开(公告)号：US20080074657A1

公开(公告)日：2008-03-27

申请号：US11856308

申请日：2007-09-17

申请人： Yoshihiro Kondo ,  Kunie Ogata ,  Shinichi Shinozuka

发明人： Yoshihiro Kondo ,  Kunie Ogata ,  Shinichi Shinozuka

IPC分类号： G01N21/00

CPC分类号： H01L21/67253 ,  H01L21/67248

摘要： In the present invention, for measurement of line widths, for example, at 36 locations within a substrate processed in a coating and developing treatment system, the 36 measurement points are divided and, for example, six substrates are used to measure the line widths at all of measurement points. In this event, the line widths at six measurement points are measured in each of the substrate, which exist in substrate regions different for each substrate. Then, the measurement results of the line widths at the measurement points of the substrates are combined, so that the line widths at 36 measurement points are finally detected. According to the present invention, the measurements of product substrates can be performed without decreasing the throughput of processing of the product substrates.

摘要翻译： 在本发明中，为了测量线宽度，例如在涂布和显影处理系统中处理的基板内的36个位置处，36个测量点被分割，并且例如使用六个基板来测量线宽 所有测量点。 在这种情况下，在每个衬底中测量六个测量点处的线宽度，每个衬底存在于对于每个衬底不同的衬底区域中。 然后，将基板的测定点的线宽度的测定结果合并，最终检测36个测定点的线宽。 根据本发明，可以在不降低产品基板的加工生产能力的情况下进行产品基板的测量。

公开(公告)号：US07113404B2

公开(公告)日：2006-09-26

申请号：US10791772

申请日：2004-03-04

申请人： Takashi Naganawa ,  Rintaro Minamitani ,  Shigeo Ohashi ,  Yoshihiro Kondo ,  Osamu Suzuki ,  Hitoshi Matsushima

发明人： Takashi Naganawa ,  Rintaro Minamitani ,  Shigeo Ohashi ,  Yoshihiro Kondo ,  Osamu Suzuki ,  Hitoshi Matsushima

IPC分类号： H05K7/20 ,  H05K1/00 ,  F28F7/00 ,  H01L23/34

CPC分类号： F28F9/002 ,  F28D1/05341 ,  F28F9/0246 ,  H01L23/473 ,  H01L2924/0002 ,  H01L2924/00

摘要： A liquid cooling system, comprises: heat-receiving jacket 7, thermally connected with a heat-generation element, a pump attached onto a radiator 1a, and a tank portion 2 on the radiator 1a, wherein a coolant liquid is circulated between the heat-receiving jacket 7 and the radiator 1a by means of the pump 8, thereby obtaining the liquid cooling system for an electronic apparatus, being suitable for small-sizing and a thin-type, while maintaining high reliability thereof.

摘要翻译： 一种液体冷却系统，包括：与发热元件热连接的热接收套7，附接到散热器1a上的泵和在散热器1a上的罐部分2，其中冷却剂液体在 热接收护套7和散热器1a，从而获得用于电子设备的液体冷却系统，适用于小尺寸和薄型，同时保持其高可靠性。

公开(公告)号：US20050157466A1

公开(公告)日：2005-07-21

申请号：US11079264

申请日：2005-03-15

申请人： Rintaro Minamitani ,  Makoto Kitano ,  Noriyuki Ashiwake ,  Shigeo Ohashi ,  Yoshihiro Kondo ,  Takashi Naganawa ,  Yuji Yoshitomi ,  Tsuyoshi Nakagawa

发明人： Rintaro Minamitani ,  Makoto Kitano ,  Noriyuki Ashiwake ,  Shigeo Ohashi ,  Yoshihiro Kondo ,  Takashi Naganawa ,  Yuji Yoshitomi ,  Tsuyoshi Nakagawa

IPC分类号： F28D15/02 ,  F01P11/06 ,  G06F1/20 ,  H01L23/473 ,  H05K7/20 ,  H05K5/00

CPC分类号： G06F1/203 ,  F01P2011/066 ,  F28D15/0266 ,  G06F2200/201 ,  Y10S165/905

摘要： A liquid cooling system which is utilizable in a personal computer includes a pump for supplying a cooling liquid; a heat receiving jacket supplied with the cooling liquid and positioned to receive heat generated from a heat generation body, a heat radiation pipe for radiating heat which is supplied by the cooling liquid passing through the heat receiving jacket, and a passage for circulating the cooling liquid passing through the heat radiation pipe into the pump. The heat radiation pipe is made of material having a corrosion resistance that is higher than that of the heat receiving jacket.

公开(公告)号：US20050082036A1

公开(公告)日：2005-04-21

申请号：US10968059

申请日：2004-10-20

申请人： Rintaro Minamitani ,  Shigeo Ohashi ,  Yoshihiro Kondo ,  Yuji Yoshitomi ,  Takashi Naganawa ,  Masato Nakanishi ,  Tsuyoshi Nakagawa

发明人： Rintaro Minamitani ,  Shigeo Ohashi ,  Yoshihiro Kondo ,  Yuji Yoshitomi ,  Takashi Naganawa ,  Masato Nakanishi ,  Tsuyoshi Nakagawa

IPC分类号： G06F1/20 ,  H01L23/473 ,  H05K7/20 ,  F28F7/00

CPC分类号： G06F1/203 ,  F28D15/0266 ,  G06F2200/201

摘要： A cooling device for an electronic apparatus includes a heat generating element attached within a housing, a heat receiving jacket connectable with the heat generating element, a heat exchanger for exchanging heat between the heat receiving jacket and outside of the electronic apparatus and a liquid driver which supplies a cooling liquid to the heat receiving jacket. A part of pipework connected between the heat receiving jacket, the heat exchanger, and the liquid driver is made of a flexible tube of resin, and an ion exchanger is provided in a portion of the pipework. The cooling liquid has a corrosion inhibitor therein.

摘要翻译： 一种用于电子设备的冷却装置，包括附接在壳体内的发热元件，可与发热元件连接的热接收护套，用于在热接收护套和电子设备外部之间进行热交换的热交换器，以及液体驱动器 向冷却液供应冷却液。 连接在热接收套管，热交换器和液体驱动器之间的管道的一部分由柔性的树脂管制成，并且在管道的一部分中提供离子交换器。 冷却液中含有腐蚀抑制剂。

公开(公告)号：US20050078450A1

公开(公告)日：2005-04-14

申请号：US10968010

申请日：2004-10-20

申请人： Shigeo Ohashi ,  Yoshihiro Kondo ,  Rintaro Minamitani ,  Takashi Naganawa ,  Yuuji Yoshitomi ,  Masato Nakanishi ,  Hajime Katou ,  Tsuyoshi Nakagawa

发明人： Shigeo Ohashi ,  Yoshihiro Kondo ,  Rintaro Minamitani ,  Takashi Naganawa ,  Yuuji Yoshitomi ,  Masato Nakanishi ,  Hajime Katou ,  Tsuyoshi Nakagawa

IPC分类号： F25D17/02 ,  F28F1/22 ,  G06F1/20 ,  H01L23/473 ,  H05K7/20

CPC分类号： G06F1/203 ,  F28F1/22 ,  G06F2200/201 ,  G06F2200/203

摘要： A water-cooling device for cooling a heat-generating element within an electronic apparatus. The water-cooling device includes a water-cooling jacket which is thermally connectable with the heat-generating element, a heat-radiation pipe, a tank, and a liquid driver which forms a circulation flow passage through which a cooling liquid flows. At least one of the water-cooling jacket, the heat-radiation pipe, the tank and the liquid driver is attached on a plate, and the water-cooling device is detachable with respect to the heat-generating element by the plate.

摘要翻译： 一种用于冷却电子设备内的发热元件的水冷装置。 水冷装置包括可与发热元件热连接的水冷套，散热管，罐和液体驱动器，其形成冷却液流过的循环流路。 水冷套，散热管，罐和液体驱动器中的至少一个安装在板上，并且水冷装置通过板相对于发热元件可拆卸。

公开(公告)号：US20050047091A1

公开(公告)日：2005-03-03

申请号：US10791823

申请日：2004-03-04

申请人： Rintaro Minamitani ,  Shinji Matsushita ,  Shigeo Ohashi ,  Yoshihiro Kondo ,  Takashi Naganawa ,  Osamu Suzuki

发明人： Rintaro Minamitani ,  Shinji Matsushita ,  Shigeo Ohashi ,  Yoshihiro Kondo ,  Takashi Naganawa ,  Osamu Suzuki

IPC分类号： F25D17/02 ,  G06F1/20 ,  H01L23/473 ,  H05K7/20

CPC分类号： H01L23/473 ,  G06F1/203 ,  G06F2200/201 ,  H01L2924/0002 ,  H01L2924/00

摘要： A liquid cooling system for use in an electronic apparatus, being super small-sized and thin in the shape and being suitable for cooling a heat-generation part, such as, a semiconductor element having large amount of heat generation, for example, with maintaining the corrosion resistance thereof for a long time period, comprises: a pump for supplying a cooling liquid; a heat-receiving jacket, being supplied with the cooling liquid, for receiving heat from an electronic parts; a radiator, being supplied with the cooling liquid passing through the heat-receiving jacket, for radiation heat; and flow passages for circulating the cooling liquid in a route passing through the radiator back to said pump, wherein an ion exchange bag, having an ion exchange resin and a bag enclosing it therein, is disposed in a part of the constituent parts of the liquid cooling system, and/or the ion exchange bag is exchangeable.

摘要翻译： 一种用于电子设备的液体冷却系统，其尺寸超薄，形状小，适合于冷却发热部件，例如具有大量发热量的半导体元件，例如维持 其耐腐蚀性长时间包括：用于供应冷却液的泵; 供给冷却液的热接收套，用于从电子部件接收热量; 散热器，供给通过热接收护套的冷却液用于辐射热; 以及用于使通过散热器的路线中的冷却液循环回到所述泵的流路，其中具有离子交换树脂的离子交换袋和其中包围的离子交换袋设置在液体的组成部分的一部分中 冷却系统和/或离子交换袋是可交换的。

公开(公告)号：US20050047083A1

公开(公告)日：2005-03-03

申请号：US10962472

申请日：2004-10-13

申请人： Yoshihiro Kondo ,  Shigeo Ohashi ,  Rintaro Minamitani ,  Takashi Naganawa ,  Yuji Yoshitomi ,  Masato Nakanishi ,  Yasuhiko Sasaki ,  Tsuyoshi Nakagawa ,  Osamu Suzuki ,  Shinji Matsushita ,  Yasunori Yamada

发明人： Yoshihiro Kondo ,  Shigeo Ohashi ,  Rintaro Minamitani ,  Takashi Naganawa ,  Yuji Yoshitomi ,  Masato Nakanishi ,  Yasuhiko Sasaki ,  Tsuyoshi Nakagawa ,  Osamu Suzuki ,  Shinji Matsushita ,  Yasunori Yamada

IPC分类号： G06F1/20 ,  H05K7/20

CPC分类号： H05K7/20781 ,  G06F1/20 ,  G06F2200/201

摘要： An electronic module which is detachably mounted on electronic equipment. The electronic module includes a board having a heat generator mounted on a surface thereof, and a cooling jacket which is integrally attached to the electronic module. The cooling jacket is thermally coupled to the heat generator and has a passage of a cooling fluid therewithin.

摘要翻译： 一种可拆卸地安装在电子设备上的电子模块。 电子模块包括安装在其表面上的具有发热体的板和与电子模块一体地连接的冷却套。 冷却套与热发生器热耦合，并且在其中具有冷却流体的通道。

公开(公告)号：US5358032A

公开(公告)日：1994-10-25

申请号：US13423

申请日：1993-02-04

申请人： Masatsugu Arai ,  Akiomi Kohno ,  Toshio Hatada ,  Yoshihiro Kondo ,  Toshihiro Komatsu ,  Kanji Otsuka ,  Yuji Shirai ,  Susumu Iwai

发明人： Masatsugu Arai ,  Akiomi Kohno ,  Toshio Hatada ,  Yoshihiro Kondo ,  Toshihiro Komatsu ,  Kanji Otsuka ,  Yuji Shirai ,  Susumu Iwai

IPC分类号： H01L23/36 ,  F28F3/02 ,  H01L23/367 ,  H01L23/467 ,  F28F7/00

CPC分类号： F28F3/022 ,  H01L23/3677 ,  H01L2224/45015 ,  H01L2224/45147 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2224/49109 ,  H01L2224/73265 ,  H01L24/45 ,  H01L24/49 ,  H01L2924/01014 ,  H01L2924/01015 ,  H01L2924/01047 ,  H01L2924/01057 ,  H01L2924/01079 ,  H01L2924/01322 ,  H01L2924/14 ,  H01L2924/16195

摘要： Disclosed is an LSI package cooling heat sink having a heat diffusion plate and thin wire fins joined to the heat diffusion plate. The heat sink is mounted on an LSI package and the LSI package is cooled by the flowing of fluid through the thin wire fins. The wire fins are made of a net formed of longitudinal thin wires intersecting with horizontal thin wires. The net is formed to continuous rectangular shapes or a swirl shape and joined to the heat diffusion plate. The net is constituted so that the number of the thin wires vertical to the heat diffusion plate is larger than the number of the thin wires parallel thereto and the net is joined to the heat diffusion plate by brazing, diffusion joint, pressure welding or the like. Since the heat sink is formed of the net composed of the longitudinal thin wires intersecting with the horizontal thin wires, the irregular portions of the adjacent thin wires are formed at a dislocated position and fluid striking against the thin wires produces many turbulent flows so that a high heat transfer performance can be obtained. Further, since the net formed of the thin wires is used, the size of cooling fins can be reduced and noise can be also lowered. Further, it is possible to produce an LSI package cooling heat sink in a short time which heat sink is excellent in mass-production.

摘要翻译： 公开了具有热扩散板的LSI封装冷却散热器和与散热板接合的细线散热片。 散热器安装在LSI封装上，并且LSI封装通过流体流过细金属丝散热片来冷却。 金属丝散热片由与水平细线相交的纵向细线形成的网构成。 网形成为连续的矩形形状或漩涡形状并且连接到热扩散板。 网构成为与散热板垂直的细线的数量大于与其平行的细线的数量，并且网通过钎焊，扩散接头，压焊等连接到热扩散板 。 由于散热器由与横向细线相交的纵向细线组成的网形成，所以相邻细线的不规则部分形成在脱位位置，并且撞击细线的流体产生许多湍流，使得 可以获得高的传热性能。 此外，由于使用由细线形成的网，所以能够降低散热片的尺寸，降低噪音。 此外，可以在短时间内制造LSI封装冷却散热器，散热器的批量生产性优异。

公开(公告)号：US20100291491A1

公开(公告)日：2010-11-18

申请号：US12662343

申请日：2010-04-13

申请人： Masahiro Yamamoto ,  Yoshihiro Kondo ,  Atsushi Ookouchi ,  Toyohisa Tsuruda

发明人： Masahiro Yamamoto ,  Yoshihiro Kondo ,  Atsushi Ookouchi ,  Toyohisa Tsuruda

IPC分类号： G03F7/38

CPC分类号： G03F7/38 ,  H01L21/0273

摘要： A resist pattern slimming treatment method of performing a slimming treatment on a resist pattern formed on a substrate includes: a slimming treatment step of performing a slimming treatment on the resist pattern by applying a reactant solubilizing the resist pattern onto the resist pattern, then performing a heat treatment on the resist pattern under a heat treatment condition determined in advance, and then performing a developing treatment on the resist pattern; and a first line width measurement step of measuring a line width of the resist pattern before the slimming treatment step. The heat treatment condition is determined based on a measurement value of the line width measured in the first line width measurement step.

摘要翻译： 对形成在基板上的抗蚀剂图案进行减肥处理的抗蚀剂图案减肥处理方法包括：减肥处理步骤，通过将抗蚀剂图案溶解在抗蚀剂图案上来进行抗蚀剂图案的减肥处理，然后进行 在预先确定的热处理条件下对抗蚀剂图案进行热处理，然后对抗蚀剂图案进行显影处理; 以及第一线宽测量步骤，用于在减肥处理步骤之前测量抗蚀剂图案的线宽。 基于在第一线宽测量步骤中测量的线宽的测量值来确定热处理条件。