公开(公告)号：US5847744A

公开(公告)日：1998-12-08

申请号：US598164

申请日：1996-02-07

申请人： Hideaki Hoki ,  Toshihiko Takakura ,  Haruhiko Yamashita ,  Kunio Motoyama ,  Mitsuhiko Fukuda ,  Yasuzo Matsuo

发明人： Hideaki Hoki ,  Toshihiko Takakura ,  Haruhiko Yamashita ,  Kunio Motoyama ,  Mitsuhiko Fukuda ,  Yasuzo Matsuo

IPC分类号： B41J2/335

CPC分类号： B41J2/3351 ,  B41J2/33525 ,  B41J2/3353 ,  B41J2/3355 ,  B41J2/3357 ,  B41J2/3359

摘要： A thin-film type thermal print head has a resistor layer formed over an insulative substrate, a conductor layer having a specified planar pattern overlapping the resistor layer, a portion of the resistor layer serving as a heat-emitting part which is not covered by the conductor layer, and a protective layer formed over the heat-emitting part and at least a portion of the conductor layer adjacent to the heat-emitting part. The protective layer may be formed as a conductive layer with resistance greater than that of the heat-emitting part such that static electricity which may be generated by the friction with printing paper can quickly escape to the conductor layer. The protective layer may also include a wear-resisting layer of a prior art type between the conductive layer and the conductor layer, a portion of the conductive layer being preferably connected to the conductor layer. The conductive layer is preferably a mixed layer of SiC and ZrB.sub.2 containing ZrB.sub.2 by 5-20 molar %, formed by sputtering or chemical vapor deposition and having surface resistance of 10.sup.6 -10.sup.9 .OMEGA..

摘要翻译： 薄膜型热敏打印头具有形成在绝缘基板上的电阻层，具有与电阻层重叠的特定平面图案的导体层，作为发热部分的电阻层的不被覆盖的部分 导体层和形成在发热部分上方的保护层和与发热部分相邻的导体层的至少一部分。 保护层可以形成为具有大于发热部分的电阻的导电层，使得由印刷纸的摩擦产生的静电可以快速地逸出到导体层。 保护层还可以包括在导电层和导体层之间的现有技术类型的耐磨层，导电层的一部分优选地连接到导体层。 导电层优选是通过溅射或化学气相沉积形成的具有106-109欧米茄的表面电阻形成的包含ZrB 2的5-20摩尔％的SiC和ZrB 2的混合层。

公开(公告)号：US5680170A

公开(公告)日：1997-10-21

申请号：US583037

申请日：1996-01-16

申请人： Hideo Taniguchi ,  Toshihiko Takakura ,  Hideaki Hoki ,  Masatoshi Nakanishi

发明人： Hideo Taniguchi ,  Toshihiko Takakura ,  Hideaki Hoki ,  Masatoshi Nakanishi

IPC分类号： B41J2/335

CPC分类号： B41J2/3351 ,  B41J2/3356

摘要： A thermal printhead according to the present invention includes an insulating head substrate (8) having an obverse surface (8a), a reverse surface (8b), a first longitudinal edge surface (8c) and a second longitudinal edge surface (8d). The surface (8a) of the head substrate (8) is formed with an array of heating dots (10a) along the first longitudinal edge surface (8c), a common electrode pattern (11) electrically connected to the array of heating dots (10a) adjacent to the first longitudinal edge surface (8c) and individual electrodes (12) extending away from the common electrode pattern (11) and being electrically connected to the respective heating dots (10a). The heating dots (10a) are selectively heated by drive elements. The common electrode pattern (11) is electrically connected to an auxiliary electrode layer (14) which covers at least the first longitudinal edge surface (8c), reverse surface (8b) and second longitudinal edge surface (8d) of the heat substrate (8).

摘要翻译： PCT No.PCT / JP95 / 01033 Sec。 371日期1996年1月16日 102（e）日期1996年1月16日PCT提交1995年5月29日PCT公布。 出版物WO95 / 32867 日期1995年12月7日根据本发明的热打印头包括具有正面（8a），反面（8b），第一纵向边缘表面（8c）和第二纵向边缘表面（8c）的绝缘头基板（8） （8d）。 头基板（8）的表面（8a）沿着第一纵向边缘表面（8c）形成有加热点阵列（10a），公共电极图案（11）电连接到加热点阵列（10a ）和离开公共电极图案（11）延伸并且电连接到相应的加热点（10a）的单独电极（12）相邻的第一纵向边缘表面（8c）。 加热点（10a）由驱动元件选择性加热。 公共电极图案（11）电连接到辅助电极层（14），该辅助电极层至少覆盖加热衬底（8）的第一纵向边缘表面（8c），反面（8b）和第二纵向边缘表面（8d） ）。

公开(公告)号：US5514524A

公开(公告)日：1996-05-07

申请号：US345705

申请日：1994-11-21

申请人： Hiroaki Ohnishi ,  Toshihiko Takakura ,  Toshiyuki Fujita

发明人： Hiroaki Ohnishi ,  Toshihiko Takakura ,  Toshiyuki Fujita

IPC分类号： B41J2/335

CPC分类号： B41J2/3356 ,  B41J2/3359 ,  Y10T29/49083

摘要： A method of making thermal printheads is provided which comprises the steps of: (a) preparing a master substrate having plural rows of unit head regions; (b) forming a head glaze member in each unit head region in each row so that an edge of the head glaze member of the unit head region aligned with that of the head glaze member of any other unit region in the same row; (c) half-cutting the master substrate along the edge of the head glaze member of the unit head region with a half-cutting dicing blade which has an inclined edge face for partially cutting the head glaze member to provide a glaze corner; and (d) forming an array of heating dots along the glaze corner; wherein at least one blade positioning mark is formed on the master substrate before the half-cutting step (c); and the half-cutting dicing blade is positionally set in the half-cutting step (c) by referring to the blade positioning mark.

摘要翻译： 提供一种制造热敏打印头的方法，其包括以下步骤：（a）制备具有多排单元头区域的母板; （b）在每行的每个单位头部区域中形成头釉构件，使得单位头部区域的头釉构件的边缘与同一行中任何其他单位区域的头釉构件的边缘对齐; （c）用具有倾斜边缘面的半切割切割刀片沿着单元头部区域的头釉构件的边缘半切割主基板，用于部分地切割头釉构件以提供釉角; 和（d）沿着釉角形成加热点阵列; 其中在所述半切割步骤（c）之前在所述母板上形成至少一个刀片定位标记; 并且半切割切割刀片通过参照刀片定位标记位置地设置在半切割步骤（c）中。

公开(公告)号：US07173644B2

公开(公告)日：2007-02-06

申请号：US10786575

申请日：2004-02-23

申请人： Toshihiko Takakura

发明人： Toshihiko Takakura

IPC分类号： B41J15/14 ,  B41J27/00

CPC分类号： B41J2/451

摘要： An optical printhead includes a light source, a light guide, and a light collecting sheet. The light guide includes a light incident surface facing the light source and a flat light emitting surface extending in a primary scanning direction. The light collecting sheet faces the light emitting surface of the light guide and allows the passage of light emitted from the light emitting surface. The collecting sheet includes a prism layer formed with a plurality of ridges extending parallel to each other, and a base layer laminated on the prism layer. Diffused light rays emitted from the light emitting surface of the light guide pass through the light collecting sheet to become parallel rays.

摘要翻译： 光学打印头包括光源，光导和聚光片。 光导包括面向光源的光入射面和沿主扫描方向延伸的平坦发光面。 集光片面对导光体的发光面并允许从发光面发出的光的通过。 收集片包括形成有彼此平行延伸的多个脊的棱镜层和层叠在棱镜层上的基底层。 从导光体的发光面发射的扩散光线通过聚光片成为平行光线。

公开(公告)号：US20050062840A1

公开(公告)日：2005-03-24

申请号：US10786575

申请日：2004-02-23

申请人： Toshihiko Takakura

发明人： Toshihiko Takakura

IPC分类号： B41J2/445 ,  B41J2/45 ,  G02F1/13 ,  G02F1/13357 ,  G03G15/04 ,  B41J27/00

CPC分类号： B41J2/451

摘要： An optical printhead includes a light source, a light guide, and a light collecting sheet. The light guide includes a light incident surface facing the light source and a flat light emitting surface extending in a primary scanning direction. The light collecting sheet faces the light emitting surface of the light guide and allows the passage of light emitted from the light emitting surface. The collecting sheet includes a prism layer formed with a plurality of ridges extending parallel to each other, and a base layer laminated on the prism layer. Diffused light rays emitted from the light emitting surface of the light guide pass through the light collecting sheet to become parallel rays.

摘要翻译： 光学打印头包括光源，光导和聚光片。 光导包括面向光源的光入射面和沿主扫描方向延伸的平坦发光面。 集光片面对导光体的发光面并允许从发光面发出的光的通过。 收集片包括形成有彼此平行延伸的多个脊的棱镜层和层叠在棱镜层上的基底层。 从导光体的发光面发射的扩散光线通过聚光片成为平行光线。

公开(公告)号：US06501115B2

公开(公告)日：2002-12-31

申请号：US09988586

申请日：2001-11-20

申请人： Makoto Yoshida ,  Katsuyuki Asaka ,  Toshihiko Takakura

发明人： Makoto Yoshida ,  Katsuyuki Asaka ,  Toshihiko Takakura

IPC分类号： H01L2976

CPC分类号： H01L27/10894 ,  H01L21/76895 ,  H01L23/485 ,  H01L23/53223 ,  H01L27/10873 ,  H01L27/10885 ,  H01L2924/0002 ,  H01L2924/00

摘要： A plurality of first contact holes reaching an n+-type semiconductor area used as the source of a MISFET employed in a logic-DRAM mixture LSI and a plurality of second contact holes reaching another n+-type semiconductor area used as the drain of the MISFET are bored through an insulation layer created over a gate electrode of the MISFET. A conductive film on the same layer as a bit line shunts the n+-type semiconductor area used as the source through the first contact holes. Another conductive film shunts the n+-type semiconductor area used as the drain through the second contact holes.

公开(公告)号：US5141888A

公开(公告)日：1992-08-25

申请号：US642922

申请日：1991-01-18

申请人： Mikinori Kawaji ,  Toshihiko Takakura ,  Akihisa Uchida ,  Shigeo Kuroda ,  Yoichi Tamaki ,  Takeo Shiba ,  Kazuhiko Sagara ,  Masao Kawamura

发明人： Mikinori Kawaji ,  Toshihiko Takakura ,  Akihisa Uchida ,  Shigeo Kuroda ,  Yoichi Tamaki ,  Takeo Shiba ,  Kazuhiko Sagara ,  Masao Kawamura

IPC分类号： H01L21/762 ,  H01L21/763 ,  H01L29/732

CPC分类号： H01L21/763 ,  H01L21/76224 ,  H01L29/7325 ,  Y10S148/05

摘要： A bipolar type of semiconductor integrated circuit device is provided with U-shaped grooves which are formed by cutting a main surface of a semiconductor body to form isolation regions between bipolar transistors. A silicon oxide film can be formed in the U-shaped grooves by thermal oxidation simultaneously with the formation of a silicon oxide film used to form isolation regions between each collector contact region and base region. No separate step is needed for forming the silicon oxide film between the collector contact region and the base region. The thickness of the silicon oxide film can be controlled, and has a sufficient thickness even at its two edges, i.e., at its boundaries with the U-shaped grooves, so that the bipolar transistors exhibit good electrical characteristics. Namely, the collector resistance thereof does not increase, and the breakdown voltage at the pn junction between the collector region and the base region does not decrease. The U-shaped grooves can each comprise narrow and deep sub-grooves, with thick oxide films formed on the surfaces of the sub-grooves and a thick oxide film formed on a surface of an area between the sub-grooves, and with wiring formed on the oxide on the area between the sub-grooves.

公开(公告)号：US4907063A

公开(公告)日：1990-03-06

申请号：US51699

申请日：1987-05-20

申请人： Daisuke Okada ,  Akihisa Uchida ,  Toshihiko Takakura ,  Shinji Nakashima ,  Nobuhiko Ohno ,  Katsumi Ogiue

发明人： Daisuke Okada ,  Akihisa Uchida ,  Toshihiko Takakura ,  Shinji Nakashima ,  Nobuhiko Ohno ,  Katsumi Ogiue

IPC分类号： H01L21/31 ,  H01L21/331 ,  H01L21/76 ,  H01L21/763 ,  H01L29/73 ,  H01L29/732

CPC分类号： H01L21/763 ,  H01L21/76 ,  Y10S438/978

摘要： A semiconductor integrated circuit device is provided with polycrystalline silicon filling U-grooves etched in a semiconductor substrate to form isolation regions which prevent any short-circuiting between the polycrystalline silicon and electrodes or wiring formed on the semiconductor substrate. A silicon dioxide film is formed within the U-grooves, and a silicon nitride film and a silicon dioxide film are further formed thereon. The silicon nitride film has a high hardness which suppresses the development of crystal defects in the peripheral active regions due to the expansion of the surface of the polycrystalline silicon when it is oxidized. When the surface of the polycrystalline silicon is oxidized, the oxidation proceeds along the oxide film over the nitride film, so that the whole of the oxide film is formed thickly. Therefore, the silicon nitride film and the silicon dioxide film are provided with an increased margin against the etching used for forming contact holes.