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150 条记录 (耗时 0.047 秒)

    Video display device and external device
    31.
    发明授权
    Video display device and external device 有权
    视频显示设备和外部设备

    公开(公告)号：US08810737B1

    公开(公告)日：2014-08-19

    申请号：US14345884

    申请日：2011-12-28

    申请人： Takafumi Hayashi ,  Tsuyoshi Hasegawa ,  Masafumi Nishi

    发明人： Takafumi Hayashi ,  Tsuyoshi Hasegawa ,  Masafumi Nishi

    IPC分类号： H04N5/44 ,  G06F13/30

    CPC分类号： H04N5/4403 ,  H04N21/4221 ,  H04N21/485 ,  H04N2005/4408

    摘要： To a video display device, a remote control transmitter for remotely operating the video display device is attached. When at least one of predetermined keys provided in the remote control transmitter of an external device is operated, the video display device switches, according to the setting of an “input target”, the validness and the invalidness of an remote operation on the at least one of predetermined keys of the external device which outputs a video stream to the video display device.

    摘要翻译： 对于视频显示设备，附接有用于远程操作视频显示设备的遥控发射器。 当设置在外部设备的遥控发射器中的预定键中的至少一个被操作时，视频显示设备根据“输入目标”的设置，至少在远程操作的有效性和无效性 将视频流输出到视频显示装置的外部设备的预定键之一。

    6,7-unsaturated-7-carbamoyl substituted morphinan derivative
    32.
    发明授权
    6,7-unsaturated-7-carbamoyl substituted morphinan derivative 有权
    6,7-不饱和-7-氨甲酰基取代的吗啡喃衍生物

    公开(公告)号：US08536192B2

    公开(公告)日：2013-09-17

    申请号：US13308483

    申请日：2011-11-30

    申请人： Masanao Inagaki ,  Shin-ichiro Hara ,  Nobuhiro Haga ,  Yoshinori Tamura ,  Yoshihisa Goto ,  Tsuyoshi Hasegawa

    发明人： Masanao Inagaki ,  Shin-ichiro Hara ,  Nobuhiro Haga ,  Yoshinori Tamura ,  Yoshihisa Goto ,  Tsuyoshi Hasegawa

    IPC分类号： C07D489/00 ,  C07D489/08 ,  A01N43/42 ,  A61K31/44

    CPC分类号： C07D489/08

    摘要： A novel compound which is useful as an agent for treating and/or preventing emesis, vomiting and/or constipation.A compound represented by the formula (I): wherein R1 and R2 are each independently hydrogen, optionally substituted lower alkyl, optionally substituted lower alkenyl, optionally substituted cycloalkyl, optionally substituted aryl etc., R3 is hydrogen, hydroxy, optionally substituted lower alkyl, optionally substituted lower alkenyl, optionally substituted lower alkynyl, optionally substituted lower alkoxy etc., R4 is hydrogen or lower alkyl, R5 is hydrogen, lower alkyl, cycloalkyl lower alkyl or lower alkenyl, or a pharmaceutically acceptably salt, or a solvate thereof is provided.

    摘要翻译： 可用作治疗和/或预防呕吐，呕吐和/或便秘的药剂的新型化合物。 由式（I）表示的化合物：其中R 1和R 2各自独立地为氢，任选取代的低级烷基，任选取代的低级烯基，任选取代的环烷基，任选取代的芳基等，R 3为氢，羟基，任选取代的低级烷基， 提供任选取代的低级烯基，任选取代的低级炔基，任选取代的低级烷氧基等，R4是氢或低级烷基，R5是氢，低级烷基，环烷基低级烷基或低级烯基，或其药学上可接受的盐或其溶剂化物 。

    DISPLAY DEVICE
    34.
    发明申请
    DISPLAY DEVICE 审中-公开
    显示设备

    公开(公告)号：US20120188217A1

    公开(公告)日：2012-07-26

    申请号：US13348808

    申请日：2012-01-12

    申请人： Tsuyoshi Hasegawa

    发明人： Tsuyoshi Hasegawa

    IPC分类号： G09G5/00

    CPC分类号： G09G3/3406 ,  G09G2320/043 ,  G09G2320/048 ,  G09G2320/064

    摘要： A display device including a plurality of LEDs and driving the LEDs by supplying different currents to the LEDs comprises a control portion which performs control such that a current value of a current that is supplied to each of the LEDs is changed each time a predetermined period of time passes or each time a power supply of the display device is turned on.

    摘要翻译： 包括多个LED并通过向LED提供不同电流来驱动LED的显示装置包括控制部分，其执行控制，使得每次提供给每个LED的电流的电流值在每个LED的预定周期 每次显示设备的电源接通时，或每次打开显示设备的电源。

    Heat sink member and method of manufacturing the same
    35.
    发明授权
    Heat sink member and method of manufacturing the same 失效
    散热片及其制造方法

    公开(公告)号：US07776452B2

    公开(公告)日：2010-08-17

    申请号：US10566721

    申请日：2005-07-27

    申请人： Kazuhiro Shiomi ,  Masaaki Ishio ,  Tsuyoshi Hasegawa

    发明人： Kazuhiro Shiomi ,  Masaaki Ishio ,  Tsuyoshi Hasegawa

    IPC分类号： H01L23/373 ,  B32B15/20

    CPC分类号： H01L23/3735 ,  H01L2224/32 ,  H01L2224/83101 ,  Y10T428/12826 ,  Y10T428/12903

    摘要： A heat sink member capable of suppressing development of cracks and chaps in manufacturing, suppressing enlargement of a thermal expansion coefficient and suppressing lowering of thermal conductivity is obtained. This heat sink member comprises a ply member (1) mainly composed of Cu, a substrate (2) mainly composed of Mo and a brazing layer (4) consisting of an Sn—Cu alloy (Sn: 1 mass % to 13 mass %) arranged between the ply member and the substrate for bonding the ply member and the substrate to each other.

    摘要翻译： 获得能够抑制制造中的裂纹和裂纹的发展，抑制热膨胀系数的扩大和抑制导热性的降低的散热构件。 该散热构件包括主要由Cu构成的层构件（1），主要由Mo构成的基板（2）和由Sn-Cu合金（Sn：1质量％〜13质量％）构成的钎焊层（4） 布置在所述帘布层构件和所述基底之间，用于将所述帘布层构件和所述衬底彼此粘合。

    ATTACHING STRUCTURE OF COMPONENT FOR MOUNTING HEATING ELEMENT
    36.
    发明申请
    ATTACHING STRUCTURE OF COMPONENT FOR MOUNTING HEATING ELEMENT 审中-公开
    安装加热元件组件的连接结构

    公开(公告)号：US20100186939A1

    公开(公告)日：2010-07-29

    申请号：US12667275

    申请日：2008-12-10

    申请人： Tsuyoshi Hasegawa

    发明人： Tsuyoshi Hasegawa

    IPC分类号： F28F7/00

    CPC分类号： H01L23/3735 ,  H01L23/047 ,  H01L23/13 ,  H01L23/3677 ,  H01L2924/0002 ,  H01L2924/01079 ,  H01L2924/00

    摘要： The invention improves the heat radiation efficiency by improving the heat conduction efficiency after ensuring downsizing. A plurality of projections 15 are formed on a attaching surface of a base plate 10 and the base plate 10 is structured so as to be attached to a heat radiation member via a heat conduction sheet 18 formed by a softer material than that of the base plate 10.

    摘要翻译： 本发明通过在确保尺寸缩小之后提高热传导效率来提高散热效率。 在基板10的安装面上形成有多个突起15，并且基板10被构造成通过由比基板的软质材料形成的导热片18附着到散热构件 10。

    Semiconductor package
    37.
    发明授权
    Semiconductor package 有权
    半导体封装

    公开(公告)号：US07732916B2

    公开(公告)日：2010-06-08

    申请号：US12030504

    申请日：2008-02-13

    申请人： Tsuyoshi Hasegawa

    发明人： Tsuyoshi Hasegawa

    IPC分类号： H01L23/10 ,  H01L23/34

    CPC分类号： H01L23/427 ,  H01L2924/0002 ,  H01L2924/00

    摘要： A semiconductor package is provided with a package main body including a base portion configured by joining thin plates integrally, and a semiconductor device accommodating portion provided on one surface of the base portion, electric terminals electrically connected to a semiconductor device in the accommodating portion and exposed to an outer surface of the accommodating portion, and a heat high-transfer element including at least one layer-like member provided in the base portion. The layer-like member is configured independent of the base portion by a material having a thermal conductivity higher than that of the base portion, and extends from a position corresponding to a heat-generation site of the semiconductor device to a position in an outside of the heat-generation site corresponding position.

    摘要翻译： 半导体封装设置有封装主体，封装主体包括通过一体地连接薄板而构成的基部，以及设置在基部的一个表面上的半导体器件容纳部，电连接到容纳部中的半导体器件的露电 到所述容纳部的外表面，以及包括设置在所述基部中的至少一个层状构件的热传递元件。 层状构件通过具有比基部的导热率高的材料独立于基部构造，并且从对应于半导体器件的发热部位的位置延伸到位于 发热场地对应位置。

    OFDM receiving method and OFDM receiving apparatus
    38.
    发明授权
    OFDM receiving method and OFDM receiving apparatus 有权
    OFDM接收方法和OFDM接收装置

    公开(公告)号：US07693035B2

    公开(公告)日：2010-04-06

    申请号：US10792515

    申请日：2004-03-02

    申请人： Tsuyoshi Hasegawa ,  Takashi Dateki

    发明人： Tsuyoshi Hasegawa ,  Takashi Dateki

    IPC分类号： H04J11/00 ,  H04L12/28 ,  H04L27/00

    CPC分类号： H04L27/2662 ,  H04L5/026 ,  H04L25/0204 ,  H04L25/0224 ,  H04L27/2678 ,  H04L27/2695

    摘要： In an OFDM receiving apparatus for receiving a signal that has undergone Orthogonal Frequency Division Multiplexing (OFDM) and applying FFT processing to the receive signal to demodulate transmit data, an OFDM symbol comprising a fixed number of items of sample data is extracted from a receive signal, a position at which FFT processing of the OFDM symbol starts is shifted based upon the state of multipath and FFT processing is executed from the position to which the shift has been made. For example, a channel estimation value is obtained from result of FFT processing of known data contained in the receive signal, a multipath delay profile is obtained by applying FFT processing to this channel estimation value, and the position at which the FFT processing begins is decided based upon the position of a path for which power is maximized among the delay profiles.

    摘要翻译： 在接收正交频分复用（OFDM）的信号并对接收信号进行FFT处理以解调发送数据的OFDM接收装置中，从接收信号中提取包含固定数量的采样数据项的OFDM符号 根据多路径的状态，从进行移位的位置执行FFT符号的FFT处理开始位置的位置。 例如，从包含在接收信号中的已知数据的FFT处理的结果获得信道估计值，通过对该信道估计值应用FFT处理获得多径延迟分布，并且决定开始FFT处理的位置 基于在延迟分布中功率最大化的路径的位置。

    SEMICONDUCTOR PACKAGE AND SEMICONDUCTOR PACKAGE ASSEMBLY
    39.
    发明申请
    SEMICONDUCTOR PACKAGE AND SEMICONDUCTOR PACKAGE ASSEMBLY 有权
    半导体封装和半导体封装组件

    公开(公告)号：US20090072386A1

    公开(公告)日：2009-03-19

    申请号：US12274582

    申请日：2008-11-20

    申请人： Tsuyoshi Hasegawa

    发明人： Tsuyoshi Hasegawa

    IPC分类号： H01L23/473

    CPC分类号： H01L23/473 ,  H01L2924/0002 ,  H01L2924/00

    摘要： A semiconductor package includes a main body having a semiconductor device accommodating portion accommodating a basic circuit including a semiconductor device, external connection terminal members protruding outside the main body, and a cooling structure reducing heat generated by the device from the main body. The cooling structure includes a coolant flowing portion including a coolant supply port to which coolant is supplied, a coolant moving space which is positioned adjacent to the accommodating portion and in which the coolant moves in a back side of the basic circuit of the accommodating portion, and a coolant discharge port which discharges the coolant from the moving space. The semiconductor package assembly includes a package support body which supports the package and which includes a coolant circulation structure supplying coolant to the flowing portion of the main body through the supply port and collecting the supplied coolant through the discharge port.

    摘要翻译： 半导体封装包括具有容纳包括半导体器件的基本电路的半导体器件容纳部分和在主体外部突出的外部连接端子部件的主体，以及减少由该器件从主体产生的热量的冷却结构。 冷却结构包括冷却剂流动部分，冷却剂流动部分包括供应冷却剂的冷却剂供应口，冷却剂移动空间，其位于与容纳部分相邻的位置，并且冷却剂在容纳部分的基本回路的后侧移动， 以及从移动空间排出冷却剂的冷却剂排出口。 半导体封装组件包括支撑封装的封装支撑体，其包括冷却剂循环结构，冷却剂循环结构通过供应端口向主体的流动部分供应冷却剂，并通过排出口收集供应的冷却剂。