METROLOGY METHODS AND APPARATUS FOR NANOMATERIAL CHARACTERIZATION OF ENERGY STORAGE ELECTRODE STRUCTURES
    31.
    发明申请
    METROLOGY METHODS AND APPARATUS FOR NANOMATERIAL CHARACTERIZATION OF ENERGY STORAGE ELECTRODE STRUCTURES 失效
    能量储存电极结构的纳米材料特征的计量方法和装置

    公开(公告)号:US20100200403A1

    公开(公告)日:2010-08-12

    申请号:US12368105

    申请日:2009-02-09

    IPC分类号: C25D15/02 C25B11/10

    摘要: Embodiments described herein generally relate to methods and apparatus for forming an electrode structure used in an energy storage device. More particularly, embodiments described herein relate to methods and apparatus for characterizing nanomaterials used in forming high capacity electrode structures for energy storage devices. In one embodiment a process for forming an electrode structure for an energy storage device is provided. The process comprises depositing a columnar metal structure over a substrate at a first current density by a diffusion limited deposition process, measuring a capacitance of the columnar metal structure to determine a surface area of the columnar metal structure, and depositing three dimensional porous metal structures over the columnar metal structure at a second current density greater than the first current density.

    摘要翻译: 本文描述的实施例一般涉及用于形成在能量存储装置中使用的电极结构的方法和装置。 更具体地,本文描述的实施例涉及用于形成用于形成能量存储装置的高容量电极结构的纳米材料的方法和装置。 在一个实施例中,提供了一种用于形成用于能量存储装置的电极结构的方法。 该方法包括通过扩散限制沉积工艺在第一电流密度的衬底上沉积柱状金属结构,测量柱状金属结构的电容以确定柱状金属结构的表面积,并将三维多孔金属结构沉积在 所述柱状金属结构的第二电流密度大于所述第一电流密度。

    POROUS THREE DIMENSIONAL COPPER, TIN, COPPER-TIN, COPPER-TIN-COBALT, AND COPPER-TIN-COBALT-TITANIUM ELECTRODES FOR BATTERIES AND ULTRA CAPACITORS
    32.
    发明申请
    POROUS THREE DIMENSIONAL COPPER, TIN, COPPER-TIN, COPPER-TIN-COBALT, AND COPPER-TIN-COBALT-TITANIUM ELECTRODES FOR BATTERIES AND ULTRA CAPACITORS 失效
    电池和超电容器的多孔三维铜,锡,铜箔,铜 - 钴和铜 - 钴 - 钛电极

    公开(公告)号:US20100193365A1

    公开(公告)日:2010-08-05

    申请号:US12696422

    申请日:2010-01-29

    IPC分类号: C25D5/00 C25D17/00

    摘要: A method and apparatus for forming a reliable and cost efficient battery or electrochemical capacitor electrode structure that has an improved lifetime, lower production costs, and improved process performance are provided. In one embodiment a method for forming a three dimensional porous electrode for a battery or an electrochemical cell is provided. The method comprises depositing a columnar metal layer over a substrate at a first current density by a diffusion limited deposition process and depositing three dimensional metal porous dendritic structures over the columnar metal layer at a second current density greater than the first current density.

    摘要翻译: 提供了一种形成可靠且具有成本效益的电池或电化学电容器电极结构的方法和装置,其具有改善的寿命,降低生产成本和改进的工艺性能。 在一个实施例中,提供了一种用于形成用于电池或电化学电池的三维多孔电极的方法。 该方法包括通过扩散限制沉积工艺以第一电流密度在衬底上沉积柱状金属层,并以大于第一电流密度的第二电流密度在柱状金属层上沉积三维金属多孔树枝状结构。

    CARBON NANOTUBE FIBER WIRE FOR WAFER SLICING
    33.
    发明申请
    CARBON NANOTUBE FIBER WIRE FOR WAFER SLICING 审中-公开
    碳纳米管光纤丝

    公开(公告)号:US20090320819A1

    公开(公告)日:2009-12-31

    申请号:US12124372

    申请日:2008-05-21

    IPC分类号: B28D1/06 B26D1/547

    摘要: A wire saw for cutting hard materials includes a carbon nanotube fiber wire spun from carbon nanotubes. The carbon nanotube fiber wire may be made from a plurality of fibers, each fiber being spun from carbon nanotubes, the fibers being twisted together to form the wire. Furthermore, the wire may also include diamond particles, silicon carbide particles and/or extra carbon nanotubes to enhance the abrasive properties of the wire. A method is provided for slicing a silicon boule including: linearly translating a carbon nanotube fiber wire between rotating drums while maintaining the wire under tension; using a fixture, moving the silicon boule onto the moving tensioned wire, whereby the wire cuts into the silicon; delivering lubricating fluid to the surface of the silicon where contact is made with the wire; and collecting the lubricating fluid after it leaves the surface of the silicon.

    摘要翻译: 用于切割硬质材料的线锯包括从碳纳米管纺丝的碳纳米管纤维丝。 碳纳米管纤维线可以由多根纤维制成,每根纤维由碳纳米管纺丝,将纤维捻合在一起形成丝。 此外,导线还可以包括金刚石颗粒,碳化硅颗粒和/或额外的碳纳米管,以增强线的研磨性能。 提供了一种用于对硅棒进行切片的方法,包括:将碳纳米管纤维丝线线性地平移在旋转鼓之间,同时保持丝束处于张力下; 使用夹具将硅棒移动到移动的张紧线上,由此导线切入硅中; 将润滑流体输送到与导线接触的硅的表面; 并在润滑流体离开硅表面之后收集润滑流体。

    Method of achieving high productivity fault tolerant photovoltaic factory with batch array transfer robots
    34.
    发明授权
    Method of achieving high productivity fault tolerant photovoltaic factory with batch array transfer robots 失效
    用批量转移机器人实现高生产率容错光伏电站的方法

    公开(公告)号:US07640071B2

    公开(公告)日:2009-12-29

    申请号:US12212522

    申请日:2008-09-17

    IPC分类号: G06F19/00

    摘要: The present invention generally comprises a method for achieving fault tolerance in a PV FAB. A plurality of processing tools may be coupled together along a processing line, and a plurality of substantially identical processing lines may be arranged within the FAB. Whenever a processing tool within any processing line is shut-down, rather than shut-down the entire processing line containing the shut-down processing tool, work-pieces may be routed around the shut-down processing tool by transferring the work-pieces to an adjacent processing line within the FAB. At a location after the shut-down processing tool, the work-pieces may be transferred back to the processing line containing the shut-down processing tool. During the time period that the processing tool is shut-down, the other processing lines within the FAB may increase their throughput in order to maintain a substantially constant optimum throughput for the FAB over a given period of time.

    摘要翻译: 本发明通常包括用于实现PV FAB中的容错的方法。 多个处理工具可以沿着处理线耦合在一起,并且可以在FAB内布置多个基本相同的处理线。 每当任何处理线中的处理工具被关闭时,不是关闭包含关闭处理工具的整个处理线,所以工件可以通过将工件传送到关闭处理工具周围 FAB内的相邻处理线。 在关闭处理工具之后的位置,工件可以被传送回包含关闭处理工具的处理线。 在关闭处理工具的时间段内,FAB内的其他处理线可能增加其吞吐量,以便在给定的时间段内为FAB维持基本恒定的最佳吞吐量。

    METHODS AND APPARATUS FOR REDUCING THE CONSUMPTION OF REAGENTS IN ELECTRONIC DEVICE MANUFACTURING PROCESSES
    35.
    发明申请
    METHODS AND APPARATUS FOR REDUCING THE CONSUMPTION OF REAGENTS IN ELECTRONIC DEVICE MANUFACTURING PROCESSES 审中-公开
    减少电子设备制造过程中试剂消耗的方法和装置

    公开(公告)号:US20090017206A1

    公开(公告)日:2009-01-15

    申请号:US12140055

    申请日:2008-06-16

    IPC分类号: C23C16/44 C23C16/54

    CPC分类号: C23C16/4412 C23C16/45593

    摘要: A substrate coating system is provided which includes a substrate coating chamber; a gas box connected to the coating chamber and adapted to provide reagent gases to the coating chamber; and a reagent reclaim system connected to the substrate coating chamber and the gas box, wherein the reagent reclaim system includes a wet scrubber connected to the coating chamber; a polisher connected to the wet scrubber; and a dryer connected to the polisher and the gas box.

    摘要翻译: 提供了一种基材涂布系统,其包括基材涂布室; 连接到所述涂覆室并适于向所述涂覆室提供试剂气体的气体箱; 以及连接到所述基板涂覆室和所述气体箱的试剂回收系统,其中所述试剂回收系统包括连接到所述涂覆室的湿式洗涤器; 与湿式洗涤器连接的抛光机; 和连接到抛光机和气箱的干燥机。

    METHOD OF ACHIEVING HIGH PRODUCTIVITY FAULT TOLERANT PHOTOVOLTAIC FACTORY WITH BATCH ARRAY TRANSFER ROBOTS
    36.
    发明申请
    METHOD OF ACHIEVING HIGH PRODUCTIVITY FAULT TOLERANT PHOTOVOLTAIC FACTORY WITH BATCH ARRAY TRANSFER ROBOTS 失效
    利用批次阵列转移机器实现高生产能力的耐光玻璃工厂的方法

    公开(公告)号:US20080281457A1

    公开(公告)日:2008-11-13

    申请号:US11747583

    申请日:2007-05-11

    IPC分类号: G06F19/00

    摘要: The present invention generally comprises a method for achieving fault tolerance in a PV FAB. A plurality of processing tools may be coupled together along a processing line, and a plurality of substantially identical processing lines may be arranged within the FAB. Whenever a processing tool within any processing line is shut-down, rather than shut-down the entire processing line containing the shut-down processing tool, work-pieces may be routed around the shut-down processing tool by transferring the work-pieces to an adjacent processing line within the FAB. At a location after the shut-down processing tool, the work-pieces may be transferred back to the processing line containing the shut-down processing tool. During the time period that the processing tool is shut-down, the other processing lines within the FAB may increase their throughput in order to maintain a substantially constant optimum throughput for the FAB over a given period of time.

    摘要翻译: 本发明通常包括用于实现PV FAB中的容错的方法。 多个处理工具可以沿着处理线耦合在一起,并且可以在FAB内布置多个基本相同的处理线。 无论何时关闭任何处理线中的处理工具,而不是关闭包含关闭处理工具的整个处理线,工件可以通过将工件传送到关闭处理工具 FAB内的相邻处理线。 在关闭处理工具之后的位置,工件可以被传送回包含关闭处理工具的处理线。 在关闭处理工具的时间段内,FAB内的其他处理线可能增加其吞吐量,以便在给定的时间段内为FAB维持基本恒定的最佳吞吐量。

    Method for chemical-mechanical jet etching of semiconductor structures
    37.
    发明授权
    Method for chemical-mechanical jet etching of semiconductor structures 失效
    半导体结构的化学机械喷射蚀刻方法

    公开(公告)号:US07037854B2

    公开(公告)日:2006-05-02

    申请号:US10675031

    申请日:2003-09-30

    IPC分类号: H01L21/302

    摘要: A chemical-mechanical jet etching method rapidly removes large amounts of material in wafer thinning, or produces large-scale features on a silicon wafer, gallium arsenide substrate, or similar flat semiconductor workpiece, at etch rates in the range of 10–100 microns of workpiece thickness per minute. A nozzle or array of nozzles, optionally including a dual-orifice nozzle, delivers a high-pressure jet of machining etchant fluid to the surface of the workpiece. The machining etchant comprises a liquid or gas, carrying particulate material. The liquid may be a chemical etchant, or a solvent for a chemical etchant, if desired. The areas which are not to be etched may be shielded from the jet by a patterned mask, or the jet may be directed at areas from which material is to be removed, as in wafer thinning or direct writing, depending on the size of the desired feature or etched area.

    摘要翻译: 化学机械喷射蚀刻方法在硅片,砷化镓衬底或类似的平坦半导体工件上快速去除大量晶片薄化中的材料,或在10-100微米范围内的蚀刻速率下产生大尺寸特征 工件厚度每分钟。 可选地包括双孔喷嘴的喷嘴或喷嘴阵列将蚀刻剂流体的高压射流输送到工件的表面。 加工蚀刻剂包括携带颗粒材料的液体或气体。 如果需要,液体可以是化学蚀刻剂或化学蚀刻剂的溶剂。 不被蚀刻的区域可以通过图案化掩模与射流屏蔽,或者喷射可以被引导到要从中除去材料的区域,如在晶片变薄或直接写入中,这取决于所需的尺寸 特征或蚀刻区域。

    Large area substrate processing system
    38.
    发明授权
    Large area substrate processing system 失效
    大面积基板加工系统

    公开(公告)号:US06896513B2

    公开(公告)日:2005-05-24

    申请号:US10243158

    申请日:2002-09-12

    摘要: A system and method for processing large area substrates is provided. In one embodiment, a processing system includes a transfer chamber having at least one processing chamber and a substrate staging system coupled thereto. The staging system includes a load lock chamber having a first port coupled to the transfer chamber and a heat treating station coupled to a second port of the load lock chamber. A load lock robot is disposed in the load lock chamber to facilitate transfer between the heat treating station and the load lock chamber.

    摘要翻译: 提供了一种用于处理大面积基板的系统和方法。 在一个实施例中,处理系统包括具有至少一个处理室和与其耦合的衬底分级系统的传送室。 分级系统包括负载锁定室,其具有耦合到传送室的第一端口和耦合到负载锁定室的第二端口的热处理站。 负载锁定机器人设置在负载锁定室中以便于热处理站和负载锁定室之间的传送。

    Use of integrated polygen deposition and RTP for microelectromechanical systems
    39.
    发明授权
    Use of integrated polygen deposition and RTP for microelectromechanical systems 失效
    用于微机电系统的综合多基因沉积和RTP

    公开(公告)号:US06605319B1

    公开(公告)日:2003-08-12

    申请号:US10074277

    申请日:2002-02-11

    IPC分类号: C23C1622

    CPC分类号: C23C16/52 C23C16/56

    摘要: The method of the invention involves depositing a plurality of thin layers of film, each layer having a thickness ranging from about 500Å to about 2000Å. Low Pressure Chemical Vapor Deposition or other techniques known in the art maybe used to deposit each thin layer of film. The film is polysilicon or silicon-germanium, where the germanium content ranges from about 4% by weight to about 20% by weight germanium. A Rapid Thermal Anneal (“RTA”) is performed on a deposited thin film layer to relieve residual film stress in at least that film layer. The use of RTA rather than furnace annealing permits much shorter annealing times. Optionally, but advantageously, hydrogen may be present during RTA to permit the use of lower processing temperatures, typically about 20% lower relative to a customary anneal. A series of film deposition/rapid thermal anneal cycles is used to produce the desired, nominal total thickness polysilicon film. This method is generally useful for producing polysilicon films in the range of from about 2 microns to about 20 microns.

    摘要翻译: 本发明的方法包括沉积多层薄膜,各层的厚度范围为约500至约2000。 低压化学气相沉积或本领域已知的其它技术可以用于沉积每层薄膜。 该膜是多晶硅或硅 - 锗,其中锗含量为约4重量%至约20重量%的锗。 在沉积的薄膜层上进行快速热退火(“RTA”)以减轻至少该膜层中的残余膜应力。 使用RTA而不是炉退火允许更短的退火时间。 可选地,但是有利地,在RTA期间可能存在氢,以允许使用较低的加工温度,相对于常规退火,通常约为20%。 使用一系列膜沉积/快速热退火循环来产生所需的标称总厚度多晶硅膜。 该方法通常可用于生产在约2微米至约20微米范围内的多晶硅膜。