SYSTEM AND METHOD FOR DEPOSITING COATINGS ON INNER SURFACE OF TUBULAR STRUCTURE
    32.
    发明申请
    SYSTEM AND METHOD FOR DEPOSITING COATINGS ON INNER SURFACE OF TUBULAR STRUCTURE 审中-公开
    用于在管状结构的内表面沉积涂层的系统和方法

    公开(公告)号:US20110111132A1

    公开(公告)日:2011-05-12

    申请号:US12939248

    申请日:2010-11-04

    IPC分类号: C23C14/02 B29C71/04

    摘要: A system and method for depositing coatings on an inner surface of a tubular structure includes at least one pump for creating and maintaining a vacuum in the tubular structure, a meshed electrode adapted to be positioned in a center of the tubular structure, and a biased voltage power supply connected to the meshed electrode. The biased voltage power supply is adapted to apply a negative voltage to the meshed electrode such that the negative voltage causes a hollow cathode discharge inside the meshed electrode. The creation of the hollow cathode discharge causes ions to be drawn out of a mesh on the meshed electrode and accelerate onto an inner surface of the tubular structure, thereby coating the inner surface with a desired coating.

    摘要翻译: 用于在管状结构的内表面上沉积涂层的系统和方法包括至少一个用于在管状结构中产生和保持真空的泵,适于定位在管状结构的中心的网状电极和偏置电压 电源连接到网状电极。 偏置电压电源适于向网状电极施加负电压,使得负电压在网状电极内部引起空心阴极放电。 空心阴极放电的产生导致离子从网状电极上的网状物拉出并加速到管状结构的内表面上,从而以期望的涂层涂覆内表面。

    Processing Tubular Surfaces Using Double Glow Discharge
    33.
    发明申请
    Processing Tubular Surfaces Using Double Glow Discharge 有权
    使用双辉光放电处理管状表面

    公开(公告)号:US20100006421A1

    公开(公告)日:2010-01-14

    申请号:US12169837

    申请日:2008-07-09

    申请人: Ronghua Wei

    发明人: Ronghua Wei

    IPC分类号: C23C14/34

    摘要: A method of sputtering a component includes positioning a conductive substrate into a vacuum chamber, wherein the conductive substrate is tubular and has a surface. A source electrode including a source material may be inserted into the conductive substrate. A first bias voltage ΔVac1 may be applied between the conductive substrate and the vacuum chamber and a second bias voltage ΔVas1 may be applied between the source electrode and the vacuum chamber, sputtering the source material onto the conductive substrate.

    摘要翻译: 溅射部件的方法包括将导电基板定位到真空室中,其中导电基板是管状的并具有表面。 可以将包括源材料的源电极插入到导电基板中。 可以在导电基板和真空室之间施加第一偏置电压DeltaVac1,并且可以在源电极和真空室之间施加第二偏置电压DeltaVas1,将源材料溅射到导电基板上。

    Magnetron sputtering apparatus and method for depositing a coating using same
    34.
    发明授权
    Magnetron sputtering apparatus and method for depositing a coating using same 有权
    磁控管溅射装置和使用其沉积涂层的方法

    公开(公告)号:US07520965B2

    公开(公告)日:2009-04-21

    申请号:US10963341

    申请日:2004-10-12

    申请人: Ronghua Wei

    发明人: Ronghua Wei

    IPC分类号: C23C14/35

    摘要: A method for depositing a coating using a magnetron sputtering apparatus and a magnetron sputtering apparatus comprising: a support structure comprising a hollowed shaft comprising a central conduit having a longitudinal axis; a sputter target material defining a bore which is external to the central conduit, the bore also having the longitudinal axis a magnet assembly supported about the support structure, the magnet assembly having a first end, a second end, and a plurality of magnets supported therebetween and being effective, upon rotation, to generate a circumferential external magnetic field about the sputter target material; a first sealed end extending radially inward from adjacent the sputter target material proximate the first end of the magnet assembly and a second sealed end extending radially inward from adjacent the sputter target material proximate the second end of the magnet assembly, wherein the first sealed end, the second sealed end, and the sputter target material seal the magnet assembly therebetween; a cooling system comprising one or more coolant passage extending through the magnet assembly, the central conduit comprising a coolant inlet and a coolant outlet at the first sealed end; and, one or more rotors supported about the support structure and rotatable therewith by coolant passing through the one or more coolant passages.

    摘要翻译: 一种使用磁控溅射装置和磁控管溅射装置沉积涂层的方法,包括:支撑结构,其包括中空轴,所述中空轴包括具有纵向轴线的中心导管; 限定在中心导管外部的孔的溅射靶材料,所述孔还具有围绕所述支撑结构支撑的所述纵向轴线的磁体组件,所述磁体组件具有第一端部,第二端部和在其间支撑的多个磁体 并且在旋转时有效地围绕溅射靶材料产生周向的外部磁场; 靠近所述磁体组件的第一端处从所述溅射靶材料附近径向向内延伸的第一密封端和靠近所述磁体组件的所述第二端处从所述溅射靶材料的附近径向向内延伸的第二密封端,其中所述第一密封端, 第二密封端,并且溅射靶材料将磁体组件密封在其间; 冷却系统,包括延伸穿过所述磁体组件的一个或多个冷却剂通道,所述中心导管包括在所述第一密封端处的冷却剂入口和冷却剂出口; 并且一个或多个转子支撑在支撑结构上并且随着通过一个或多个冷却剂通道的冷却剂随之旋转。

    Method and apparatus for forming a nitride layer on a biomedical device
    35.
    发明授权
    Method and apparatus for forming a nitride layer on a biomedical device 有权
    在生物医学装置上形成氮化物层的方法和装置

    公开(公告)号:US07261914B2

    公开(公告)日:2007-08-28

    申请号:US10811485

    申请日:2004-03-26

    IPC分类号: B05D3/06

    摘要: This invention is a method of forming a nitride layer on at least one metal or metal alloy biomedical device, comprising: providing a vacuum chamber with at least one biomedical device positioned thereon on a worktable within the vacuum chamber; reducing the pressure in the vacuum chamber; introducing nitrogen into the vacuum chamber so that the pressure in the vacuum chamber is about 0.01 to about 10 milli-Torr; generating electrons within the vacuum chamber to form positively charged nitrogen ions; providing a negative bias to the worktable so that the positively charged nitrogen ions contact the biomedical devices under conditions such that a nitride layer forms on the at least one prosthetic device.

    摘要翻译: 本发明是一种在至少一种金属或金属合金生物医学装置上形成氮化物层的方法,其包括:在真空室内的工作台上提供具有至少一个生物医学装置的真空室; 降低真空室内的压力; 将氮气引入真空室,使得真空室中的压力为约0.01至约10毫乇; 在真空室内产生电子以形成带正电的氮离子; 向工作台提供负偏压,使得带正电的氮离子在使得在至少一个假肢装置上形成氮化物层的条件下接触生物医学装置。

    Apparatus and method for metal plasma immersion ion implantation and metal plasma immersion ion deposition
    37.
    发明申请
    Apparatus and method for metal plasma immersion ion implantation and metal plasma immersion ion deposition 审中-公开
    金属等离子体浸没离子注入和金属等离子体浸没离子沉积的装置和方法

    公开(公告)号:US20050061251A1

    公开(公告)日:2005-03-24

    申请号:US10932925

    申请日:2004-09-02

    摘要: This invention is a method for metal plasma ion implantation and metal plasma ion deposition, comprising: providing a vacuum chamber with at least one workpiece having a surface positioned on a worktable within the vacuum chamber; reducing the pressure in the vacuum chamber; generating a plasma of metal ions within the vacuum chamber, applying a negative bias to the worktable to thereby accelerate metal ions from the plasma toward at least one workpiece to thereby either implant metal ions into or deposit metal ions onto the workpiece or both. This invention includes an apparatus for metal ion implantation and metal ion plasma deposition, comprising: a vacuum chamber, a metal plasma generator within the vacuum chamber, and at least one worktable within the vacuum chamber.

    摘要翻译: 本发明是一种用于金属等离子体离子注入和金属等离子体离子沉积的方法,包括:提供具有至少一个工件的真空室,所述工件具有位于所述真空室内的工作台上的表面; 降低真空室内的压力; 在真空室内产生金属离子等离子体,向工作台施加负偏压,从而将金属离子从等离子体加速至至少一个工件,从而将金属离子注入或将金属离子沉积到工件上或两者上。 本发明包括一种用于金属离子注入和金属离子等离子体沉积的装置,包括:真空室,真空室内的金属等离子体发生器和真空室内的至少一个工作台。

    Method and apparatus of plasma-enhanced coaxial magnetron for sputter-coating interior surfaces

    公开(公告)号:US06767436B2

    公开(公告)日:2004-07-27

    申请号:US10256151

    申请日:2002-09-25

    申请人: Ronghua Wei

    发明人: Ronghua Wei

    IPC分类号: C23C1434

    摘要: A plasma-enhanced coaxial magnetron sputter-cleaning and coating assembly for sputter-cleaning and coating the interior surfaces of a cylindrical workpiece is provided. The apparatus sputter-coats the workpiece using a cylindrical sputtering material, the material having an interior and an exterior. The apparatus includes a core cooling system surrounded by a ring magnet assembly including a plurality of axially aligned ring magnets, with the core cooling system and the ring magnet assembly axially aligned with, and residing in the interior of, the cylindrical sputtering material. A cylindrical-shaped filament circumferentially surrounds the exterior of the cylindrical sputtering material. An anode comprised of a wire screen circumferentially surrounds, and is external to the filament; whereby the apparatus for plasma-enhanced coaxial magnetron sputter-cleaning and coating may be housed inside the workpiece in order to sputter-clean and coat the interior of the workpiece.