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38 条记录 (耗时 0.018 秒)

    Method for magnetron sputter deposition
    2.
    发明申请
    Method for magnetron sputter deposition 有权
    磁控溅射沉积方法

    公开(公告)号：US20060251917A1

    公开(公告)日：2006-11-09

    申请号：US11397878

    申请日：2006-04-04

    申请人： Kuang-Tsan Chiang ,  Ronghua Wei ,  Edward Langa

    发明人： Kuang-Tsan Chiang ,  Ronghua Wei ,  Edward Langa

    IPC分类号： C23C14/32 ,  B32B15/20

    CPC分类号： C23C14/046 ,  C23C14/165 ,  C23C14/225 ,  C23C14/352 ,  C23C14/355 ,  H01J37/3405 ,  Y10T428/12903

    摘要： A method for depositing a nanostructured coating comprising chromium or a copper-chromium mixture on a workpiece. The workpiece may comprise a hollowed structure such as a rocket or jet engine combustion chamber liner. The method comprises providing a magnetron and an external sputter target material comprising chromium or a copper-chromium composite and effecting a magnetron sputter deposition to deposit a substantially uniform nanostructured coating comprising said sputter target material on said workpiece. The method may include plasma enhancement wherein a filament is utilized to produce a plasma that effects an ion bombardment on the workpiece during the magnetron sputter deposition process. The invention also includes the nanostructured coatings deposited by these methods and workpieces coated thereby.

    摘要翻译： 一种在工件上沉积包含铬或铜 - 铬混合物的纳米结构涂层的方法。 工件可以包括中空结构，例如火箭或喷气式发动机燃烧室衬套。 该方法包括提供磁控管和包含铬或铜 - 铬复合材料的外部溅射靶材料，并进行磁控溅射沉积，以将包含所述溅射靶材料的基本均匀的纳米结构涂层沉积在所述工件上。 该方法可以包括等离子体增强，其中使用丝来产生在磁控溅射沉积工艺期间对工件进行离子轰击的等离子体。 本发明还包括通过这些方法沉积的纳米结构涂层和由此涂覆的工件。

    Method for depositing coatings on the interior surfaces of tubular structures
    3.
    发明授权
    Method for depositing coatings on the interior surfaces of tubular structures 有权
    在管状结构的内表面上沉积涂层的方法

    公开(公告)号：US07052736B2

    公开(公告)日：2006-05-30

    申请号：US10807039

    申请日：2004-03-23

    申请人： Ronghua Wei ,  Christopher Rincon ,  James Arps

    发明人： Ronghua Wei ,  Christopher Rincon ,  James Arps

    IPC分类号： B05D7/22 ,  C23C14/22

    CPC分类号： B05D7/22 ,  B05D1/62 ,  B05D7/52 ,  B05D2254/04 ,  F41A21/04 ,  Y10T428/13

    摘要： A method is disclosed for substantially uniformly coating an interior surface of a ferromagnetic tubular structure such as a ferromagnetic tube having a high aspect ratio. The method entails inducing a magnetic field of a given magnitude within the tubular structure. Further, a bias is applied at a given voltage to the tubular structure. Then, the interior surface of the tubular structure is exposed to a gaseous precursor material under conditions effective to convert a quantity of the gaseous precursor material to ionize gaseous precursor material. The given magnitude and voltage is such that it is effective to deposit the ionized the gaseous precursor material onto the interior surface and converts the ionized gaseous precursor material to a substantially uniform protective coating in the interior surface.

    摘要翻译： 公开了一种基本上均匀地涂覆铁磁管状结构的内表面的方法，例如具有高纵横比的铁磁管。 该方法需要在管状结构内引起给定量值的磁场。 此外，在给定电压下施加偏压到管状结构。 然后，管状结构的内表面在有效地将一定量的气态前体材料转化成电离气态前体材料的条件下暴露于气态前体材料。 给定的量值和电压使得将离子化的气态前体材料沉积到内表面上并将离子化的气态前体材料转化成内表面中基本均匀的保护涂层是有效的。

    Method for depositing coatings on the interior surfaces of tubular walls
    4.
    发明授权
    Method for depositing coatings on the interior surfaces of tubular walls 有权
    在管壁内表面上沉积涂层的方法

    公开(公告)号：US06764714B2

    公开(公告)日：2004-07-20

    申请号：US10167189

    申请日：2002-06-11

    申请人： Ronghua Wei ,  Christopher Rincon ,  James Arps

    发明人： Ronghua Wei ,  Christopher Rincon ,  James Arps

    IPC分类号： C23C1606

    CPC分类号： F41A21/04 ,  B05D1/62 ,  B05D7/22 ,  B05D7/52 ,  B05D2254/04 ,  Y10T428/30

    摘要： Methods for coating the interior surface of tubular structures having high aspect ratios and tubular structures produced by such methods. The interior surface of the tubular structure is coated by inducing a magnetic field having a given magnitude around a circumference along a length of the tubular structure, applying a bias at a given voltage to the tubular structure, and exposing the interior surface to a precursor material to deposit the precursor material onto the interior surface of the tubular structure.

    摘要翻译： 用于涂覆具有高纵横比的管状结构的内表面的方法和通过这些方法制造的管状结构。 管状结构的内表面通过沿管状结构的长度诱导围绕圆周具有给定大小的磁场，将给定电压的偏压施加到管状结构，并将内表面暴露于前体材料 以将前体材料沉积到管状结构的内表面上。

    Apparatus and method for metal plasma immersion ion implantation and metal plasma immersion ion deposition
    6.
    发明申请
    Apparatus and method for metal plasma immersion ion implantation and metal plasma immersion ion deposition 审中-公开
    金属等离子体浸没离子注入和金属等离子体浸没离子沉积的装置和方法

    公开(公告)号：US20050061251A1

    公开(公告)日：2005-03-24

    申请号：US10932925

    申请日：2004-09-02

    申请人： Ronghua Wei ,  Thomas Booker ,  Christopher Rincon ,  James Arps

    发明人： Ronghua Wei ,  Thomas Booker ,  Christopher Rincon ,  James Arps

    IPC分类号： C23C14/00 ,  C23C14/26 ,  C23C14/30 ,  C23C14/32 ,  C23C14/48 ,  C23C16/00 ,  H01J37/32

    CPC分类号： C23C14/48 ,  C23C14/26 ,  C23C14/30 ,  C23C14/32 ,  H01J37/32412

    摘要： This invention is a method for metal plasma ion implantation and metal plasma ion deposition, comprising: providing a vacuum chamber with at least one workpiece having a surface positioned on a worktable within the vacuum chamber; reducing the pressure in the vacuum chamber; generating a plasma of metal ions within the vacuum chamber, applying a negative bias to the worktable to thereby accelerate metal ions from the plasma toward at least one workpiece to thereby either implant metal ions into or deposit metal ions onto the workpiece or both. This invention includes an apparatus for metal ion implantation and metal ion plasma deposition, comprising: a vacuum chamber, a metal plasma generator within the vacuum chamber, and at least one worktable within the vacuum chamber.

    摘要翻译： 本发明是一种用于金属等离子体离子注入和金属等离子体离子沉积的方法，包括：提供具有至少一个工件的真空室，所述工件具有位于所述真空室内的工作台上的表面; 降低真空室内的压力; 在真空室内产生金属离子等离子体，向工作台施加负偏压，从而将金属离子从等离子体加速至至少一个工件，从而将金属离子注入或将金属离子沉积到工件上或两者上。 本发明包括一种用于金属离子注入和金属离子等离子体沉积的装置，包括：真空室，真空室内的金属等离子体发生器和真空室内的至少一个工作台。

    Processing tubular surfaces using double glow discharge
    7.
    发明授权
    Processing tubular surfaces using double glow discharge 有权
    使用双辉光放电加工管状表面

    公开(公告)号：US09175381B2

    公开(公告)日：2015-11-03

    申请号：US12169837

    申请日：2008-07-09

    申请人： Ronghua Wei

    发明人： Ronghua Wei

    IPC分类号： C23C14/34 ,  C23C14/16 ,  C23C14/54 ,  C23C14/48 ,  C23C14/04

    CPC分类号： C23C14/345 ,  C23C14/046 ,  C23C14/16 ,  C23C14/165 ,  C23C14/48 ,  C23C14/541

    摘要： A method of sputtering a component includes positioning a conductive substrate into a vacuum chamber, wherein the conductive substrate is tubular and has a surface. A source electrode including a source material may be inserted into the conductive substrate. A first bias voltage ΔVac1 may be applied between the conductive substrate and the vacuum chamber and a second bias voltage ΔVas1 may be applied between the source electrode and the vacuum chamber, sputtering the source material onto the conductive substrate.

    摘要翻译： 溅射部件的方法包括将导电基板定位到真空室中，其中导电基板是管状的并具有表面。 可以将包括源材料的源电极插入到导电基板中。 可以在导电基板和真空室之间施加第一偏置电压＆amp; Vac1，并且可以在源电极和真空室之间施加第二偏压＆Dgr; Vas1，将源材料溅射到导电基板上。