公开(公告)号：US20120007470A1

公开(公告)日：2012-01-12

申请号：US13231144

申请日：2011-09-13

申请人： Kazuaki KURIHARA ,  Shigeyoshi Umemiya ,  Tsuyoshi Aoki

发明人： Kazuaki KURIHARA ,  Shigeyoshi Umemiya ,  Tsuyoshi Aoki

IPC分类号： H02N2/18

CPC分类号： H01L41/1136 ,  H02N2/186

摘要： A piezoelectric generating apparatus includes a plurality of piezoelectric bodies arranged at intervals via a gap. Each of the plurality of piezoelectric bodies includes a fixed end and a free end. A first surface electrode is formed on one side of each of the plurality of piezoelectric bodies, and a second surface electrode is formed on an opposite side of each of the plurality of piezoelectric bodies. A weight spans the plurality of piezoelectric bodies and attached to the free ends of the plurality of piezoelectric bodies. The plurality of piezoelectric bodies are curved upon application of acceleration to the weight from the outside in a lateral direction.

摘要翻译： 一种压电发生装置，包括经由间隙间隔设置的多个压电体。 多个压电体中的每一个包括固定端和自由端。 第一表面电极形成在多个压电体中的每一个的一侧上，并且第二表面电极形成在多个压电体中的每一个的相对侧上。 重物跨越多个压电体并附着到多个压电体的自由端。 多个压电体在横向上从外部施加加速度而弯曲。

公开(公告)号：US20100073823A1

公开(公告)日：2010-03-25

申请号：US12560901

申请日：2009-09-16

申请人： Tsuyoshi Aoki ,  Kazuaki Kurihara ,  Shigeyoshi Umemiya

发明人： Tsuyoshi Aoki ,  Kazuaki Kurihara ,  Shigeyoshi Umemiya

IPC分类号： G11B21/24 ,  H01L41/047

CPC分类号： G11B5/6005 ,  H01L41/0475 ,  H01L41/0993 ,  H01L41/257

摘要： A piezoelectric actuator includes a piezoelectric body; a first and a second electrode for applying an electric field to the piezoelectric body in order to polarize the piezoelectric body in a first direction at an elevated temperature, at least one of the first and the second electrode including a material whose resistivity decreases with elevation of the temperature; and a third and a fourth electrode for applying an electric field to the piezoelectric body in a second direction across the first direction of the polarization of the piezoelectric body in order to actuate the piezoelectric body.

摘要翻译： 压电致动器包括压电体; 第一和第二电极，用于向压电体施加电场，以便在升高的温度下使第一方向上的压电体极化，所述第一和第二电极中的至少一个电极包括其电阻率随着 气温; 以及第三和第四电极，用于在压电体的偏振的第一方向上沿着第二方向向压电体施加电场，以便致动压电体。

公开(公告)号：US07682124B2

公开(公告)日：2010-03-23

申请号：US11375360

申请日：2006-03-14

申请人： Eiji Miyazaki ,  Shuichi Takeshita ,  Tsuyoshi Aoki

发明人： Eiji Miyazaki ,  Shuichi Takeshita ,  Tsuyoshi Aoki

IPC分类号： E02F3/36

CPC分类号： E02F3/384 ,  E02F9/2267 ,  E02F9/2271 ,  E02F9/2275 ,  Y10S414/131

摘要： A tractor with a backhoe is disclosed. The backhoe is mounted to a rear portion of the tractor. The backhoe has a boom, an arm pivotally supported to a leading end of the boom, a bucket pivotally supported to a leading end of the arm, a boom cylinder for operating the boom, an arm cylinder for operating the arm and a bucket cylinder for operating the bucket. The tractor includes a frame attached to a rear portion of the tractor, a swing bracket supported to a rear portion of the frame to be pivotable about a vertical axis, a control valve unit having control valves for controlling the boom cylinder, the arm cylinder and the bucket cylinder and a hose unit for feeding pressure oil from the control valve unit to the boom cylinder, the arm cylinder and the bucket cylinder. The wing bracket includes a first opening open to the front side and a second opening open to the rear side. The control valve unit is disposed, in its plan view, on an extension line of the first opening and the second opening. The hose unit extends substantially linearly from the control valve unit through the first opening to the second opening.

摘要翻译： 公开了具有反铲的拖拉机。 该反铲装置安装在拖拉机的后部。 该反铲具有悬臂，枢转地支撑在起重臂的前端的臂，可枢转地支撑在臂的前端的铲斗，用于操作动臂的动臂缸，用于操作臂的斗杆缸和用于 操作桶。 拖拉机包括安装在拖拉机后部的框架，支撑在框架后部以绕垂直轴线转动的摆动支架，具有用于控制起重臂液压缸，臂缸和 铲斗缸和用于将压力油从控制阀单元输送到动臂缸，斗杆缸和铲斗缸的软管单元。 翼支架包括向前侧开口的第一开口和向后侧开口的第二开口。 控制阀单元在其平面图中设置在第一开口和第二开口的延伸线上。 软管单元从控制阀单元基本线性地延伸穿过第一开口至第二开口。

公开(公告)号：US07650174B2

公开(公告)日：2010-01-19

申请号：US11594778

申请日：2006-11-09

申请人： Tsuyoshi Aoki ,  Kazuaki Kurihara ,  Teru Nakanishi ,  Akihiko Akasegawa ,  Manabu Kai ,  Kazunori Yamanaka

发明人： Tsuyoshi Aoki ,  Kazuaki Kurihara ,  Teru Nakanishi ,  Akihiko Akasegawa ,  Manabu Kai ,  Kazunori Yamanaka

IPC分类号： H01P1/203 ,  H01B12/02

CPC分类号： H01P1/20381

摘要： A resonator pattern made of superconductive material is disposed over a first surface of a base substrate made of dielectric. An adjustment substrate made of dielectric is disposed facing the first surface at a distance from the first surface. The adjustment substrate is supported by a support mechanism for supporting the adjustment substrate in such a manner capable of changing an angle between the first surface and a surface of the adjustment substrate facing the base substrate. A superconductive filter is provided which can shift a center frequency of a filter band and suppress disturbance of a waveform of a filter characteristic, with a simple method.

摘要翻译： 由超导材料制成的谐振器图案设置在由电介质制成的基底基板的第一表面上。 由电介质构成的调整用基板相对于第一面设置成与第一面相距一定距离。 调整基板由用于支撑调整基板的支撑机构支撑，该支撑机构能够改变第一表面与面向基底基板的调整基板的表面之间的角度。 提供了一种可以通过简单的方法移动滤波器频带的中心频率并抑制滤波器特性波形的干扰的超导滤波器。

公开(公告)号：US20090219653A1

公开(公告)日：2009-09-03

申请号：US12395161

申请日：2009-02-27

申请人： Tsuyoshi Aoki ,  Kazuaki Kurihara ,  Shigeyoshi Umemiya

发明人： Tsuyoshi Aoki ,  Kazuaki Kurihara ,  Shigeyoshi Umemiya

IPC分类号： G11B5/56 ,  B05D5/12

CPC分类号： G11B5/5552 ,  G11B5/56

摘要： A head slider includes a slider substrate, an actuator provided in an end portion of the slider substrate and equipped with a piezoelectric element, and a magnetic head disposed on a side opposite to the slider substrate with interposition of the actuator. The piezoelectric element has piezoelectric bodies polarized along a first direction connecting the slider substrate and the magnetic head. The piezoelectric element has electrodes which apply an electric field to the piezoelectric bodies along a second direction intersecting the first direction.

摘要翻译： 磁头滑动器包括滑块基板，设置在滑块基板的端部并配备有压电元件的致动器，以及设置在与滑块基板相对的一侧的磁头，插入致动器。 压电元件具有沿连接滑块基板和磁头的第一方向偏振的压电体。 压电元件具有沿着与第一方向交叉的第二方向向压电体施加电场的电极。

公开(公告)号：US20080180849A1

公开(公告)日：2008-07-31

申请号：US12008872

申请日：2008-01-15

申请人： Shigeyoshi Umemiya ,  Masaharu Hida ,  Masao Kondo ,  Tsuyoshi Aoki

发明人： Shigeyoshi Umemiya ,  Masaharu Hida ,  Masao Kondo ,  Tsuyoshi Aoki

IPC分类号： G11B5/48 ,  H01L41/24

CPC分类号： G11B5/4826 ,  G11B5/4873 ,  H01L41/094 ,  H01L41/1876 ,  H01L41/316 ,  H01L41/332 ,  Y10T29/42

摘要： According to an aspect of an embodiment, a method for manufacturing a magnetic head support having a piezoelectric device on a metal plate member comprises the steps of: providing a metal plate member; forming a piezoelectric layer of a piezoelectric material on the plate member at an elevated temperature; forming a first electrode layer of an electrical conducting material on the piezoelectric layer; and bending the metal plate member at a bending portion adjacent to the piezoelectric layer while the temperature is lowered from the elevated temperature after forming the piezoelectric layer.

摘要翻译： 根据实施例的一个方面，一种用于制造在金属板构件上具有压电装置的磁头支撑件的方法包括以下步骤：提供金属板构件; 在升高的温度下在所述板构件上形成压电材料的压电层; 在所述压电层上形成导电材料的第一电极层; 以及在形成压电层之后，从升高的温度降低温度的同时，在与压电体层相邻的弯曲部弯曲金属板部件。

公开(公告)号：US20080039579A1

公开(公告)日：2008-02-14

申请号：US11658093

申请日：2005-07-20

申请人： Yoshiharu Kimura ,  Zhen Tang ,  Kazuki Fukushima ,  Kiyotsuna Toyohara ,  Ryuji Nonokawa ,  Yasuhito Maeda ,  Masayuki Takada ,  Yuka Komazawa ,  Tsuyoshi Aoki

发明人： Yoshiharu Kimura ,  Zhen Tang ,  Kazuki Fukushima ,  Kiyotsuna Toyohara ,  Ryuji Nonokawa ,  Yasuhito Maeda ,  Masayuki Takada ,  Yuka Komazawa ,  Tsuyoshi Aoki

IPC分类号： C08G63/08 ,  C08K7/02 ,  C08L31/02

CPC分类号： C08G63/08 ,  C08G63/06 ,  C08J5/045 ,  C08J2367/04

摘要： It is an object of the present invention to provide polylactic acid containing a stereocomplex crystal and having excellent moldability, a high molecular weight, high crystallinity and a high melting point and a process for manufacturing the same. It is another object of the present invention to provide a composition comprising the polylactic acid and a molded product of the polylactic acid. The present invention is characterized from polylactic acid having a weight average molecular weight of 80,000 to 500,000 and a melting peak at 195° C. or higher which accounts for 80% or more of the total of melting peaks in the temperature elevation step when measured by a differential scanning calorimeter (DSC) and a process for manufacturing the same.

摘要翻译： 本发明的目的是提供含有立体络合物晶体的聚乳酸，并且具有优异的成型性，高分子量，高结晶度和高熔点及其制造方法。 本发明的另一个目的是提供包含聚乳酸和聚乳酸的模塑产品的组合物。 本发明的特征在于重均分子量为80,000〜500,000的聚乳酸和195℃以上的熔融峰，当温度升高步骤中的熔融峰的总量为80％以上时，其通过 差示扫描量热计（DSC）及其制造方法。

公开(公告)号：US20050069274A1

公开(公告)日：2005-03-31

申请号：US10990983

申请日：2004-11-18

申请人： Tsuyoshi Aoki ,  Masayuki Kato ,  Yasuo Yamagishi ,  Tomoyuki Akahoshi ,  Nawalage Cooray ,  Mamoru Kurashina

发明人： Tsuyoshi Aoki ,  Masayuki Kato ,  Yasuo Yamagishi ,  Tomoyuki Akahoshi ,  Nawalage Cooray ,  Mamoru Kurashina

IPC分类号： G02B6/30 ,  G02B6/42 ,  G02B6/10

CPC分类号： G02B6/30 ,  G02B6/4226 ,  G02B6/4239

摘要： An optoelectronic component is mounted at a precise position on a waveguide substrate so as to reduce loss in propagating light, and electrically connect electrodes on the waveguide substrate and the optoelectronic component. The waveguide substrate has an optical waveguide and a recessed portion for mounting the optoelectronic component, and electrodes are arranged on the recessed portion. A great number of globular elastic conductive particles are distributed on the bottom surface of the recessed portion. Thereafter, the optoelectronic component is placed in the recessed portion so as to press the globular elastic conductive particles, and alignment between the optical waveguide in the waveguide substrate and an optical waveguide in the optoelectronic component is adjusted. Then, the optoelectronic component is fixed to the waveguide substrate with an optical adhesive while the alignment is precisely adjusted.

摘要翻译： 光电子部件安装在波导基板上的精确位置，以便减少传播光的损耗，并且电连接波导基板上的电极和光电子部件。 波导基板具有用于安装光电子部件的光波导和凹部，电极布置在凹部上。 大量的球形弹性导电颗粒分布在凹陷部分的底表面上。 此后，将光电子部件放置在凹部中，以便按压球形弹性导电颗粒，并且调整波导基板中的光波导与光电子部件中的光波导之间的对准。 然后，通过光学粘合剂将光电子部件固定在波导基板上，同时精确调整对准。

公开(公告)号：US5929513A

公开(公告)日：1999-07-27

申请号：US886013

申请日：1997-06-30

申请人： Yuichi Asano ,  Akihiro Kubota ,  Koichi Sibasaki ,  Kazuhiro Yonetake ,  Tsuyoshi Aoki

发明人： Yuichi Asano ,  Akihiro Kubota ,  Koichi Sibasaki ,  Kazuhiro Yonetake ,  Tsuyoshi Aoki

IPC分类号： H01L23/433 ,  H01L23/495 ,  H01L23/28 ,  H01L23/10

CPC分类号： H01L23/4334 ,  H01L23/49548 ,  H01L2224/45144 ,  H01L2224/48091 ,  H01L2224/48247 ,  H01L2224/73265 ,  H01L24/45 ,  H01L24/48 ,  H01L2924/00014 ,  H01L2924/01079 ,  H01L2924/12042 ,  H01L2924/181 ,  H01L2924/3011

摘要： The present invention relates to a semiconductor device in which inner leads of a lead frame are electrically connected to a semiconductor chip, a method for producing thereof and a lead frame used therein. The object of the present invention is to improve a strength of the lead frame and a heat release efficiency in a small-size multi-pin type semiconductor device. In the inner lead of the lead frame, a thin plate portion is formed. The thin plate portions are secured on a heat spreader. A semiconductor chip is mounted on the heat spreader. The semiconductor chip is bonded to the thin plate portions of the inner leads through wires.

摘要翻译： 本发明涉及一种半导体器件，其中引线框架的内部引线电连接到半导体芯片，其制造方法和其中使用的引线框架。 本发明的目的在于提高小型多针式半导体装置的引线框架的强度和散热效率。 在引线框架的内引线中形成薄板部分。 薄板部分固定在散热器上。 半导体芯片安装在散热器上。 半导体芯片通过导线结合到内引线的薄板部分。

公开(公告)号：US5834831A

公开(公告)日：1998-11-10

申请号：US609840

申请日：1996-03-01

申请人： Akihiro Kubota ,  Yuichi Asano ,  Koichi Sibasaki ,  Kazuhiro Yonetake ,  Tsuyoshi Aoki ,  Akira Takashima

发明人： Akihiro Kubota ,  Yuichi Asano ,  Koichi Sibasaki ,  Kazuhiro Yonetake ,  Tsuyoshi Aoki ,  Akira Takashima

IPC分类号： H01L23/433 ,  H01L23/495 ,  H01L23/50

CPC分类号： H01L24/49 ,  H01L23/4334 ,  H01L23/4951 ,  H01L23/49548 ,  H01L24/48 ,  H01L2224/32245 ,  H01L2224/45144 ,  H01L2224/48091 ,  H01L2224/48095 ,  H01L2224/4813 ,  H01L2224/48247 ,  H01L2224/4826 ,  H01L2224/484 ,  H01L2224/48599 ,  H01L2224/49 ,  H01L2224/73265 ,  H01L2224/85385 ,  H01L24/45 ,  H01L2924/01006 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01047 ,  H01L2924/01074 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/12042 ,  H01L2924/181 ,  H01L2924/18165 ,  H01L2924/3011

摘要： A thin semiconductor device in which a strength of a lead frame and a heat dissipation efficiency can be improved. The semiconductor device has a semiconductor chip, a lead having an inner lead and an a outer lead continuing to the inner lead, said inner lead having a thin plate portion thinner than the other portion therof, said thin plate portion being electrically connected to said semiconductor chip through a wire and said outer lead serving as an outer connecting terminal, and a sealing resin sealing said semiconductor chip and at least a part of said lead, wherin said inner lead of said lead is positioned on said semiconductor chip.

摘要翻译： 可以提高引线框架的强度和散热效率的薄型半导体器件。 半导体器件具有半导体芯片，具有内引线和连接到内引线的外引线的引线，所述内引线具有比其它部分栅极更薄的薄板部分，所述薄板部分电连接到所述半导体 并且所述外引线用作外连接端子，密封树脂密封所述半导体芯片，并且所述引线的至少一部分，所述引线的所述内引线位于所述半导体芯片上。