公开(公告)号：US20090230528A1

公开(公告)日：2009-09-17

申请号：US12403175

申请日：2009-03-12

申请人： Simon J. S. McElrea ,  Marc E. Robinson ,  Lawrence Douglas Andrews, JR.

发明人： Simon J. S. McElrea ,  Marc E. Robinson ,  Lawrence Douglas Andrews, JR.

IPC分类号： H01L23/495 ,  H01L23/50 ,  H01L23/34 ,  H01L25/16 ,  H01L21/50

CPC分类号： H01L25/0657 ,  H01L21/56 ,  H01L23/48 ,  H01L24/24 ,  H01L24/80 ,  H01L24/82 ,  H01L29/0657 ,  H01L2224/24145 ,  H01L2224/32145 ,  H01L2224/32225 ,  H01L2224/76155 ,  H01L2224/82102 ,  H01L2225/06524 ,  H01L2225/06551 ,  H01L2225/06555 ,  H01L2225/06562 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/01015 ,  H01L2924/01033 ,  H01L2924/01038 ,  H01L2924/01047 ,  H01L2924/01067 ,  H01L2924/01082 ,  H01L2924/014 ,  H01L2924/09701 ,  H01L2924/14 ,  H01L2924/15311 ,  H01L2924/15787 ,  H01L2924/00

摘要： Stacked die assemblies are electrically connected to connection sites on any support, without electrical connection to any interposed substrate or leadframe, and without solder.

摘要翻译： 堆叠的模具组件电连接到任何支撑件上的连接部位，而不与任何插入的基板或引线框架电连接，并且没有焊料。

公开(公告)号：US20090102038A1

公开(公告)日：2009-04-23

申请号：US12251624

申请日：2008-10-15

申请人： SIMON J.S. MCELREA ,  Marc E. Robinson ,  Lawrence Douglas Andrews, JR. ,  Terrence Caskey ,  Scott McGrath ,  Yong Du ,  Al Vindasius

发明人： SIMON J.S. MCELREA ,  Marc E. Robinson ,  Lawrence Douglas Andrews, JR. ,  Terrence Caskey ,  Scott McGrath ,  Yong Du ,  Al Vindasius

IPC分类号： H01L23/488 ,  H01L21/02

CPC分类号： H01L23/3114 ,  H01L23/525 ,  H01L25/0657 ,  H01L2224/24145 ,  H01L2225/06513 ,  H01L2225/06527 ,  H01L2225/06551 ,  H01L2225/06572

摘要： A die prepared for stacking in a chip scale stacked die assembly, having interconnect sites in an area inward from a die edge and interconnect pads near at least one die edge. Second-level interconnection of the stacked die assembly can be made by way of connections between a first die in the assembly and circuitry on a support; and interconnection between die in the stack can be made by way of connection of z-interconnects with bonds pads in the die attach side of the support near or at one or more die edges. Methods for preparing the die include processes carried out to an advanced stage at the wafer level or at the die array level.

摘要翻译： 准备用于堆叠在芯片级堆叠管芯组件中的管芯，其具有从管芯边缘向内的区域中的互连位置和在至少一个管芯边缘附近的互连焊盘。 可以通过组件中的第一管芯和支撑件上的电路之间的连接来进行堆叠管芯组件的二次互连; 并且堆叠中的管芯之间的互连可以通过z-互连与在支撑件的管芯附接侧中的接合焊盘附近或在一个或多个管芯边缘处的连接来进行。 用于制备模具的方法包括在晶片级或模具阵列级进行到高级阶段的工艺。

公开(公告)号：US20080224279A1

公开(公告)日：2008-09-18

申请号：US12046651

申请日：2008-03-12

申请人： Terrence Caskey ,  Lawrence Douglas Andrews ,  Scott McGrath ,  Simon J.S. McElrea ,  Yong Du ,  Mark Scott

发明人： Terrence Caskey ,  Lawrence Douglas Andrews ,  Scott McGrath ,  Simon J.S. McElrea ,  Yong Du ,  Mark Scott

IPC分类号： H01L23/495 ,  H01L23/488 ,  H01L21/60

CPC分类号： H01L23/49811 ,  H01L24/01 ,  H01L24/29 ,  H01L24/32 ,  H01L24/45 ,  H01L24/48 ,  H01L24/73 ,  H01L24/80 ,  H01L24/83 ,  H01L25/0657 ,  H01L25/50 ,  H01L2223/54426 ,  H01L2224/29 ,  H01L2224/29101 ,  H01L2224/2919 ,  H01L2224/2929 ,  H01L2224/29339 ,  H01L2224/32014 ,  H01L2224/45014 ,  H01L2224/48229 ,  H01L2224/731 ,  H01L2224/8312 ,  H01L2224/83191 ,  H01L2224/838 ,  H01L2225/06551 ,  H01L2225/06575 ,  H01L2924/00013 ,  H01L2924/00014 ,  H01L2924/01006 ,  H01L2924/01033 ,  H01L2924/01047 ,  H01L2924/01082 ,  H01L2924/014 ,  H01L2924/0665 ,  H01L2924/14 ,  H01L2924/00 ,  H01L2224/29099 ,  H01L2224/29199 ,  H01L2224/29299 ,  H01L2224/45015 ,  H01L2924/207

摘要： A die assembly includes a die mounted to a support, in which the support has interconnect pedestals formed at bond pads, and the die has interconnect terminals projecting beyond a die edge into corresponding pedestals. Also, a support has interconnect pedestals. Also, a method for electrically interconnecting a die to a support includes providing a support having interconnect pedestals formed at bond pads on the die mount surface of the support, providing a die having interconnect terminals projecting beyond a die edge, positioning the die in relation to the support such that the terminals are aligned with the corresponding pedestals, and moving the die and the support toward one another so that the terminals contact the respective pedestals.

摘要翻译： 模具组件包括安装到支撑件的模具，其中支撑件具有形成在接合焊盘处的互连基座，并且模具具有突出超过模具边缘的相互连接端子到相应的基座。 另外，支架具有互连基座。 此外，用于将管芯电连接到支撑件的方法包括提供支撑件，其具有形成在支撑件的管芯安装表面上的接合焊盘处的互连基座，提供具有突出超过模具边缘的互连端子的管芯，将管芯相对于 所述支撑件使得端子与相应的基座对准，并且使模具和支撑件朝向彼此移动，使得端子与相应的基座接触。

公开(公告)号：US20070290377A1

公开(公告)日：2007-12-20

申请号：US11849162

申请日：2007-08-31

申请人： Al Vindasius ,  Marc Robinson

发明人： Al Vindasius ,  Marc Robinson

IPC分类号： H01L23/29 ,  H01L21/56

CPC分类号： H01L23/3185 ,  H01L23/3171 ,  H01L2924/0002 ,  H01L2924/00

摘要： Semiconductor die are typically manufactured as a large group of integrated circuit die imaged through photolithographic means on a semiconductor wafer or slice made of silicon. After manufacture, the silicon wafer is thinned, usually by mechanical means, and the wafer is cut, usually with a diamond saw, to singulate the individual die. The resulting individual integrated circuit has six exposed surfaces. The top surface of the die includes the circuitry images and any passivation layers that have been added to the top layer during wafer fabrication. The present invention describes a method for protecting and insulating all six surfaces of the die to reduce breakage, provide electrical insulation for these layers, and to provide physical surfaces that can be used for bonding one semiconductor die to another for the purpose of stacking die in an interconnected module or component.

摘要翻译： 半导体管芯通常被制造为通过光刻装置在半导体晶片或硅片上成像的大量集成电路管芯。 在制造之后，通常通过机械方式使硅晶片变薄，并且通常使用金刚石锯将晶片切割成单个模具。 所得到的单个集成电路具有六个暴露表面。 芯片的顶表面包括电路图像和在晶片制造期间已被添加到顶层的任何钝化层。 本发明描述了一种用于保护和绝缘模具的所有六个表面以减少断裂的方法，为这些层提供电绝缘，并提供用于将一个半导体管芯与另一个半导体管芯结合的物理表面，用于将模具堆叠 互连的模块或组件。

公开(公告)号：US20070284716A1

公开(公告)日：2007-12-13

申请号：US11744142

申请日：2007-05-03

申请人： Al Vindasius ,  Marc Robinson ,  Larry Jacobsen ,  Donald Almen

发明人： Al Vindasius ,  Marc Robinson ,  Larry Jacobsen ,  Donald Almen

IPC分类号： H01L23/522

CPC分类号： H01L25/00 ,  H01L21/563 ,  H01L23/3128 ,  H01L23/34 ,  H01L23/525 ,  H01L25/0657 ,  H01L2224/24145 ,  H01L2224/73203 ,  H01L2225/06513 ,  H01L2225/06517 ,  H01L2225/06524 ,  H01L2225/06551 ,  H01L2225/06582 ,  H01L2225/06586 ,  H01L2924/01046 ,  H01L2924/01079 ,  H01L2924/09701 ,  H01L2924/15311 ,  H01L2924/3011

摘要： The present invention provides an apparatus for vertically interconnecting semiconductor die, integrated circuit die, or multiple die segments. Metal rerouting interconnects which extend to one or more sides of the die or segment can be optionally added to the die or multi die segment to provide edge bonding pads upon the surface of the die for external electrical connection points. After the metal rerouting interconnect has been added to the die on the wafer, the wafer is optionally thinned and each die or multiple die segment is singulated from the wafer by cutting or other appropriate singulation method. After the die or multiple die segments are singulated or cut from the wafer, insulation is applied to all surfaces of the die or multiple die segments, openings are made in the insulation above the desired electrical connection pads, and the die or multiple die segments are placed on top of one another to form a stack. Vertically adjacent segments in the stack are electrically interconnected by attaching a short flexible bond wire or bond ribbon to the exposed electrical connection pad at the peripheral edges of the die which protrudes horizontally from the die and applying electrically conductive polymer, or epoxy, filaments or lines to one or more sides of the stack

摘要翻译： 本发明提供一种用于垂直互连半导体管芯，集成电路管芯或多个管芯段的装置。 延伸到模具或段的一个或多个侧面的金属重路由互连可以任选地添加到管芯或多管段中，以在管芯的表面上提供用于外部电连接点的边缘焊盘。 在金属重路由互连已经被添加到晶片上的管芯之后，晶片可选地变薄，并且通过切割或其他合适的分割方法将晶片从晶片上分离出来。 在从晶片上切割或切割管芯或多个管芯段之后，将绝缘施加到管芯或多个管芯段的所有表面上，在所需的电连接焊盘上方的绝缘体中形成开口，并且模具或多个管芯段是 放置在彼此的顶部以形成堆叠。 在堆叠中的垂直相邻的段通过将短的柔性接合线或粘合带附接到裸露的电连接焊盘而在模具的外围边缘处水平地从模具突出并且施加导电聚合物或环氧树脂，细丝或线 到堆叠的一侧或多侧

公开(公告)号：US07245021B2

公开(公告)日：2007-07-17

申请号：US11097829

申请日：2005-03-31

申请人： Al Vindasius ,  Marc Robinson ,  Larry Jacobsen ,  Donald Almen

发明人： Al Vindasius ,  Marc Robinson ,  Larry Jacobsen ,  Donald Almen

IPC分类号： H01L23/48 ,  H01L23/52 ,  H01L29/40

CPC分类号： H01L23/49575 ,  H01L25/0657 ,  H01L2224/24145 ,  H01L2225/0652 ,  H01L2225/06524 ,  H01L2225/06527 ,  H01L2225/06551 ,  H01L2225/06555 ,  H01L2225/06575 ,  H01L2225/06579 ,  H01L2924/09701 ,  H01L2924/3011

摘要： The present invention provides an apparatus for vertically interconnecting semiconductor die, integrated circuit die, or multiple die segments. Metal rerouting interconnects which extend to one or more sides of the die or segment can be optionally added to the die or multi die segment to provide edge bonding pads upon the surface of the die for external electrical connection points. After the metal rerouting interconnect has been added to the die on the wafer, the wafer is optionally thinned and each die or multiple die segment is singulated from the wafer by cutting or other appropriate singulation method. After the die or multiple die segments are singulated or cut from the wafer, insulation is applied to all surfaces of the die or multiple die segments, openings are made in the insulation above the desired electrical connection pads, and the die or multiple die segments are placed on top of one another to form a stack. Vertically adjacent segments in the stack are electrically interconnected by attaching a short flexible bond wire or bond ribbon to the exposed electrical connection pad at the peripheral edges of the die which protrudes horizontally from the die and applying electrically conductive polymer, or epoxy, filaments or lines to one or more sides of the stack.

摘要翻译： 本发明提供一种用于垂直互连半导体管芯，集成电路管芯或多个管芯段的装置。 延伸到模具或段的一个或多个侧面的金属重路由互连可以任选地添加到管芯或多管段中，以在管芯的表面上提供用于外部电连接点的边缘焊盘。 在金属重路由互连已经被添加到晶片上的管芯之后，晶片可选地变薄，并且通过切割或其他合适的分割方法将晶片从晶片上分离出来。 在从晶片上切割或切割管芯或多个管芯段之后，将绝缘施加到管芯或多个管芯段的所有表面上，在所需的电连接焊盘上方的绝缘体中形成开口，并且模具或多个管芯段是 放置在彼此的顶部以形成堆叠。 在堆叠中的垂直相邻的段通过将短的柔性接合线或粘合带附接到裸露的电连接焊盘而在模具的外围边缘处水平地从模具突出并且施加导电聚合物或环氧树脂，细丝或线 到堆叠的一侧或多侧。