Abstract:
A method for fabricating the MEMS device includes providing a substrate. Then, a structural dielectric layer is formed over the substrate at a first side, wherein a diaphragm is embedded in the structural dielectric layer. The substrate is patterned from a second side to form a cavity in corresponding to the diaphragm and a plurality of venting holes in the substrate. An isotropic etching process is performed from the first side and the second side of the substrate via vent holes to remove a dielectric portion of the structural dielectric layer for exposing a central portion of the diaphragm while an end portion is held by a residue portion of the structural dielectric layer.
Abstract:
A physical quantity detection circuit (12) is used for a physical quantity sensor (10) that outputs a sensor signal according to a physical quantity given externally. In the physical quantity detection circuit (12), an analog-to-digital converter (104) converts an analog sensor signal (Ssnc) to a digital sensor signal (Dsnc). A digital filter (100) attenuates a frequency component of the digital sensor signal (Dsnc) that is higher than a predetermined cutoff frequency. A multiplier (106) multiplies a digital sensor signal (Dps) having passed the digital filter (100) by a digital detection signal (Ddet) to detect a digital physical quantity signal (Dphy).
Abstract:
A displacement sensor comprising at least one pair of co-planar photonic crystal waveguide (PCWG) sections aligned along or parallel to a common axis and separated by a gap, one PCWG section of a pair operative to perform a displacement relative to the other section of the pair. In some embodiments, the sensor is linear, comprising two PCWG sections separated by a gap that forms a cross PCWG, the displacement sensing performed preferrably differentially between two edges of the cross PCWG. In other embodiments, the sensor includes Mach Zehnder Interferometer (MZI) configurations with gaps between fixed and moving PCWG sections. Displacement induced changes in the gap widths are reflected in changes in an output parameter of the MZI.
Abstract:
The invention relates to measuring devices used in the measuring of acceleration and, more specifically, to capacitive acceleration sensors. The capacitive acceleration sensor according to the present invention contains a movable electrode (5) supported at an axis of rotation (7). The capacitance change in the pair of electrodes of the acceleration sensor, according to the present invention, is enhanced. The acceleration sensor structure, according to the present invention, enables improving the capacitance sensitivity of the pair of electrodes based on rotational motion and measuring acceleration with good performance in capacitive acceleration sensor designs.
Abstract:
An acceleration sensor includes a mount section arranged to be fixed to an object, a flexible section coupled to the mount section, a weight coupled to the mount section via the flexible section, and first and second opposed electrode unit. The first opposed electrode unit includes a first electrode placed on the weight and a second electrode spaced away from and facing the first electrode, and provides a first capacitance. The second opposed electrode unit includes a third electrode placed on the weight and a fourth electrode spaced away from and facing the third electrode, and provides a second capacitance. The first and third electrodes are arranged along a first direction. The second and fourth electrodes are spaced away from and face the first and third electrodes along a second direction perpendicular to the first direction, respectively. A component of an acceleration along the first direction applied to the object is detected based on the first and second capacitances. A control voltage is applied to the first and second opposed electrode units. The control voltage is changed when both of the first capacitance and the second capacitance simultaneously increase or decrease. This acceleration sensor detects the acceleration accurately.
Abstract:
A microelectromechanical system comprises a deformable portion and at least one stress sensor fixedly attached to the deformable portion. The sensor itself comprises a base portion and a shunt portion juxtaposed on the deformable portion, and connections arranged to detect a change of a distribution of an electric current in the base and shunt portions. Such a system is suitable for many applications, in particular for forming a portion of an arm of an atomic force microscope or for entering into the constitution of a bio sensor.
Abstract:
A long-period weak-motion inertial sensor includes a frame having a frame mounting surface, a movable mass having a movable mass mounting surface, a transducer for sensing displacements of the movable mass with respect to the frame, and a monolithic flexure element for suspending the movable mass in the frame. The monolithic flexure element includes: a stiff frame integral clamp attachable to the frame mounting surface of the frame, a stiff movable mass integral clamp attachable to the movable mass mounting surface of the movable mass, and a stiffest flexible region for operatively connecting the frame integral clamp to the movable mass integral clamp. The frame and movable mass mounting surfaces do not overlap the stiffest flexible region, thereby minimizing the generation of creep and hysteresis noise. The variation in stiffness of the monolithic flexure element is controlled by varying thickness along the length of the flexure element.
Abstract:
One embodiment of the present application includes a multisensor assembly. This assembly has an electromechanical motion sensor member defined with one wafer layer, a first sensor carried with a first one or two or more other wafer layers, and a second sensor carried with a second one of the other wafer layers. The one wafer layer is positioned between the other wafer layers to correspondingly enclose the sensor member within a cavity of the assembly.
Abstract:
A fiber optic sensor for detecting acceleration or displacement includes a fiber optic probe with a multimode transmitting optical fiber, a multimode receiving optical fiber and a edge reflector spaced apart from the fiber probe. The reflector moves in a transverse direction substantially normal to the longitudinal axis of the fiber optic probe, so the amount of light received by the receiving fiber indicates a relative acceleration or a relative displacement of the reflective surface with respect to the fiber probe in the transverse direction of motion of the edge of the reflector. The reflector can be mounted on a cantilever beam. The sensor can have one transmitting fiber, two receiving fiber, and a reflector with two edges, each edge partially covering one of the receiving fibers. A triaxial sensor system has at least two two-fiber sensors.
Abstract:
Disclosed is a low-cost high-resolution compact accelerometer which utilizes multiple self-mixing optical interferometers. The device is also a micro-opto-electro-mechanical systems (MOEMS) sensor. The interferometers are used to detect acceleration as well as monitor the wavelength, temperature, and refractive index and perform differential measurements. In addition, photodetectors are employed to monitor the input optical power.