公开(公告)号：US20140008022A1

公开(公告)日：2014-01-09

申请号：US13936298

申请日：2013-07-08

申请人： Kyung-Hyun AHN ,  Jin-Han PARK ,  Dong-Sul KIM ,  Byung-Chul LEE

发明人： Kyung-Hyun AHN ,  Jin-Han PARK ,  Dong-Sul KIM ,  Byung-Chul LEE

IPC分类号： B29C69/00

CPC分类号： B29C69/006 ,  B32B38/10 ,  B32B43/006 ,  B32B2457/20 ,  Y10T156/1132 ,  Y10T156/1137 ,  Y10T156/1174 ,  Y10T156/1939 ,  Y10T156/195 ,  Y10T156/1956 ,  Y10T156/1978

摘要： A delamination apparatus that includes a stage to which a lower support, an acceptor substrate disposed on the lower support, and a donor film laminated with the lower support along the edge of the acceptor substrate, interposing the acceptor substrate therebetween are mounted. The delamination apparatus further includes a first gripper disposed in an end side of the stage to move an end of the donor film to a direction far away from the acceptor substrate by gripping the end of the donor film; and a first peeling roll disposed on the donor film to support the donor film disposed between the acceptor substrate and the first gripper, and rotating itself to a direction of the first gripper.

摘要翻译： 一种分层装置，其包括下部支撑体，设置在下部支撑体上的受主基板和沿着受主基板的边缘与下部支撑体层叠的供体膜，在其间插入受体基板的阶段。 分层装置还包括设置在台架的端侧的第一夹持器，通过夹持施主膜的端部将施主膜的端部移动到远离受主基板的方向; 以及第一剥离辊，其设置在供体膜上以支撑设置在受主基板和第一夹持器之间的供体膜，并且将其自身旋转到第一夹持器的方向。

公开(公告)号：US20130299098A1

公开(公告)日：2013-11-14

申请号：US13941507

申请日：2013-07-14

申请人： Renesas Electronics Corporation

发明人： Hiroshi MAKI ,  Tsuyoshi YOKOMORI ,  Tatsuyuki OKUBO

IPC分类号： H01L21/77

CPC分类号： H01L21/77 ,  H01L21/67132 ,  H01L21/6835 ,  H01L21/6836 ,  H01L21/6838 ,  H01L21/78 ,  H01L22/12 ,  H01L22/20 ,  H01L24/27 ,  H01L24/29 ,  H01L24/32 ,  H01L24/45 ,  H01L24/48 ,  H01L24/73 ,  H01L24/75 ,  H01L24/83 ,  H01L2221/68322 ,  H01L2221/68327 ,  H01L2221/68336 ,  H01L2224/274 ,  H01L2224/2919 ,  H01L2224/32145 ,  H01L2224/32225 ,  H01L2224/45144 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2224/48465 ,  H01L2224/73265 ,  H01L2224/83101 ,  H01L2224/83191 ,  H01L2224/8385 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01014 ,  H01L2924/01019 ,  H01L2924/01023 ,  H01L2924/01027 ,  H01L2924/01033 ,  H01L2924/01047 ,  H01L2924/01057 ,  H01L2924/01075 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/01084 ,  H01L2924/0132 ,  H01L2924/014 ,  H01L2924/0665 ,  H01L2924/07802 ,  H01L2924/10253 ,  H01L2924/10329 ,  H01L2924/12042 ,  H01L2924/14 ,  H01L2924/181 ,  Y10T156/1132 ,  Y10T156/1944 ,  H01L2924/00014 ,  H01L2924/00012 ,  H01L2924/00 ,  H01L2924/01032 ,  H01L2924/01031 ,  H01L2924/3512

摘要： In a chip pick-up process after dicing in an assembly process during manufacture of a semiconductor integrated circuit device it is an important subject to diminish a pick-up defect caused by the reduction in thickness of each chip which is proceeding in quick tempo. Particularly, bending of the chip peripheral portion caused by a peeling operation is very likely to induce cracking and chipping of the chip. In the present invention, to solve these problems, in case of peeling a chip from a dicing tape (adhesive tape) or the like while vacuum-chucking the chip by a chucking collet, the flow rate of a vacuum chucking system in the chucking collet is monitored to check a bent state of the chip before complete separation of the first chip from the adhesive tape.

公开(公告)号：US20130186574A1

公开(公告)日：2013-07-25

申请号：US13358110

申请日：2012-01-25

申请人： Kevin D. Baker ,  Sidney E. Hughs

发明人： Kevin D. Baker ,  Sidney E. Hughs

IPC分类号： B29C59/06 ,  B29C59/04

CPC分类号： B32B43/006 ,  B32B2307/304 ,  Y10T156/1132 ,  Y10T156/1174 ,  Y10T156/1944 ,  Y10T156/195

摘要： The fiber batt reclaiming method and apparatus separates the fiber batt portion of surplus or defective fiberglass insulation from the paper backing material attached to the fiber batt. As the insulation is fed to a perforated roller, a vacuum means draws the backing material to the roller so that the backing material adheres to the roller. As the roller rotates the fiber batt portion of the insulation is separated from the backing material by a separation tool. In accordance with various embodiments of the apparatus, the separation tool may be an elongated knife, a pressurized air bar, a circular saw bar, or an elongated wire brush.

摘要翻译： 纤维絮垫回收方法和装置将剩余或有缺陷的玻璃纤维绝缘体的纤维毡部分与附着到纤维絮垫上的纸背衬材料分离。 当绝缘体被供给到多孔辊时，真空装置将背衬材料拉到辊子上，使得背衬材料粘附到辊子上。 当辊旋转时，绝缘体的纤维毡部分通过分离工具与背衬材料分离。 根据装置的各种实施例，分离工具可以是细长刀，加压空气棒，圆锯条或细长丝刷。

公开(公告)号：US08492173B2

公开(公告)日：2013-07-23

申请号：US13742788

申请日：2013-01-16

申请人： Renesas Electronics Corporation

发明人： Hiroshi Maki ,  Tsuyoshi Yokomori ,  Tatsuyuki Okubo

IPC分类号： H01L21/00

CPC分类号： H01L21/77 ,  H01L21/67132 ,  H01L21/6835 ,  H01L21/6836 ,  H01L21/6838 ,  H01L21/78 ,  H01L22/12 ,  H01L22/20 ,  H01L24/27 ,  H01L24/29 ,  H01L24/32 ,  H01L24/45 ,  H01L24/48 ,  H01L24/73 ,  H01L24/75 ,  H01L24/83 ,  H01L2221/68322 ,  H01L2221/68327 ,  H01L2221/68336 ,  H01L2224/274 ,  H01L2224/2919 ,  H01L2224/32145 ,  H01L2224/32225 ,  H01L2224/45144 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2224/48465 ,  H01L2224/73265 ,  H01L2224/83101 ,  H01L2224/83191 ,  H01L2224/8385 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01014 ,  H01L2924/01019 ,  H01L2924/01023 ,  H01L2924/01027 ,  H01L2924/01033 ,  H01L2924/01047 ,  H01L2924/01057 ,  H01L2924/01075 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/01084 ,  H01L2924/0132 ,  H01L2924/014 ,  H01L2924/0665 ,  H01L2924/07802 ,  H01L2924/10253 ,  H01L2924/10329 ,  H01L2924/12042 ,  H01L2924/14 ,  H01L2924/181 ,  Y10T156/1132 ,  Y10T156/1944 ,  H01L2924/00014 ,  H01L2924/00012 ,  H01L2924/00 ,  H01L2924/01032 ,  H01L2924/01031 ,  H01L2924/3512

摘要： In a chip pick-up process after dicing in an assembly process during manufacture of a semiconductor integrated circuit device it is an important subject to diminish a pick-up defect caused by the reduction in thickness of each chip which is proceeding in quick tempo. Particularly, bending of the chip peripheral portion caused by a peeling operation is very likely to induce cracking and chipping of the chip. In the present invention, to solve these problems, in case of peeling a chip from a dicing tape (adhesive tape) or the like while vacuum-chucking the chip by a chucking collet, the flow rate of a vacuum chucking system in the chucking collet is monitored to check a bent state of the chip before complete separation of the first chip from the adhesive tape.

公开(公告)号：US20130146229A1

公开(公告)日：2013-06-13

申请号：US13818150

申请日：2011-03-04

申请人： Osamu Hirakawa ,  Naoto Yoshitaka ,  Masataka Matsunaga ,  Norihiko Okamoto

发明人： Osamu Hirakawa ,  Naoto Yoshitaka ,  Masataka Matsunaga ,  Norihiko Okamoto

IPC分类号： H01L21/02

CPC分类号： H01L21/02076 ,  B32B38/10 ,  B32B43/006 ,  H01L21/02057 ,  H01L21/67051 ,  H01L21/67092 ,  Y10T156/11 ,  Y10T156/1132 ,  Y10T156/1153 ,  Y10T156/1168 ,  Y10T156/19 ,  Y10T156/1911 ,  Y10T156/1944

摘要： The present invention is used for separating a superposed substrate in which a processing target substrate and a supporting substrate are joined together with an adhesive into the processing target substrate and the supporting substrate, and includes: a separation processing station performing predetermined processing on the processing target substrate, the supporting substrate, and the superposed substrate; a transfer-in/out station transferring the substrates into/from the separation processing station; and a transfer unit transferring the substrates between the separation processing station and the transfer-in/out station, wherein the separation processing station includes: a separation unit separating the superposed substrate into the processing target substrate and the supporting substrate; a first cleaning unit cleaning the processing target substrate separated in the separation unit; and a second cleaning unit cleaning the supporting substrate separated in the separation unit.

摘要翻译： 本发明用于将处理对象基板和支撑基板与粘合剂接合在一起的叠加基板分离到处理对象基板和支撑基板中，并且包括：对处理对象进行预定处理的分离处理站 基板，支撑基板和叠置基板; 将基板传送到分离处理站/从分离处理站传送的输入/输出站; 以及转移单元，其在所述分离处理站和所述分离处理站之间传送所述基板，其中所述分离处理站包括：分离单元，将所述叠加的基板分离成所述处理对象基板和所述支撑基板; 清洗分离单元中分离的处理对象基板的第一清洗单元; 以及清洁在分离单元中分离的支撑基板的第二清洁单元。

公开(公告)号：US20130130408A1

公开(公告)日：2013-05-23

申请号：US13742788

申请日：2013-01-16

申请人： RENESAS ELECTRONICS CORPORATION

发明人： Hiroshi MAKI ,  Tsuyoshi YOKOMORI ,  Tatsuyuki OKUBO

IPC分类号： H01L21/66

CPC分类号： H01L21/77 ,  H01L21/67132 ,  H01L21/6835 ,  H01L21/6836 ,  H01L21/6838 ,  H01L21/78 ,  H01L22/12 ,  H01L22/20 ,  H01L24/27 ,  H01L24/29 ,  H01L24/32 ,  H01L24/45 ,  H01L24/48 ,  H01L24/73 ,  H01L24/75 ,  H01L24/83 ,  H01L2221/68322 ,  H01L2221/68327 ,  H01L2221/68336 ,  H01L2224/274 ,  H01L2224/2919 ,  H01L2224/32145 ,  H01L2224/32225 ,  H01L2224/45144 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2224/48465 ,  H01L2224/73265 ,  H01L2224/83101 ,  H01L2224/83191 ,  H01L2224/8385 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01014 ,  H01L2924/01019 ,  H01L2924/01023 ,  H01L2924/01027 ,  H01L2924/01033 ,  H01L2924/01047 ,  H01L2924/01057 ,  H01L2924/01075 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/01084 ,  H01L2924/0132 ,  H01L2924/014 ,  H01L2924/0665 ,  H01L2924/07802 ,  H01L2924/10253 ,  H01L2924/10329 ,  H01L2924/12042 ,  H01L2924/14 ,  H01L2924/181 ,  Y10T156/1132 ,  Y10T156/1944 ,  H01L2924/00014 ,  H01L2924/00012 ,  H01L2924/00 ,  H01L2924/01032 ,  H01L2924/01031 ,  H01L2924/3512

摘要： In a chip pick-up process after dicing in an assembly process during manufacture of a semiconductor integrated circuit device it is an important subject to diminish a pick-up defect caused by the reduction in thickness of each chip which is proceeding in quick tempo. Particularly, bending of the chip peripheral portion caused by a peeling operation is very likely to induce cracking and chipping of the chip. In the present invention, to solve these problems, in case of peeling a chip from a dicing tape (adhesive tape) or the like while vacuum-chucking the chip by a chucking collet, the flow rate of a vacuum chucking system in the chucking collet is monitored to check a bent state of the chip before complete separation of the first chip from the adhesive tape.

摘要翻译： 在半导体集成电路器件制造期间的组装工艺中的切割之后的芯片拾取过程中，减少由快速进行的每个芯片的厚度减小引起的拾取缺陷是重要的课题。 特别地，由剥离操作引起的芯片周边部分的弯曲很可能引起芯片的破裂和碎裂。 在本发明中，为了解决这些问题，在通过夹紧夹头对芯片进行真空夹持的情况下，在从切割带（胶带）等剥离芯片的情况下，夹紧夹头中的真空夹紧系统的流量 被监视以在第一芯片从胶带完全分离之前检查芯片的弯曲状态。

公开(公告)号：US08192578B2

公开(公告)日：2012-06-05

申请号：US12089865

申请日：2006-10-13

申请人： Hiroshi Haji ,  Mitsuru Ozono ,  Teruaki Kasai ,  Kazuhiro Noda

发明人： Hiroshi Haji ,  Mitsuru Ozono ,  Teruaki Kasai ,  Kazuhiro Noda

IPC分类号： B32B38/10

CPC分类号： H01L21/67132 ,  H01L21/67092 ,  Y10S156/932 ,  Y10S156/943 ,  Y10S438/976 ,  Y10T156/1132 ,  Y10T156/1179 ,  Y10T156/1195 ,  Y10T156/1944 ,  Y10T156/1983 ,  Y10T156/1994

摘要： In the pickup apparatus wherein a chip adhered on a sheet is sucked and held by a picking nozzle and then picked up by the nozzle, a sheet push-up member configured by forming flexible elastic material such as rubber in a spherical shape is attached on the abutment supporting surface of the upper surface of a tool, then the push-up surface of the sheet push-up member is followed in a flat surface state along the lower surface of the sheet and abutted thereto in the moving down state of the picking nozzle, and then the push-up surface pushes up the lower surface of the sheet while being deformed in a upwardly protruded curved surface shape in the moving up operation where the picking nozzle moves up together with the chip. Thus, the chip can be released from the sheet from the outer peripheral side of the chip.

摘要翻译： 在拾取装置中，附着在片材上的芯片由拾取喷嘴吸引并保持，然后由喷嘴拾起，将通过形成球形的诸如橡胶的柔性弹性材料构成的片状上推构件安装在 工具上表面的基台支撑表面，则片材上推构件的上推表面沿着片材的下表面处于平坦表面状态，并且在拾取喷嘴的向下移动状态下与其邻接 然后在拾取喷嘴与芯片一起向上移动的上移操作中，上推表面向上推动纸张的下表面，同时以向上突出的曲面形状变形。 因此，芯片可以从芯片的外周侧从片材释放。

公开(公告)号：US08052835B2

公开(公告)日：2011-11-08

申请号：US12412866

申请日：2009-03-27

申请人： Dale C. Merrill ,  Ernest L. Goodwin

发明人： Dale C. Merrill ,  Ernest L. Goodwin

IPC分类号： B32B38/10

CPC分类号： B65C9/42 ,  B65C2009/0093 ,  B65C2009/404 ,  Y10S156/934 ,  Y10T156/1132 ,  Y10T156/1174 ,  Y10T156/1195 ,  Y10T156/1944 ,  Y10T156/195 ,  Y10T156/1994

摘要： An incorrect label removal system is disclosed for removing unwanted labels from a web of labels in a labeling machine. The incorrect label removal system includes a label peel assembly positioned between two fixed points along the direction of travel of the web of labels. The label peel assembly provides a first orientation in which labels remain on the web as the web passes the label peel assembly, and selectively provides a second orientation in which labels are removed from the web. The label peel assembly provides that a length of the web between the two fixed points is substantially the same when the label peel assembly is in each of the first orientation and the second orientation.

摘要翻译： 公开了一种不正确的标签去除系统，用于从贴标机中的标签网中去除不需要的标签。 不正确的标签去除系统包括标签剥离组件，该标签剥离组件位于沿着标签网的行进方向的两个固定点之间。 标签剥离组件提供第一取向，其中当幅材通过标签剥离组件时，标签保留在幅材上，并且选择性地提供标签从幅材上移除的第二取向。 标签剥离组件规定，当标签剥离组件处于第一取向和第二取向中的每一个时，两个固定点之间的幅材的长度基本相同。

公开(公告)号：US20110048634A1

公开(公告)日：2011-03-03

申请号：US12553834

申请日：2009-09-03

申请人： Daniel Kim

发明人： Daniel Kim

IPC分类号： B29C65/02

CPC分类号： B29C66/439 ,  B29C51/008 ,  B29C65/18 ,  B29C66/00145 ,  B29C66/1122 ,  B29C66/1312 ,  B29C66/242 ,  B29C66/54 ,  B29C66/542 ,  B29C66/73186 ,  B29C66/81825 ,  B29C66/81831 ,  B29C66/8242 ,  B29C66/8322 ,  B29C2791/001 ,  B29C2791/006 ,  B29L2031/7138 ,  B31D5/0073 ,  B65D81/052 ,  Y10T156/1132 ,  Y10T156/1944 ,  Y10T428/231

摘要： A method for fabricating an air-filled cellular structure for use as a resilient cushion. The method includes providing a molding structure including a shelf substantially surrounding a depression, and a platform that fits within the depression and is selectively movable between a plurality of positions relative to the shelf, moving the platform to a preselected position relative to the shelf, wherein the preselected position corresponds to a substantially predetermined amount of air to be contained by the air-filled cellular structure, and using a vacuum device to draw air from within the depression. The method further includes engaging a first portion of a first expanse of generally air-impermeable material with the shelf, whereby the vacuum device draws a second portion of the first expanse of material against the moveable platform, and bonding a first portion of a second expanse of generally air-impermeable material to the first portion of the first expanse, thereby enclosing a volume of air between the first and second expanses. The method may further include bonding a third portion of the first expanse to a second portion of the second expanse, thereby decreasing the volume of the air enclosed between the first and second expanses.

摘要翻译： 一种用于制造用作弹性垫的充气蜂窝状结构的方法。 该方法包括提供一种模制结构，其包括基本上围绕凹陷的搁板和安装在凹陷内的平台，并且可相对于搁板在多个位置之间选择性地移动，将平台相对于搁架移动到预定位置，其中 预选位置对应于空气填充的细胞结构所包含的基本上预定量的空气，并且使用真空装置从凹陷内抽取空气。 该方法还包括将第一大体上不透气材料的第一部分与搁架接合，由此真空装置将第一部分材料的第二部分拉向可移动平台，并将第二部分的第一部分 通常为不透气的材料到第一穹顶的第一部分，从而在第一和第二膨胀之间包围一定体积的空气。 该方法可以进一步包括将第一穹顶的第三部分接合到第二exp的第二部分，从而减小在第一和第二扩展之间包围的空气的体积。

公开(公告)号：US07888141B2

公开(公告)日：2011-02-15

申请号：US12137522

申请日：2008-06-11

申请人： Hiroshi Maki ,  Tsuyoshi Yokomori ,  Tatsuyuki Okubo

发明人： Hiroshi Maki ,  Tsuyoshi Yokomori ,  Tatsuyuki Okubo

IPC分类号： H01L21/00

CPC分类号： H01L21/77 ,  H01L21/67132 ,  H01L21/6835 ,  H01L21/6836 ,  H01L21/6838 ,  H01L21/78 ,  H01L22/12 ,  H01L22/20 ,  H01L24/27 ,  H01L24/29 ,  H01L24/32 ,  H01L24/45 ,  H01L24/48 ,  H01L24/73 ,  H01L24/75 ,  H01L24/83 ,  H01L2221/68322 ,  H01L2221/68327 ,  H01L2221/68336 ,  H01L2224/274 ,  H01L2224/2919 ,  H01L2224/32145 ,  H01L2224/32225 ,  H01L2224/45144 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2224/48465 ,  H01L2224/73265 ,  H01L2224/83101 ,  H01L2224/83191 ,  H01L2224/8385 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01014 ,  H01L2924/01019 ,  H01L2924/01023 ,  H01L2924/01027 ,  H01L2924/01033 ,  H01L2924/01047 ,  H01L2924/01057 ,  H01L2924/01075 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/01084 ,  H01L2924/0132 ,  H01L2924/014 ,  H01L2924/0665 ,  H01L2924/07802 ,  H01L2924/10253 ,  H01L2924/10329 ,  H01L2924/12042 ,  H01L2924/14 ,  H01L2924/181 ,  Y10T156/1132 ,  Y10T156/1944 ,  H01L2924/00014 ,  H01L2924/00012 ,  H01L2924/00 ,  H01L2924/01032 ,  H01L2924/01031 ,  H01L2924/3512

摘要： In a chip pick-up process after dicing in an assembly process during manufacture of a semiconductor integrated circuit device it is an important subject to diminish a pick-up defect caused by the reduction in thickness of each chip which is proceeding in quick tempo. Particularly, bending of the chip peripheral portion caused by a peeling operation is very likely to induce cracking and chipping of the chip. In the present invention, to solve these problems, in case of peeling a chip from a dicing tape (adhesive tape) or the like while vacuum-chucking the chip by a chucking collet, the flow rate of a vacuum chucking system in the chucking collet is monitored to check a bent state of the chip before complete separation of the first chip from the adhesive tape.