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公开(公告)号：US09025238B2
公开(公告)日：2015-05-05
申请号：US13916498
申请日：2013-06-12
申请人： SiPix Imaging, Inc.
发明人： Bryan Hans Chan , Craig Lin , HongMei Zang
IPC分类号： G02B26/00 , G09G3/34 , G02F1/167 , G02B26/02 , H01L41/08 , H01L41/293 , H01L41/297 , B06B1/06 , H01L41/31 , H01L41/312 , H01L41/35 , G02F1/1333
CPC分类号： G02F1/167 , B06B1/06 , B06B1/0644 , B06B1/0659 , G02B26/026 , G02F2001/133394 , G02F2001/1672 , G09G3/34 , G09G3/3433 , G09G3/344 , G09G2380/02 , H01L41/08 , H01L41/0805 , H01L41/293 , H01L41/297 , H01L41/31 , H01L41/312 , H01L41/35
摘要： The invention is directed to a variety of designs of piezo electrophoretic displays which may be driven without connecting to a power source. The piezo-electrophoretic display comprises an electrophoretic layer, a conductor layer, and a layer of piezo material. The processes for manufacturing the piezo electrophoretic displays are also provided.
摘要翻译： 本发明涉及压电电泳显示器的各种设计，其可以在不连接到电源的情况下被驱动。 压电电泳显示器包括电泳层，导体层和压电材料层。 还提供了制造压电电泳显示器的方法。
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公开(公告)号：US08999187B2
公开(公告)日：2015-04-07
申请号：US14092624
申请日：2013-11-27
发明人： Sandra Obernhuber , Christof Jalics , Joerg Adler , Uwe Hoeckele , Walter Preis , Reinhard Goellner , Tanja Ippisch , Patricia Nickut
IPC分类号： C03C15/00 , H01L41/297 , H03H3/04
CPC分类号： H01L41/297 , H03H3/04
摘要： A method for manufacturing a device on a substrate includes forming a layer structure on the substrate, forming an auxiliary layer on the layer structure, forming a planarization layer on the auxiliary layer and on the substrate, exposing the auxiliary layer by a chemical mechanical polishing process and removing at least partly the auxiliary layer to form a planar surface of the remaining auxiliary layer or of the layer structure and the planarization layer. The chemical mechanical polishing process has a first removal rate with respect to the planarization layer and a second removal rate with respect to the auxiliary layer and the first removal rate is greater than the second removal rate.
摘要翻译： 在衬底上制造器件的方法包括在衬底上形成层结构，在层结构上形成辅助层，在辅助层和衬底上形成平坦化层，通过化学机械抛光工艺使辅助层露出 以及至少部分去除所述辅助层以形成剩余辅助层或所述层结构和所述平坦化层的平坦表面。 化学机械抛光工艺相对于平坦化层具有第一去除速率，相对于辅助层具有第二去除速率，并且第一去除速率大于第二去除速率。
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公开(公告)号：US20150044386A1
公开(公告)日：2015-02-12
申请号：US14028578
申请日：2013-09-17
申请人： DVX, LLC
发明人： David Vilkomerson , Thomas Chilipka
IPC分类号： H01L41/314 , H01L41/317 , H01L41/297 , C23C28/00 , B05D1/04 , B05D1/18 , B05D1/00 , H01L41/316 , H01L41/45
CPC分类号： H01L41/22 , A61B8/4272 , A61B8/4281 , A61B8/4483 , A61B8/4494 , B06B1/067 , B06B1/0688 , H01L41/183 , H01L41/193 , H01L41/257 , H01L41/29 , H01L41/314 , H01L41/317 , H01L41/37 , H01L41/45 , H03H3/04 , H05K9/0094 , Y10T29/42
摘要： Matching layers improve the performance of ultrasonic transducers. Such layers have traditionally required significant effort and expense to be added to ultrasonic transducers. The present invention discloses a method of producing ultrasonic transducers with a matching layer, specifically for ultrasonic transducers utilizing piezopolymer transducer materials. Rather than the conventional method of forming the piezopolymer on a substrate and then attaching a matching layer through which the transducer emits its ultrasound energy, we teach depositing the piezopolymer on a substrate that also serves as a matching layer through which the ultrasound is emitted. We also teach depositing an additional shield layer for reducing electromagnetic interference. Methods of how to select materials and modify their ultrasonic characteristics are also discussed.
摘要翻译： 匹配层提高超声波换能器的性能。 这些层传统上需要大量的努力和费用才能添加到超声换能器中。 本发明公开了一种制造具有匹配层的超声波换能器的方法，特别涉及使用压电聚合物换能器材料的超声换能器。 而不是在基片上形成压电聚合物的常规方法，然后附加换能器通过该匹配层发射其超声能量的匹配层，我们教导了将压电聚合物沉积在也用作发射超声波的匹配层的基底上。 我们还教导了放置一个额外的屏蔽层，以减少电磁干扰。 还讨论了如何选择材料和修改其超声波特性的方法。
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公开(公告)号：US20140083973A1
公开(公告)日：2014-03-27
申请号：US14092624
申请日：2013-11-27
发明人： Sandra Obernhuber , Christof Jalics , Joerg Adler , Uwe Hoeckele , Walter Preis , Reinhard Goellner , Tanja Schest , Patricia Nickut
IPC分类号： H01L41/297
CPC分类号： H01L41/297 , H03H3/04
摘要： A method for manufacturing a device on a substrate includes forming a layer structure on the substrate, forming an auxiliary layer on the layer structure, forming a planarization layer on the auxiliary layer and on the substrate, exposing the auxiliary layer by a chemical mechanical polishing process and removing at least partly the auxiliary layer to form a planar surface of the remaining auxiliary layer or of the layer structure and the planarization layer. The chemical mechanical polishing process has a first removal rate with respect to the planarization layer and a second removal rate with respect to the auxiliary layer and the first removal rate is greater than the second removal rate.
摘要翻译： 在衬底上制造器件的方法包括在衬底上形成层结构，在层结构上形成辅助层，在辅助层和衬底上形成平坦化层，通过化学机械抛光工艺使辅助层露出 以及至少部分去除所述辅助层以形成剩余辅助层或所述层结构和所述平坦化层的平坦表面。 化学机械抛光工艺相对于平坦化层具有第一去除速率，相对于辅助层具有第二去除速率，并且第一去除速率大于第二去除速率。
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35.发明授权Piezoelectric device, ladder type filter, and method of producing the piezoelectric device 失效压电元件，梯型滤波器及压电元件的制造方法公开(公告)号：US06903498B2
公开(公告)日：2005-06-07
申请号：US10216377
申请日：2002-08-12
申请人： Toshihiko Unami , Jiro Inoue
发明人： Toshihiko Unami , Jiro Inoue
IPC分类号： H01L41/083 , H01L41/09 , H01L41/22 , H01L41/257 , H01L41/297 , H02N2/02 , H03H3/02 , H03H9/13 , H03H9/17 , H03H9/205 , H03H9/58 , H01L41/08
CPC分类号： H03H9/178 , H01L41/0471 , H01L41/083 , H01L41/0833 , H01L41/0926 , H03H3/02
摘要： A lamination type piezoelectric device includes a piezoelectric member that is longer in one direction, and a plurality of internal electrodes extending substantially perpendicularly to the longitudinal direction and arranged so as to be opposed to each other via piezoelectric layers, respectively. Bending vibration in which the piezoelectric member is bent substantially perpendicularly to the longitudinal direction thereof is excited using a piezoelectric longitudinal effect.
摘要翻译： 叠层型压电元件包括在一个方向上较长的压电元件以及大体上垂直于纵向方向延伸的多个内部电极，并分别经由压电层彼此相对配置。 使用压电纵向效应来激励压电元件基本上垂直于其纵向方向弯曲的弯曲振动。
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公开(公告)号：US5163209A
公开(公告)日：1992-11-17
申请号：US510875
申请日：1990-04-18
IPC分类号： H01L41/047 , H01L41/083 , H01L41/297
CPC分类号： H01L41/297 , H01L41/0477 , H01L41/083 , Y10T29/42
摘要： In an overall stacked piezoelectric element, the material for the electrode was selected from aluminum, nickel and copper each alone or alloys based on aluminum, nickel or copper, and further the parts of the electrode which contact with molding resin on the side face of the stacked body and the parts which have to be insulated from the lead-out terminals were subjected to an oxidation or nitriding treatment. As the result, an improved element was obtained which is of a high reliability, suited to low voltage operation and suffers no short-circuit of the electrode even when water permeates to the side face of the stacked body during operation in humid atmosphere.
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公开(公告)号：US11527706B2
公开(公告)日：2022-12-13
申请号：US16027574
申请日：2018-07-05
发明人： Takeshi Kijima , Yasuaki Hamada , Yuuji Honda
IPC分类号： H01L41/187 , H01L41/047 , H01L41/297 , H01L41/314 , H01L41/083 , H01L41/316 , H01L41/318 , H01L41/08
摘要： A film structure body has: a substrate that is a silicon substrate including an upper surface composed of a (100) plane; an orientation film including a zirconium oxide film that is cubic crystal (100)-oriented on the upper surface; and a conductive film including a platinum film that is cubic crystal (100)-oriented on the orientation film.
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公开(公告)号：US20220344575A1
公开(公告)日：2022-10-27
申请号：US17241620
申请日：2021-04-27
发明人： Chih-Ming Chen , Chiao-Chun Hsu , Chung-Yi Yu
IPC分类号： H01L41/273 , C23C16/458 , C23C16/46 , H01L41/297 , H01L41/318
摘要： In some embodiments, the present disclosure relates to a processing tool that includes a wafer chuck disposed within a hot plate chamber and having an upper surface configured to hold a semiconductor wafer. A heating element is disposed within the wafer chuck and configured to increase a temperature of the wafer chuck. A motor is coupled to the wafer chuck and configured to rotate the wafer chuck around an axis of rotation extending through the upper surface of the wafer chuck. The processing tool further includes control circuitry coupled to the motor and configured to operate the motor to rotate the wafer chuck while the temperature of the wafer chuck is increased to form a piezoelectric layer from a sol-gel solution layer on the semiconductor wafer.
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公开(公告)号：US11088314B2
公开(公告)日：2021-08-10
申请号：US16225419
申请日：2018-12-19
发明人： Lei Zhao
IPC分类号： H01L41/08 , H01L41/297 , H01L41/09 , B81C1/00 , H01L41/332 , B81B7/04 , H01L41/113 , H01L41/23
摘要： The present disclosure provides an ultrasonic transducer and a method for manufacturing an ultrasonic transducer, a display substrate and a method for manufacturing a display substrate. The method for manufacturing the ultrasonic transducer includes: forming a via hole in a substrate; forming a structural layer on a side of the substrate, the structural layer cover the via hole; and etching the structural layer from a side of the substrate away from the structural layer by using the substrate formed with the via hole as a blocking layer, to form a cavity at a position of the structural layer corresponding to that of the via hole.
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公开(公告)号：US20210166883A1
公开(公告)日：2021-06-03
申请号：US17168757
申请日：2021-02-05
发明人： Daizo Ito
IPC分类号： H01G4/30 , H01G4/012 , H01G4/12 , H01L41/047 , H01L41/083 , H01L41/297 , H01L41/338 , H01C7/00 , H01C17/28
摘要： Even with the occurrence of misalignment of inner electrodes in a ceramic collective board, a multilayer electronic component is made in which inner electrodes are disposed at suitable positions. Disclosed herein are descriptions of a first-stage ceramic collective board and a second-stage ceramic collective board used for manufacturing a multilayer electronic component. The present disclosure further describes a manufacturing method for the second-stage ceramic collective board and a manufacturing method for a multilayer electronic component.
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