摘要:
Resistance or side electrodes of a chip resistor is prevented from being lost due to chemical reaction with NaCl contained in human sweat and so on when human sweat, seawater, etc. are adhered thereto. The chip resistor comprises an insulating substrate, thick-film upper surface electrodes formed at opposite ends of the top surface of the insulating substrate, a thin-film resistance made of a constituent material not reacting with NaCl, and formed so as to be extended over the upper surface of the insulating substrate and respective portions of the upper surface of the thick-film upper surface electrodes, thick-film back surface electrodes formed at spots on the back surface of the insulating substrate, corresponding to the thick-film upper surface electrodes, respectively, and thick-film side surface electrodes connecting the thick-film back surface electrodes with respective portions of the thick-film upper surface electrodes, exposed out of the thin-film resistance, respectively.
摘要:
A nonlinear resistor is formed by forming side surface insulating layer 2 on a sintered body 1 which contains zinc oxide as a main component and providing a pair of electrodes 3 on upper and lower surfaces of the sintered body 1. The electrodes 3 are formed by plasma thermal spraying of less than 10 kW in an atmosphere in which an oxygen concentration is set to 22 volume % or less. The electrodes 3 are formed of aluminum, copper, zinc, nickel, silver, or their alloy whose average particle size is within 5 .mu.m to 50 .mu.m. Preferably porosity is less than 15%, weight percentage of metal oxide is less than 25%, average film thickness is within 5 .mu.m to 500 .mu.m, average surface roughness is less than 8 .mu.m, and resistivity is less than 15 .mu..OMEGA..multidot.cm. Accordingly, the nonlinear resistor having the excellent discharge withstand can be provided.
摘要:
A resistor comprising a substrate, a pair of first top electrode layers disposed at least on the top face of the substrate, a resistance layer disposed so as to electrically connect with the first top electrode layers, a protective layer disposed so as to cover at least the resistance layer, and a pair of second top electrode layers disposed at least on the top faces of the pair of first top electrode layers. At least one of the pairs of first top electrode layers or second top electrode layers partially extends to the substrate side faces.
摘要:
An electrical device comprising a resistive element having a first electrode in electrical contact with the top surface of the resistive element and a second electrode in electrical contact with the bottom surface of the resistive element. An insulating layer is formed on the first and second electrodes. A portion of the insulating layer is removed from the first and second electrodes to form first and second contact points. A conductive layer is formed on the insulating layer and makes electrical contact with the first and second electrodes at the contact points. The conductive layer has portions removed to form first and second end terminations separated by electrically non-conductive gaps. The wrap-around configuration of the device allows for an electrical connection to be made to both electrodes from the same side of the electrical device.
摘要:
A jig in a plate form capable of efficient formation of side electrodes on electronic components in a plate form. After electrode formation on one side of each electronic component, an electrode can be formed on the other side without causing spalling or chipping of the already formed side electrode. The jig 1 includes a core member 3 having a soft member 4 joined thereto and has a multiple of grooves 5 and 6 formed on reverse sides, respectively, in such a way that aligned electronic components A can be pushed into the grooves. The inner sides of each groove are composed of the soft member 4. Side electrodes B are formed on both sides of an electronic component as it is held between the opposed inner sides of grooves 5 or 6. The grooves 6 on the reverse side of the jig 1 into which the first formed side electrodes B are to be fitted may be sized to be wider than the grooves 5 on the reverse side so that electronic components A can be pushed into and pulled out of the grooves 6 without causing spalling and chipping of the already formed side electrodes B.
摘要:
The invention is directed to a thick film conductor composition wherein such compositions have improved solderability and adhesion to substrates due to the addition of a crystalline material from the feldspar family.
摘要:
A bulk metal chip resistor includes an elongated resistor element having terminals at its opposite ends. The terminals are formed by coating the opposite ends of the resistor element with a conductive material. Insulative material may be molded around the center portion of the resistor to provide structural support, and the ends of the resistor can be bent downwardly so as to cause the central portion to be raised when the resistor is mounted on a circuit board. A modified form of the invention includes wrapping the resistance element around the ends of a rectangular substrate so that the substrate provides structural support. Another modified form includes placing four terminals at the four corners of the resistor element.
摘要:
An improved electronic device having metal-glazing type end terminations comprising a surface metal phase of Sn or Zn, is produced by sintering a paste material containing a matrix metal powder (Cu and/or Ni), a fluxing metal powder and an organic binding material, so that the surface portion serves to improve wettability and solderability of the end termination owing to its composition being similar to solder.
摘要:
A detection element including a cylindrical base body, an electric resistor formed on an outer peripheral surface of the base body, and lead wires attached to ends of the base body. The lead wires are electrically connected to the electric resistor. An electrically thick film is provided over end faces of the base body, an inner peripheral surface and an outer peripheral surface of the base body near each of the opposite ends of the base body, and the lead wires are electrically connected to the resistor at least through the electrically conductive thick film. A process for producing such a detecting element including forming an electric resistor on an outer periphery of a cylindrical base body; coating a paste onto end faces of the base body and inner and outer peripheral surfaces of the base body near each of the end faces; forming the electrically conductive thick film electrically connected to the electrical resistor by firing the electrically conductive thick film-forming paste; and fixing the lead wires to the end portions of the base body and forming electrically conductive portions where the lead wire is electrically connected to the electrically conductive thick film.
摘要:
A ceramic sensor device is disclosed which comprises a sensing element of a ceramic material and electric conductors for connection to external circuit which are tightly embedded within a ceramic insulating body. The solid state sensor device having an excellent capability to withstand detrimental conditions such as a high temperature, rapid temperature change and mechanical shocks is provided. The sensor is advantageously used as a temperature sensor, a moisture sensor and a gas sensor for detecting oxidizing and reducing gas. Above all, the sensor is suited as a temperature sensor device for detecting temperature of exhaust gas purifying catalyst used in motor vehicles.