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    Methods of manufacturing printed circuit boards
    401.
    发明授权
    Methods of manufacturing printed circuit boards 有权
    制造印刷电路板的方法

    公开(公告)号：US08567053B2

    公开(公告)日：2013-10-29

    申请号：US13153254

    申请日：2011-06-03

    Applicant: Rajesh Kumar ,  Monte P. Dreyer ,  Michael J. Taylor

    Inventor： Rajesh Kumar ,  Monte P. Dreyer ,  Michael J. Taylor

    IPC: H01K3/10

    CPC classification number: H05K3/4623 ,  H05K3/4069 ,  H05K3/4614 ,  H05K2201/0195 ,  H05K2201/096 ,  H05K2203/061 ,  Y10T29/49124 ,  Y10T29/49126 ,  Y10T29/49146 ,  Y10T29/49165 ,  Y10T29/532

    Abstract: Systems and methods of manufacturing printed circuit boards using blind and internal micro vias to couple subassemblies. An embodiment of the invention provides a method of manufacturing a printed circuit including attaching a plurality of metal layer carriers to form a first subassembly including at least one copper foil pad on a first surface, applying an encapsulation material onto the first surface of the first subassembly, curing the encapsulation material and the first subassembly; applying a lamination adhesive to a surface of the cured encapsulation material, forming at least one via in the lamination adhesive and the cured encapsulation material to expose the at least one copper foil pad, attaching a plurality of metal layer carriers to form a second subassembly, and attaching the first subassembly and the second subassembly.

    Abstract translation: 使用盲孔和内部微通孔来制造印刷电路板来耦合子组件的系统和方法。 本发明的一个实施例提供一种制造印刷电路的方法，包括附接多个金属层载体以形成第一子组件，该第一子组件包括在第一表面上的至少一个铜箔焊盘，将封装材料施加到第一子组件的第一表面上 固化封装材料和第一子组件; 在所述固化的包封材料的表面上施加层压粘合剂，在所述层压粘合剂和所述固化的封装材料中形成至少一个通孔，以暴露所述至少一个铜箔垫，附接多个金属层载体以形成第二子组件， 以及附接第一子组件和第二子组件。

    AUTOFOCUSING ENDOSCOPE AND SYSTEM
    402.
    发明申请
    AUTOFOCUSING ENDOSCOPE AND SYSTEM 审中-公开
    自动注射内镜和系统

    公开(公告)号：US20130253313A1

    公开(公告)日：2013-09-26

    申请号：US13813896

    申请日：2011-08-02

    Applicant: Jin Kang ,  Marcin Arkadiusz Balicki ,  Rajesh Kumar ,  Russell H. Taylor

    Inventor： Jin Kang ,  Marcin Arkadiusz Balicki ,  Rajesh Kumar ,  Russell H. Taylor

    IPC: A61B1/00 ,  A61B3/10 ,  A61B1/07

    CPC classification number: A61B1/00188 ,  A61B1/00004 ,  A61B1/00165 ,  A61B1/00172 ,  A61B1/0669 ,  A61B1/07 ,  A61B1/313 ,  A61B3/102 ,  A61B3/1225 ,  A61F9/007

    Abstract: An autofocusing endoscope includes an objective lens, a relay optical system arranged to relay an image between the objective lens and a proximal end of the autofocusing endoscope, an optical fiber arranged with a distal end proximate the objective lens, a light source arranged to couple light into the optical fiber, an optical detection system arranged to receive and detect light from the optical fiber, and a data processor constructed to communicate with the optical detection system while in operation. The data processor is configured to determine a distance of a surface to be imaged through the objective lens and provide instructions for adjusting a focus of the autofocusing endoscope of the surface.

    Abstract translation: 一种自动对焦内窥镜，包括：物镜;中继光学系统，被配置为中继所述物镜与所述自聚焦内窥镜的近端之间的图像，配置有靠近所述物镜的远端的光纤;光源， 光纤检测系统被布置成接收和检测来自光纤的光;以及数据处理器，被构造成在操作中与光学检测系统进行通信。 数据处理器被配置为确定要通过物镜成像的表面的距离，并提供用于调整表面的自动聚焦内窥镜的焦点的指令。

    Real time lockdown
    406.
    发明授权
    Real time lockdown 有权

    公开(公告)号：US08453243B2

    公开(公告)日：2013-05-28

    申请号：US11319678

    申请日：2005-12-28

    Applicant: Rajesh Kumar Sharma ,  Winping Lo ,  Joseph Papa

    Inventor： Rajesh Kumar Sharma ,  Winping Lo ,  Joseph Papa

    IPC: H04L29/06

    CPC classification number: G06F21/51 ,  G06F21/54 ,  G06F21/554 ,  G06F21/56 ,  G06F21/60

    Abstract: A system and method that trusts software executables existent on a machine prior to activation for different types of accesses e.g. execution, network, and registry. The system detects new executables added to the machine as well as previously existent executables that have been modified, moved, renamed or deleted. In certain embodiments, the system will tag the file with a flag as modified or newly added. Once tagged, the system intercepts particular types of file accesses for execution, network or registry. The system determines if the file performing the access is flagged and may apply one or more policies based on the requested access. In certain embodiments, the system intercepts I/O operations by file systems or file system volumes and flags metadata associated with the file. For example, the NT File System and its extended attributes and alternate streams may be utilized to implement the system.

    Semiconductor device having D mode JFET and E mode JFET and method for manufacturing the same
    410.
    发明授权
    Semiconductor device having D mode JFET and E mode JFET and method for manufacturing the same 有权
    具有D型JFET和E型JFET的半导体器件及其制造方法

    公开(公告)号：US08373209B2

    公开(公告)日：2013-02-12

    申请号：US12974516

    申请日：2010-12-21

    Applicant: Rajesh Kumar Malhan ,  Naohiro Sugiyama

    Inventor： Rajesh Kumar Malhan ,  Naohiro Sugiyama

    IPC: H01L29/12

    CPC classification number: H01L29/808 ,  H01L29/1058 ,  H01L29/1066 ,  H01L29/1608 ,  H01L29/66068

    Abstract: A semiconductor device includes: a substrate; and depletion and enhancement mode JFETs. The depletion mode JFET includes: a concavity on the substrate; a channel layer in the concavity; a first gate region on the channel layer; first source and drain regions on respective sides of the first gate region in the channel layer; first gate, source and drain electrodes. The enhancement mode JFET includes: a convexity on the substrate; the channel layer on the convexity; a second gate region on the channel layer; second source and drain regions on respective sides of the second gate region in the channel layer; second gate, source and drain electrodes. A thickness of the channel layer in the concavity is larger than a thickness of the channel layer on the convexity.

    Abstract translation: 半导体器件包括：衬底; 以及耗尽和增强型JFET。 耗尽型JFET包括：衬底上的凹面; 凹陷中的沟道层; 沟道层上的第一栅极区; 在沟道层中的第一栅极区域的相应侧上的第一源极和漏极区域; 第一栅极，源极和漏极。 增强模式JFET包括：在衬底上的凸起; 沟道层上凸; 沟道层上的第二栅极区; 在沟道层中的第二栅极区的相应侧上的第二源极和漏极区; 第二栅极，源极和漏极。 凹槽中的沟道层的厚度大于沟槽层的厚度。

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