公开(公告)号：US4570150A

公开(公告)日：1986-02-11

申请号：US561306

申请日：1983-12-14

申请人： Felix Zandman ,  Frank P. Sandone, Jr

发明人： Felix Zandman ,  Frank P. Sandone, Jr

IPC分类号： H01C1/144 ,  H01C7/22

CPC分类号： H01C1/144 ,  H01C7/22 ,  Y10T29/49087

摘要： A precision resistor of the type formed by defining a resistive path in a thin foil of resistance material attached to a substrate. Metallic interface layers are deposited on terminal pads between which the resistive path extends, so that when solder-coated copper leads are spot-welded to the terminal pads, the junction between the copper leads and the terminal pads is both a spot-weld and a solder connection.

摘要翻译： 一种精密电阻器，其类型是通过在电阻材料的薄箔中限定电阻性路径而形成的，该电阻材料附着在基板上。 金属界面层沉积在电阻路径延伸的端子焊盘之间，以便当焊接的铜引线点焊到端子焊盘上时，铜引线和端子焊盘之间的连接点是点焊和 焊接连接。

公开(公告)号：US4378549A

公开(公告)日：1983-03-29

申请号：US185756

申请日：1980-09-10

申请人： Joseph Szware

发明人： Joseph Szware

IPC分类号： H01C7/22 ,  H01C17/07 ,  H01C17/23 ,  H01C10/00

CPC分类号： H01C17/23 ,  H01C17/07 ,  H01C7/22 ,  Y10T29/49099

摘要： Improved resistive electrical components are disclosed comprising an insulating or insulated substrate, a resistive foil bonded to the substrate having photoetched therein a pair of terminal pads for making electrical connections to the component and a system of resistive paths interconnecting the terminal pads, said system including an unadjustable section or sections and a plurality of adjustable sections, each having an adjustment tab associated therewith, said tab being removable to modify said section resistance and thereby altering the total resistance presented by the component between its terminal pads, the configurations of the sections differing from each other in a modified geometric progression so that the total resistance of said component is altered by a differing amount depending on which of the sections is modified by removal of its associated adjustment tab, whereby the total resistance of the component may be systematically varied in a sequence of successive steps to achieve a desired ultimate value of the total resistance of the component to the desired degree of accuracy with the least number of steps, the most effective use of substrate surface area, the least contribution to reliability degradation, and the lowest cost. Adjustment of the total resistance of the component to its desired ultimate value and precision is assisted by monitoring the component resistance while making successive adjustments. Placement of said adjustment tabs along one edge of said substrate simplifies manual adjustment and makes practical the use of automatic apparatus controlled by a monitor.

公开(公告)号：US4324547A

公开(公告)日：1982-04-13

申请号：US001009

申请日：1979-01-04

申请人： Mircea Arcan ,  Benedict Heinrich

发明人： Mircea Arcan ,  Benedict Heinrich

IPC分类号： A61C9/00 ,  A61C19/05

CPC分类号： A61C9/00 ,  A61C19/05

摘要： Qualitative as well as quantitative evaluation of bite characteristics is performed by subjecting to bite forces pieces of material which exhibits photoelastic memory and studying the resulting impression with a polariscope. A permanent record can also be obtained.

摘要翻译： 咬定特性的定性和定量评估是通过咬合力展示光弹记忆的材料并用偏光镜研究产生的印象来进行的。 也可以获得永久记录。

公开(公告)号：US4138656A

公开(公告)日：1979-02-06

申请号：US742030

申请日：1976-11-15

申请人： Leon Resnicow

发明人： Leon Resnicow

IPC分类号： H01C1/14 ,  H01C1/144

CPC分类号： H01C1/144

摘要： An electrical component, comprising an insulating substrate having conductive material applied to one side thereof and including terminal pad portions for attaching electrically connecting leads thereto, in which said leads are provided with relatively thick rigid portions adapted to extend externally of the component to provide means for making electrical connections thereto and have relatively thinner, less rigid portions mechanically bonded to the other side of said substrate and have end portions dressed around the edge of said substrate to said one side thereof and electrically connected to said terminal pad portions by brazing, welding or soldering. In a preferred form, said leads may be bonded to said substrate by epoxy or other suitable cement and the end portions thereof may be made even thinner than the remainder of said thinner portions to facilitate dressing them around the edge of said substrate into contact with said terminal pad portions.

摘要翻译： 一种电气部件，包括具有施加到其一侧的导电材料的绝缘基板，并且包括用于将电连接引线附接到其上的端子焊盘部分，其中所述引线设置有相对较厚的刚性部分，其适于在部件的外部延伸以提供用于 与其形成电连接并且具有相对较薄，较少的刚性部分机械地结合到所述基板的另一侧，并且具有围绕所述基板的边缘周边的端部，以其一侧固定并且通过钎焊，焊接或电连接到所述端子焊盘部分 焊接。 在优选形式中，所述引线可以通过环氧树脂或其它合适的粘合剂结合到所述基底，并且其端部可以制成得比所述较薄部分的其余部分更薄，以便于使它们围绕所述基底的边缘进行修整，使其与所述 端子焊盘部分。

公开(公告)号：US3782182A

公开(公告)日：1974-01-01

申请号：US3782182D

申请日：1971-04-29

申请人： VISHAY INTERTECHNOLOGY INC

发明人： STARR J

IPC分类号： G01B7/16 ,  G01L1/22 ,  G01B7/18

CPC分类号： G01B7/18 ,  G01L1/2206

摘要： A strain multiplier is provided which is designed to be firmly attached to both a structural surface and a sensing gage at all points of contact between the multiplier and the structural surface and the multiplier and the sensing gage while preventing direct contact between the sensing gage and the structural surface.

摘要翻译： 提供了一种应变倍增器，其被设计成在乘法器和结构表面以及乘法器和感测量规之间的所有接触点牢固地附接到结构表面和感测量规，同时防止感测量规和 结构面。

公开(公告)号：US3517436A

公开(公告)日：1970-06-30

申请号：US70179467

申请日：1967-11-01

申请人： VISHAY INTERTECHNOLOGY INC

发明人： ZANDMAN FELIX ,  BOYD BRANIN A

IPC分类号： H01C1/024 ,  H01C7/06 ,  H01C17/232 ,  H01C17/24 ,  H01C17/245 ,  H01C1/02 ,  H01C17/00

CPC分类号： H01C1/024 ,  H01C7/06 ,  H01C17/232 ,  H01C17/2416 ,  H01C17/245 ,  Y10T29/49087 ,  Y10T29/49099

公开(公告)号：US11862648B2

公开(公告)日：2024-01-02

申请号：US17012683

申请日：2020-09-04

申请人： VISHAY INTERTECHNOLOGY, INC.

发明人： Koon-Wing Tsang ,  Yuh-Min Lin

IPC分类号： H01L27/144 ,  H01L31/0216 ,  G01J3/02 ,  G01J3/28 ,  H01L31/101

CPC分类号： H01L27/1446 ,  G01J3/0229 ,  G01J3/2803 ,  H01L31/02164 ,  H01L31/02165 ,  H01L31/1013 ,  G01J2003/2806

摘要： An optoelectronic device is disclosed, comprising: a photodiode array including a plurality of first photodiodes, each first photodiode including a respective n+ region and a respective n-well region; a guide array disposed over the photodiode array, the guide array including a plurality of guide members separated from one another by a layer of light-blocking material, the guide members being aligned with the n+ regions of the first photodiodes, such that each guide member is disposed over a different respective n+ region, and the layer of light-blocking material being aligned with the n-well regions of the first photodiodes; and a filter array disposed over the guide array, the filter array including a plurality of bandpass filters, each bandpass filter being aligned with a different one of the plurality of guide members, each bandpass filter having a different transmission band.

公开(公告)号：US08514051B2

公开(公告)日：2013-08-20

申请号：US13185065

申请日：2011-07-18

申请人： Michael Belman ,  Leonid Akhtman

发明人： Michael Belman ,  Leonid Akhtman

IPC分类号： H01C1/012

CPC分类号： H01C1/034 ,  H01C17/288

摘要： A chip resistor includes an insulating substrate 11, top terminal electrodes 12 formed on top surface of the substrate using silver-based cermet, bottom electrodes 13, resistive element 14 that is situated between the top terminal electrodes 12 and overlaps them partially, an optional internal protective coating 15 that covers resistive element 14 completely or partially, an external protective coating 16 that covers completely the internal protection coating 15 and partially covers top terminal electrodes 12, a plated layer of nickel 17 that covers face sides of the substrate, top 12 and bottom 13 electrodes, and overlaps partially external protective coating 16, finishing plated layer 18 that covers nickel layer 17. The overlap of nickel layer 17 and external protective layer 16 possesses a sealing property because of metallization of the edges of external protective layer 16 prior to the nickel plating process.

摘要翻译： 芯片电阻器包括绝缘基板11，使用银基金属陶瓷在基板的顶表面上形成的顶部端子电极12，底部电极13，位于顶部端子电极12之间并与其部分重叠的电阻元件14，可选内部 完全或部分覆盖电阻元件14的保护涂层15，完全覆盖内部保护涂层15并且部分地覆盖顶部端子电极12的外部保护涂层16，覆盖基底的正面的镍17的镀层，顶部12和 底部13个电极，并且部分地覆盖外部保护涂层16，覆盖镍层17的整理镀层18.镍层17和外部保护层16的重叠由于外部保护层16的边缘的金属化而具有密封特性， 镀镍工艺。

公开(公告)号：US08126410B2

公开(公告)日：2012-02-28

申请号：US12134467

申请日：2008-06-06

申请人： Dani Alon ,  David Ben-Bassat

发明人： Dani Alon ,  David Ben-Bassat

IPC分类号： H04C1/52

CPC分类号： H01Q9/0442 ,  H01Q9/0485

摘要： A novel antenna system for receiving transmissions in the VHF and UHF frequency bands particularly suitable as a miniaturized antenna for UHF reception, such as of digital video broadcasting transmissions. The antenna system utilizes a combination of three techniques including (1) the use of dialect loading using a high dielectric constant ceramic substrate; (2) an antenna dielectrically loaded and tuned to a significantly higher frequency than desired; and (3) use of a tuning circuit to compensate for the frequency offset of the antenna thereby shifting the resonant frequency to cover the entire band. The antenna is intentionally designed to be too small to radiate at the frequency of interest. The antenna element is then ‘forced’ to be tuned to the desired lower frequency using passive (or active) reactive components as part of a tuning circuit. Multi-band operation is achieved by providing a bypass switch to connect the antenna element either to (1) a first receiver without the tuning circuit (i.e. high frequency tuning) or (2) a second receiver with the tuning circuit (i.e. low frequency tuning).

摘要翻译： 一种用于在VHF和UHF频带中接收传输的新型天线系统，特别适用于UHF接收的小型化天线，例如数字视频广播传输。 天线系统采用三种技术的组合，包括（1）使用高介电常数陶瓷衬底的方言负载; （2）天线介电加载并调谐到比所需频率高得多的频率; 和（3）使用调谐电路来补偿天线的频率偏移，从而使谐振频率移动以覆盖整个频带。 天线有意设计成太小，不能以感兴趣的频率辐射。 作为调谐电路的一部分，使用无源（或有源）无功元件将天线元件“强制”调谐到期望的较低频率。 通过提供旁路开关来将天线元件连接到（1）没有调谐电路的第一接收器（即高频调谐）或（2）具有调谐电路的第二接收器（即低频调谐）来实现多频带操作 ）。

公开(公告)号：US20110176247A1

公开(公告)日：2011-07-21

申请号：US13075752

申请日：2011-03-30

申请人： Haim Goldberger ,  Sik Lui ,  Jacek Korec ,  Y. Mohammed Kasem ,  Harianto Wong ,  Jack Van Den Heuvel

发明人： Haim Goldberger ,  Sik Lui ,  Jacek Korec ,  Y. Mohammed Kasem ,  Harianto Wong ,  Jack Van Den Heuvel

IPC分类号： H02H9/00 ,  H01L21/20 ,  H01L29/92

CPC分类号： H01G4/33 ,  H01G4/38 ,  H01L23/481 ,  H01L28/40 ,  H01L29/66181 ,  H01L29/945 ,  H01L2224/0401 ,  H01L2224/05 ,  H01L2224/13025 ,  H01L2224/131 ,  H01L2924/13091 ,  Y10S438/957 ,  H01L2924/014 ,  H01L2924/00

摘要： A precision high-frequency capacitor includes a dielectric layer formed on the front side surface of a semiconductor substrate and a first electrode on top of the dielectric layer. The semiconductor substrate is heavily doped and therefore has a low resistivity. A second electrode, insulated from the first electrode, is also formed over the front side surface. In one embodiment, the second electrode is connected by a metal-filled via to a layer of conductive material on the back side of the substrate. In alternative embodiments, the via is omitted and the second electrode is either in electrical contact with the substrate or is formed on top of the dielectric layer, yielding a pair of series-connected capacitors. ESD protection for the capacitor can be provided by a pair of oppositely-directed diodes formed in the substrate and connected in parallel with the capacitor. To increase the capacitance of the capacitor while maintaining a low effective series resistance, each of the electrodes may include a plurality of fingers, which are interdigitated with the fingers of the other electrode. The capacitor is preferably fabricated in a wafer-scale process concurrently with numerous other capacitors on the wafer, and the capacitors are then separated from each other by a conventional dicing technique.

摘要翻译： 精密高频电容器包括形成在半导体衬底的前侧表面上的电介质层和位于电介质层顶部的第一电极。 半导体衬底是重掺杂的，因此具有低电阻率。 与第一电极绝缘的第二电极也形成在前侧表面上。 在一个实施例中，第二电极通过金属填充的通孔连接到衬底背面上的导电材料层。 在替代实施例中，省略通孔，并且第二电极与衬底电接触或者形成在电介质层的顶部，从而产生一对串联电容器。 电容器的ESD保护可以由形成在衬底中并与电容器并联连接的一对相反方向的二极管提供。 为了在保持低有效串联电阻的同时增加电容器的电容，每个电极可以包括与另一个电极的指状物交叉的多个指状物。 电容器优选与晶片上的许多其它电容器同时地以晶片级工艺制造，然后通过常规的切割技术将电容器彼此分离。