公开(公告)号：US08405212B2

公开(公告)日：2013-03-26

申请号：US12818422

申请日：2010-06-18

Applicant: Chi-Chih Chu ,  Cheng-Yi Weng

Inventor： Chi-Chih Chu ,  Cheng-Yi Weng

IPC: H01L23/48 ,  H01L23/52 ,  H01L29/40

CPC classification number: H01L23/3128 ,  H01L23/49816 ,  H01L24/48 ,  H01L24/73 ,  H01L2224/32225 ,  H01L2224/48225 ,  H01L2224/48227 ,  H01L2224/73265 ,  H01L2924/00014 ,  H01L2924/15311 ,  H01L2924/15331 ,  H01L2924/181 ,  H01L2924/00012 ,  H01L2924/00 ,  H01L2224/45099 ,  H01L2224/45015 ,  H01L2924/207

Abstract: The present invention relates to a semiconductor package. The semiconductor package includes a substrate, at least one chip, a plurality of conductive elements, a plurality of first conductors and a molding compound. The substrate has a plurality of first pads and a solder mask. The first pads are exposed to a first surface of the substrate, and the material of the first pads is copper. The solder mask is disposed on the first surface, contacts the first pads directly, and has at least one opening so as to expose part of the first pads. The chip is mounted on the first surface of the substrate. The conductive elements electrically connect the chip and the substrate. The first conductors are disposed on the first pads. The molding compound is disposed on the first surface of the substrate, and encapsulates the chip, the conductive elements and part of the first conductors. Whereby, the solder mask contacts the first pads directly, and thus results in higher bonding strength, so as to avoid the bridge between the first conductors caused by the first conductors permeating into the interface between the solder mask and the first pads.

Abstract translation: 本发明涉及半导体封装。 半导体封装包括衬底，至少一个芯片，多个导电元件，多个第一导体和模制化合物。 基板具有多个第一焊盘和焊接掩模。 第一焊盘暴露于衬底的第一表面，并且第一焊盘的材料是铜。 焊接掩模设置在第一表面上，直接接触第一焊盘，并且具有至少一个开口以暴露第一焊盘的部分。 芯片安装在基板的第一表面上。 导电元件电连接芯片和基板。 第一导体设置在第一焊盘上。 模塑料配置在基板的第一表面上，并封装芯片，导电元件和第一导体的一部分。 由此，焊接掩模直接接触第一焊盘，从而导致更高的焊接强度，以避免第一导体之间由第一导体渗入焊料掩模和第一焊盘之间的界面引起的桥。

公开(公告)号：US20120170119A1

公开(公告)日：2012-07-05

申请号：US13174097

申请日：2011-06-30

Applicant: Yi-Chih CHU ,  Ching-Chung Hung

Inventor： Yi-Chih CHU ,  Ching-Chung Hung

IPC: G03B17/00

CPC classification number: G03B17/55 ,  G02B27/0006 ,  G03B11/00

Abstract: The present invention relates to a defogging and defrosting devices for the protective lens of camera, which includes a heater that is coupled to a control circuit panel, a thermal gasket that is in contact contacting with the heater, receives the heat from the heater and transmits the heat to the glass or mirror object which contacts with in order to avoid and prevent the loss of lucidity of the glass or mirror object due to humidity. The defogging and defrosting device is installed on the body of the camera instead of on the protective lens in order to avoid shading the camera view and to facilitate the removal of protective lens while adjusting the focus of the camera. It also facilitates the replacement of the protective lens of the camera.

Abstract translation: 本发明涉及一种用于相机保护镜头的除雾除霜装置，其包括耦合到控制电路板的加热器，与加热器接触接触的热垫片，从加热器接收热量并传输 与玻璃或镜子物体接触的热量，以避免和防止由于湿度导致的玻璃或镜面物体的透明度的损失。 除雾和除霜装置安装在相机的主体而不是保护镜头上，以避免遮挡相机视图，并在调整相机焦距的同时方便拆卸保护镜头。 它还有助于更换相机的保护镜头。

公开(公告)号：US08076765B2

公开(公告)日：2011-12-13

申请号：US12507305

申请日：2009-07-22

Applicant: Kuang-Hsiung Chen ,  Chi-Chih Shen ,  Jen-Chuan Chen ,  Wen-Hsiung Chang ,  Hui-Shan Chang ,  Pei-Yu Hsu ,  Fa-Hao Wu ,  Chen-Yu Chia ,  Chi-Chih Chu ,  Cheng-Yi Weng ,  Ya-Wen Hsu

Inventor： Kuang-Hsiung Chen ,  Chi-Chih Shen ,  Jen-Chuan Chen ,  Wen-Hsiung Chang ,  Hui-Shan Chang ,  Pei-Yu Hsu ,  Fa-Hao Wu ,  Chen-Yu Chia ,  Chi-Chih Chu ,  Cheng-Yi Weng ,  Ya-Wen Hsu

IPC: H01L21/44 ,  H01L21/302 ,  H01L21/461

CPC classification number: H01L23/3128 ,  H01L21/565 ,  H01L23/49816 ,  H01L24/45 ,  H01L24/48 ,  H01L24/73 ,  H01L24/97 ,  H01L25/105 ,  H01L2224/16225 ,  H01L2224/32145 ,  H01L2224/32225 ,  H01L2224/45144 ,  H01L2224/45147 ,  H01L2224/45565 ,  H01L2224/45664 ,  H01L2224/48091 ,  H01L2224/48145 ,  H01L2224/48227 ,  H01L2224/73204 ,  H01L2224/73265 ,  H01L2224/97 ,  H01L2225/1023 ,  H01L2225/1058 ,  H01L2924/00011 ,  H01L2924/00014 ,  H01L2924/01046 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/15311 ,  H01L2924/15321 ,  H01L2924/15331 ,  H01L2924/181 ,  H01L2924/1815 ,  H01L2924/3511 ,  H01L2924/00012 ,  H01L2224/85 ,  H01L2924/00 ,  H01L2224/0401 ,  H01L2224/45015 ,  H01L2924/207

Abstract: In one embodiment, a semiconductor device package includes: (1) a substrate unit; (2) connecting elements disposed adjacent to a periphery of the substrate unit and extending upwardly from an upper surface of the substrate unit; (3) a semiconductor device disposed adjacent to the upper surface of the substrate unit and electrically connected to the substrate unit; and (4) a package body disposed adjacent to the upper surface of the substrate unit and covering the semiconductor device. A lateral surface of the package body is substantially aligned with a lateral surface of the substrate unit. The package body defines openings that at least partially expose respective ones of the connecting elements. At least one of the connecting elements has a width WC, and at least one of the openings has a width WU adjacent to an upper surface of the package body, such that WU>WC.

Abstract translation: 在一个实施例中，半导体器件封装包括：（1）衬底单元; （2）连接元件，其邻近所述基板单元的周边设置并从所述基板单元的上表面向上延伸; （3）半导体器件，与所述衬底单元的上表面相邻并且电连接到所述衬底单元; 和（4）与衬底单元的上表面相邻并且覆盖半导体器件的封装体。 封装主体的侧表面基本上与衬底单元的侧表面对准。 包装体限定了至少部分地暴露相应的连接元件的开口。 连接元件中的至少一个具有宽度WC，并且至少一个开口具有与封装主体的上表面相邻的宽度WU，使得WU> WC。

公开(公告)号：US20110156251A1

公开(公告)日：2011-06-30

申请号：US12818422

申请日：2010-06-18

Applicant: Chi-Chih Chu ,  Cheng-Yi Weng

Inventor： Chi-Chih Chu ,  Cheng-Yi Weng

IPC: H01L23/485

CPC classification number: H01L23/3128 ,  H01L23/49816 ,  H01L24/48 ,  H01L24/73 ,  H01L2224/32225 ,  H01L2224/48225 ,  H01L2224/48227 ,  H01L2224/73265 ,  H01L2924/00014 ,  H01L2924/15311 ,  H01L2924/15331 ,  H01L2924/181 ,  H01L2924/00012 ,  H01L2924/00 ,  H01L2224/45099 ,  H01L2224/45015 ,  H01L2924/207

Abstract: The present invention relates to a semiconductor package. The semiconductor package includes a substrate, at least one chip, a plurality of conductive elements, a plurality of first conductors and a molding compound. The substrate has a plurality of first pads and a solder mask. The first pads are exposed to a first surface of the substrate, and the material of the first pads is copper. The solder mask is disposed on the first surface, contacts the first pads directly, and has at least one opening so as to expose part of the first pads. The chip is mounted on the first surface of the substrate. The conductive elements electrically connect the chip and the substrate. The first conductors are disposed on the first pads. The molding compound is disposed on the first surface of the substrate, and encapsulates the chip, the conductive elements and part of the first conductors. Whereby, the solder mask contacts the first pads directly, and thus results in higher bonding strength, so as to avoid the bridge between the first conductors caused by the first conductors permeating into the interface between the solder mask and the first pads.

Abstract translation: 本发明涉及半导体封装。 半导体封装包括衬底，至少一个芯片，多个导电元件，多个第一导体和模制化合物。 基板具有多个第一焊盘和焊接掩模。 第一焊盘暴露于衬底的第一表面，并且第一焊盘的材料是铜。 焊接掩模设置在第一表面上，直接接触第一焊盘，并且具有至少一个开口以暴露第一焊盘的部分。 芯片安装在基板的第一表面上。 导电元件电连接芯片和基板。 第一导体设置在第一焊盘上。 模塑料配置在基板的第一表面上，并封装芯片，导电元件和第一导体的一部分。 由此，焊接掩模直接接触第一焊盘，从而导致更高的焊接强度，以避免第一导体之间由第一导体渗入焊料掩模和第一焊盘之间的界面引起的桥。

公开(公告)号：US07866874B2

公开(公告)日：2011-01-11

申请号：US12177578

申请日：2008-07-22

Applicant: Keng-ju Liu ,  Wen-yuan Cheng ,  Chi-chih Chu

Inventor： Keng-ju Liu ,  Wen-yuan Cheng ,  Chi-chih Chu

IPC: F21V8/00

CPC classification number: G02B6/009 ,  G02B6/0083

Abstract: The present invention discloses a backlight module having replaceable light apparatus. The backlight module includes the replaceable light apparatus, a back plate and a frame body. The replaceable light apparatus includes a light control circuit, a securing device and conducting wires. The light control circuit is adapted to a frame body and a back plate of the backlight module. Additionally, the light control circuit has a plurality of light sources, a first end portion and a second end portion. The securing device has a supporting housing which has a position protrusion and a clamping portion for supporting the first end portion of the light control circuit along a first direction (X) and a third direction (Z). The clamping portion clamps the first end portion of the light control circuit along a second direction (Y) and the third direction (Z).

Abstract translation: 本发明公开了一种具有可更换灯具的背光模块。 背光模块包括可替换的灯装置，背板和框体。 可替换的光装置包括光控制电路，固定装置和导线。 光控制电路适用于背光模块的框体和背板。 另外，光控制电路具有多个光源，第一端部和第二端部。 固定装置具有支撑壳体，其具有位置突起和夹持部分，用于沿着第一方向（X）和第三方向（Z）支撑光控制电路的第一端部。 夹持部沿着第二方向（Y）和第三方向（Z）夹持光控制电路的第一端部。

公开(公告)号：US20080286034A1

公开(公告)日：2008-11-20

申请号：US11979646

申请日：2007-11-07

Applicant: Ming-Chih Chu ,  Cheng-Yi Wang

Inventor： Ming-Chih Chu ,  Cheng-Yi Wang

IPC: A46B11/00

CPC classification number: A45D34/04 ,  A45D34/042 ,  A46B11/0041 ,  A46B11/0079 ,  A46B2200/1046

Abstract: A liquid cosmetics container has a brushing device, which includes an applying component joined to a container body, and a clipping component around the applying component; the applying component is positioned over an opening of the container body, and has a passage therein for liquid cosmetics to flow through; the applying component has an applying portion at a tail, which is around a tail end of the passage; the clipping element has an opening end, and two gaps extending through the opening end, therefore the opening end is compressible; the clipping component has two opposing clipping portions on an inner side of the opening end; a cap is used to cover the opening of the container body; the cap has a squeezing portion on an inner side to compress the opening end of the clipping component so as to block the passage of the applying component.

Abstract translation: 液体化妆品容器具有刷装置，其包括连接到容器主体的施加部件和围绕施加部件的夹持部件; 所述涂敷部件位于所述容器主体的开口部的上方，并具有用于使液体化妆品流过的通道; 所述施加部件具有位于所述通道的尾端附近的尾部的施加部分; 剪切元件具有开口端，并且延伸穿过开口端的两个间隙，因此开口端是可压缩的; 夹持部件在开口端的内侧具有两个相对的夹持部分; 盖用于覆盖容器主体的开口; 盖在内侧具有挤压部分，以压缩夹持部件的开口端，以阻止施加部件的通过。

公开(公告)号：US20080073769A1

公开(公告)日：2008-03-27

申请号：US11828351

申请日：2007-07-26

Applicant: Yen-Yi Wu ,  Wei-Yueh Sung ,  Pao-Huei Chang Chien ,  Chi-Chih Chu ,  Cheng-Yin Lee ,  Gwo-Liang Weng

Inventor： Yen-Yi Wu ,  Wei-Yueh Sung ,  Pao-Huei Chang Chien ,  Chi-Chih Chu ,  Cheng-Yin Lee ,  Gwo-Liang Weng

IPC: H01L23/02 ,  H01L23/52

CPC classification number: H01L24/14 ,  H01L21/56 ,  H01L23/3128 ,  H01L23/49816 ,  H01L24/48 ,  H01L24/73 ,  H01L25/105 ,  H01L25/50 ,  H01L2224/1405 ,  H01L2224/32225 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2224/73265 ,  H01L2225/1023 ,  H01L2225/1058 ,  H01L2924/00014 ,  H01L2924/01079 ,  H01L2924/12042 ,  H01L2924/15321 ,  H01L2924/15331 ,  H01L2924/181 ,  H01L2924/1815 ,  H01L2924/00012 ,  H01L2924/00 ,  H01L2224/45099 ,  H01L2224/45015 ,  H01L2924/207

Abstract: The present invention relates to a semiconductor package and a semiconductor device and a method of making the same. The method of making the semiconductor package comprises: providing a substrate; attaching a chip to a surface of the substrate; forming a plurality of connecting elements for electrically connecting the chip and the substrate; forming a plurality of first conductive bodies on the surface of the substrate; forming a molding compound for encapsulating the surface of the substrate, the chip, the connecting elements and the first conductive bodies; and removing a part of a border portion of the molding compound, so that the molding compound has two heights and one end of each first conductive bodies is exposed. Thereby, the molding compound covers the entire surface of the substrate, so that the bonding pads on the surface of the substrate will not be polluted.

Abstract translation: 本发明涉及半导体封装和半导体器件及其制造方法。 制造半导体封装的方法包括：提供衬底; 将芯片附接到所述基板的表面; 形成用于电连接所述芯片和所述基板的多个连接元件; 在所述基板的表面上形成多个第一导电体; 形成用于封装基板，芯片，连接元件和第一导电体的表面的模塑料; 并且除去模塑料的边界部分的一部分，使得模塑料具有两个高度，并且暴露出每个第一导电体的一端。 因此，成型化合物覆盖基板的整个表面，使得基板表面上的接合焊盘不会被污染。

公开(公告)号：US07187070B2

公开(公告)日：2007-03-06

申请号：US10934409

申请日：2004-09-07

Applicant: Chi Chih Chu ,  Cheng-Yin Lee ,  Gwo-Liang Weng ,  Shih-Chang Lee

Inventor： Chi Chih Chu ,  Cheng-Yin Lee ,  Gwo-Liang Weng ,  Shih-Chang Lee

IPC: H01L23/02

CPC classification number: H01L25/0657 ,  H01L2224/16145 ,  H01L2224/81193 ,  H01L2225/06513 ,  H01L2225/06527 ,  H01L2225/06551 ,  H01L2924/01079 ,  H01L2924/01322 ,  H01L2924/15311 ,  H01L2924/18161

Abstract: A Stackable package module comprises a plurality of semiconductor devices in stack. One of the semiconductor devices includes a chip with an active surface and a corresponding back surface, a plurality of solder bumps and a plurality of stud bumps. The solder bumps are formed on the active surface. The stud bumps are formed on the back surface. Each stud bump has a bump body and a protruding trail by wire-bonding and cutting. Bumps of another package are bonded on the stub bumps for replacing known intermediate substrate in conventional stacked package module.

Abstract translation: 可堆叠封装模块包括堆叠中的多个半导体器件。 半导体器件中的一个包括具有活性表面和对应的背面的芯片，多个焊料凸块和多个凸块凸块。 焊料凸块形成在有源表面上。 柱形凸块形成在背面。 每个柱形凸起具有凸起体和通过引线接合和切割的突出轨迹。 另一个封装的凸块被结合在短截线凸起上，用于替代传统堆叠封装模块中的已知中间衬底。

公开(公告)号：US20060267943A1

公开(公告)日：2006-11-30

申请号：US11176124

申请日：2005-07-07

Applicant: Wen-Chih Chu ,  Hsiao-Lung Chiang

Inventor： Wen-Chih Chu ,  Hsiao-Lung Chiang

IPC: G09G5/08

CPC classification number: G06F3/03543 ,  G06F3/038

Abstract: A wireless mouse includes a wireless receiver and a mouse main body. The mouse main body includes an upper cover, a base, a receiving part and a withdrawing part. The base includes a first sidewall and a second sidewall. The receiving part is defined at an end of the first sidewall. The withdrawing part is defined at an end of the second sidewall. The wireless receiver is stored within the mouse main body through the receiving part, and the wireless receiver having been stored within the mouse main body is partially detached from the mouse main body through the withdrawing part.

Abstract translation: 无线鼠标包括无线接收器和鼠标主体。 鼠标主体包括上盖，底座，接收部和抽出部。 底座包括第一侧壁和第二侧壁。 接收部分限定在第一侧壁的端部。 抽出部分限定在第二侧壁的一端。 无线接收器通过接收部分存储在鼠标主体内，并且已经存储在鼠标主体内的无线接收器通过撤回部分与鼠标主体部分地分离。

公开(公告)号：US20050185397A1

公开(公告)日：2005-08-25

申请号：US10856648

申请日：2004-05-28

Applicant: Chi-Chih Chu

Inventor： Chi-Chih Chu

IPC: F21V8/00 ,  F21V15/01 ,  G02F1/1335 ,  G02F1/13357

CPC classification number: G02F1/133608 ,  G02F2001/133317 ,  G02F2001/133325 ,  G02F2201/503 ,  G02F2203/68

Abstract: A direct backlight module and assembly method thereof. The direct light type backlight module has a light diffusing plate, a frame, a reflective back plate, and a light source. The light diffusing plate has a first positioning portion on an edge of the light diffusing plate. The frame has a groove corresponding to the light diffusing plate, and a second positioning portion corresponding to the first positioning portion is provided in the groove. The reflective back plate is provided on a side of the frame, forming a cavity between the reflective back plate and the light diffusing plate for disposition of the light source. In assembly, the light diffusing plate is slotted in the groove of the frame to form a light diffusing module, and the light diffusing module is assembled with the reflective back plate and the light source to form the direct backlight module.

Abstract translation: 一种直接背光模组及其装配方法。 直接光型背光模块具有光漫射板，框架，反射背板和光源。 光漫射板在光漫射板的边缘上具有第一定位部分。 框架具有对应于光漫射板的凹槽，并且在凹槽中设置与第一定位部相对应的第二定位部。 反射背板设置在框架的一侧，在反射背板和光漫射板之间形成空腔，用于配置光源。 在组装中，光漫射板被开槽在框架的凹槽中以形成光漫射模块，并且光扩散模块与反射背板和光源组装以形成直接背光模块。