Abstract:
A detachable projection module and an electronic device having the same integrate an optical engine and an image processing unit into an independent detachable module, where the module case is fixedly connected to a device body of the electronic device, so that projection module can receive image signals from the electronic device and convert the received image signals into projection signals to be projected onto a surface near the device body of the electronic device. Through a dedicated or generic connector interface, the detachable projection module may be removed from one electronic device and be mounted to another electronic device, giving an electronic device capability of equipping a projection module to extend the electronic device with a secondary display or empower an electronic device, which has no display at first, with display ability.
Abstract:
A detachable projection module and an electronic device having the same integrate an optical engine and an image processing unit into an independent detachable module, where the module case is fixedly connected to a device body of the electronic device, so that projection module can receive image signals from the electronic device and convert the received image signals into projection signals to be projected onto a surface near the device body of the electronic device. Through a dedicated or generic connector interface, the detachable projection module may be removed from one electronic device and be mounted to another electronic device, giving an electronic device capability of equipping a projection module to extend the electronic device with a secondary display or empower an electronic device, which has no display at first, with display ability.
Abstract:
Provided is a method and structure for utilizing advance channel substrate materials in semiconductor manufacturing. Advanced channel substrate materials such as germanium and Group III-V channel substrate materials, are advantageously utilized. One or more capping films including at least a nitride layer are formed over the channel substrate prior to patterning, ion implantation and the subsequent stripping and wet cleaning operations. With the capping layers intact during these operations, attack of the channel substrate material is prevented and the protective films are easily removed subsequently. The films are dimensioned in conjunction with the ion implantation operation to enable the desired dopant profile and concentration to be formed in the channel substrate material.
Abstract:
Memory cells of a nonvolatile memory array are characterized by one of multiple threshold voltage ranges including at least an erased threshold voltage range and a programmed threshold voltage range. Responsive to an erase command to erase a group of memory cells of the nonvolatile memory array, a plurality of phases are performed, including at least a pre-program phase and an erase phase. The pre-program phase programs a first set of memory cells in the group having threshold voltages within the erased threshold voltage range, and does not program a second set of memory cells in the group having threshold voltages within the erased threshold voltage range in the group. By not programming the second set of memory cells, the pre-program phase is performed more quickly than if the second set of memory cells were programmed along with the first set of memory cells.
Abstract:
A liquid crystal composite material and a liquid crystal electro-optical display device are provided. A liquid crystal composite material, includes: a liquid crystal; a polymer; and a modified inorganic layered material, wherein the modified inorganic layered material is formed by modifying an inorganic layered material with a conjugated oligomer, and the conjugated oligomer has a quaternary ammonium group or sulfonate group.
Abstract:
The present invention relates to a heat radiating structure in all-in-one computers, comprising a pedestal, mainframe module and back cover. The mainframe module is contained in a containing stand behind the pedestal, and a motherboard is included in the containing space in front of a mainframe module base. The motherboard's CPU sticks through a radiator to a heat radiating aluminum plate in the rear of the containing space, while the hard disk drive is close to the heat radiating aluminum plate, and the pedestal is covered by the back cover on the back. With the heat radiating aluminum plate to quickly conduct heat and its multiple heat radiating holes, heat dispersing holes behind the containing stand and hollowed grooves on the back cover to convect hot air.
Abstract:
The present invention relates to a heat radiating structure in all-in-one computers, comprising a pedestal, mainframe module and back cover. The mainframe module is contained in a containing stand behind the pedestal, and a motherboard is included in the containing space in front of a mainframe module base. The motherboard's CPU sticks through a radiator to a heat radiating aluminum plate in the rear of the containing space, while the hard disk drive is close to the heat radiating aluminum plate, and the pedestal is covered by the back cover on the back. With the heat radiating aluminum plate to quickly conduct heat and its multiple heat radiating holes, heat dispersing holes behind the containing stand and hollowed grooves on the back cover to convect hot air.
Abstract:
A heat sink assembly includes a fin module, heat pipes, and a pair of side plates. The fin module is composed of a plurality of fins and has a flat side formed with a trough and two recesses. Each of the heat pipes has an evaporation section. The evaporation sections are parallelly accommodated in the trough and in contact with each other. The side plates are separately fixed in the recesses and protrude from the flat side. The evaporation sections are formed with a flat surface coplanar with the side plates. By this arrangement, the thermal contact area between the heat pipes and a heat source is increased to thereby improve the heat-dissipating efficiency of the heat sink assembly.
Abstract:
A semiconductor structure comprising an SRAM/inverter cell and a method for forming the same are provided, wherein the SRAM/inverter cell has an improved write margin. The SRAM/inverter cell includes a pull-up PMOS device comprising a gate dielectric over the semiconductor substrate, a gate electrode on the gate dielectric wherein the gate electrode comprises a p-type impurity and an n-type impurity, and a stressor formed in a source/drain region. The device drive current of the pull-up PMOS device is reduced due to the counter-doping of the gate electrode.
Abstract:
The invention relates to a system, method, computer readable medium, and computer program product for managing electronic commerce to make users spend the least times, go to the nearest and fewest sales channel and buy the cheapest or suitable goods in order to save money, time, effort and energy. The system comprises an input module configured to receive at least one keyword request from a user client; a search module configured to search at least one goods record according to the keyword request in a database or on the Internet; a selection module configured to show the at least one goods record searched by the search module, receive an input, and perform a corresponding operation according to the input; a result module configured to show at least one shopping plan got from the correspondingly operation; a database configured to store goods records; and an order module configured to operate a shopping order.