公开(公告)号：US08289720B2

公开(公告)日：2012-10-16

申请号：US12699716

申请日：2010-02-03

申请人： Koji Ishikawa

发明人： Koji Ishikawa

IPC分类号： H05K1/00

CPC分类号： G03B17/00 ,  H01R12/59 ,  H01R12/722 ,  H05K1/0218 ,  H05K1/0245 ,  H05K1/147 ,  H05K2201/043 ,  H05K2201/0715 ,  H05K2201/09318 ,  H05K2201/10189

摘要： An electronic apparatus includes an outer cover member, an internal structure member, first and second external connection connectors, and first and second printed circuit boards. The first printed circuit board has a first surface on which the first external connector is mounted thereon, a signal pattern of the first external connector is formed on the first surface, and a second surface. The second printed circuit board has a first surface on which the second external connector is mounted thereon, a signal pattern of the second external connector is formed on the first surface, and a second surface. Ground patterns are formed on the second surfaces of the printed circuit boards. The first and second external connectors overlap and are arranged in a space surrounded by the outer cover member and the internal structure member so that the second surfaces of the first and second printed circuit boards face each other.

摘要翻译： 电子设备包括外盖构件，内部结构构件，第一和第二外部连接连接器以及第一和第二印刷电路板。 第一印刷电路板具有其上安装有第一外部连接器的第一表面，在第一表面上形成第一外部连接器的信号图案和第二表面。 第二印刷电路板具有其上安装有第二外部连接器的第一表面，在第一表面上形成第二外部连接器的信号图案和第二表面。 在印刷电路板的第二表面上形成接地图案。 第一外部连接器和第二外部连接器重叠并且布置在由外盖构件和内部结构构件包围的空间中，使得第一和第二印刷电路板的第二表面彼此面对。

公开(公告)号：US20110086521A1

公开(公告)日：2011-04-14

申请号：US12884637

申请日：2010-09-17

申请人： Yasuyuki Miki ,  Mitsuru Kobayashi ,  Hiroshi Tajiri ,  Takahiro Kondou ,  Koji Ishikawa ,  Akira Tamura

发明人： Yasuyuki Miki ,  Mitsuru Kobayashi ,  Hiroshi Tajiri ,  Takahiro Kondou ,  Koji Ishikawa ,  Akira Tamura

IPC分类号： H01R12/16 ,  H01R24/00

CPC分类号： H01R12/735 ,  H01R13/6471 ,  H01R13/6585

摘要： An inserting connector includes a plurality of plug electrodes where plug connecting terminals are provided at first ends of the plug electrodes and plug terminals are provided at second ends of the plug electrodes, the plug connecting terminals being configured to be connected to a board, the plug terminals being configured to be connected to jack terminals; wherein the plug connecting terminals extend in a direction perpendicular to a surface of the board; the plug terminals extend in a movable direction where the plug terminals are attached to or detached from the jack terminals; the plug electrodes are bent at an angle α in longitudinal directions of the plug electrodes, the angle α being greater than 0 degrees and less than 90 degrees.

摘要翻译： 插入连接器包括多个插头电极，插头连接端子设置在插头电极的第一端，插头端子设置在插头电极的第二端，插头连接端子被配置为连接到电路板，插头 端子被配置为连接到插座端子; 其中所述插头连接端子在垂直于所述板的表面的方向上延伸; 插头端子在插头端子被安装到插座端子或从插座端子拆卸的可移动方向上延伸; 插塞电极在插头电极的长度方向上以角度α弯曲，角度α大于0度且小于90度。

公开(公告)号：US20100226099A1

公开(公告)日：2010-09-09

申请号：US12717551

申请日：2010-03-04

申请人： Takahiro KONDOU ,  Koji ISHIKAWA ,  Akira TAMURA

发明人： Takahiro KONDOU ,  Koji ISHIKAWA ,  Akira TAMURA

IPC分类号： H05K5/00 ,  H05K1/00 ,  B23P19/00 ,  H05K13/00

CPC分类号： H05K7/1489 ,  Y10T29/49002 ,  Y10T29/5313

摘要： An electronic apparatus includes a cabinet which includes a first face capable of being opened, a second face vertical relative to the first face, and a third face facing the second face, a first connector which is disposed over the second face inside the cabinet and a fitting face of which faces the third face, and a substrate unit which includes a second connector fitted with the first connector, a first edge included in the second connector, a second edge on an opposite side of the first edge, and an engaging part disposed on the second edge.

摘要翻译： 一种电子设备，包括：机壳，其包括能够打开的第一面，相对于所述第一面垂直的第二面和面向所述第二面的第三面;布置在所述机壳内部的所述第二面上的第一连接器， 其第一边缘包括在第二连接器中，第二边缘在第一边缘的相对侧上，并且配合部分设置在第二边缘的第二边缘上， 在第二边。

公开(公告)号：US20090298307A1

公开(公告)日：2009-12-03

申请号：US12085170

申请日：2006-11-21

申请人： Taiichi Rikimaru ,  Koji Ishikawa ,  Jun Tominaga

发明人： Taiichi Rikimaru ,  Koji Ishikawa ,  Jun Tominaga

IPC分类号： H01R12/00 ,  H01R9/24

CPC分类号： G01R1/06738 ,  G01R1/06722 ,  G01R1/07307

摘要： A conductive contact unit includes plate-like conductive contacts for electrically connecting different circuitries. Each conductive contact includes a first contacting element to be brought in physical contact with one circuitry, a second contacting element to be brought in physical contact with another circuitry, an elastic element between the first contacting element and the second contacting element, a first connecting element that connects the elastic element and the first contacting element, and a second connecting element that connects the elastic element and the second contacting element and that has an opening. The conductive contact unit also includes a conductive contact holder including first guiding grooves and second guiding grooves facing the first guiding grooves. The conductive contact holder holds the conductive contacts with both longitudinal outside ends of each conductive contact being slidably engaged with the first and the second guiding grooves.

摘要翻译： 导电接触单元包括用于电连接不同电路的板状导电接点。 每个导电触点包括与一个电路物理接触的第一接触元件，与另一个电路物理接触的第二接触元件，第一接触元件和第二接触元件之间的弹性元件，第一连接元件 其连接弹性元件和第一接触元件，以及连接弹性元件和第二接触元件并具有开口的第二连接元件。 导电接触单元还包括导电接触保持器，其包括面向第一引导槽的第一引导槽和第二引导槽。 导电接触保持器保持导电触点，每个导电触头的两个纵向外端可滑动地与第一和第二引导槽接合。

公开(公告)号：US20090233493A1

公开(公告)日：2009-09-17

申请号：US12224447

申请日：2007-03-01

申请人： Jun Tominaga ,  Koji Ishikawa ,  Taiichi Rikimaru

发明人： Jun Tominaga ,  Koji Ishikawa ,  Taiichi Rikimaru

IPC分类号： H01R13/40 ,  G01R31/28

CPC分类号： G01R1/0416 ,  G01R1/06722 ,  G01R1/06738 ,  G01R1/0735 ,  G01R31/2891 ,  G09G3/006

摘要： A conductive contact unit establishes an electrical connection between different circuitries, and includes a plurality of conductive contacts that receive and output an electrical signal from and to the circuitries, respectively. The conductive contact unit includes a conductive contact holder that accommodates and holds the conductive contacts, and a vibration applying unit that applies vibration to the conductive contact holder.

摘要翻译： 导电接触单元在不同电路之间建立电连接，并且包括分别从电路接收和输出电信号的多个导电触点。 导电接触单元包括容纳和保持导电触点的导电触头保持器，以及向导电触点保持器施加振动的振动施加单元。

公开(公告)号：US20090104100A1

公开(公告)日：2009-04-23

申请号：US12224508

申请日：2007-02-06

申请人： Hiroshi Imamura ,  Hiroaki Takeuchi ,  Koji Ishikawa ,  Hiroshi Suzuki ,  Akira Moriya ,  Katsuyoshi Harada

发明人： Hiroshi Imamura ,  Hiroaki Takeuchi ,  Koji Ishikawa ,  Hiroshi Suzuki ,  Akira Moriya ,  Katsuyoshi Harada

IPC分类号： B01D53/70

CPC分类号： B01D53/68 ,  B01D2257/204 ,  C23C16/4412 ,  F23G7/063 ,  F23L7/002

摘要： Hexachlorodisilane is decomposed into hydrochloric acid, silicon dioxide and water by introducing hexachlorodisilane-containing flue gas into a reaction region without moistening the flue gas and by supplying oxygen-containing gas that also contains a small amount of moisture to the reaction region maintained at a temperature at which hexachlorodisilane decomposes.

摘要翻译： 将六氯二硅烷分解成盐酸，二氧化硅和水，通过将六氯二硅烷的烟道气引入反应区而不使烟道气润湿，并将含有少量水分的含氧气体供给到保持在温度 六氯代硅烷分解。

公开(公告)号：US20070184675A1

公开(公告)日：2007-08-09

申请号：US11671729

申请日：2007-02-06

申请人： Koji ISHIKAWA

发明人： Koji ISHIKAWA

IPC分类号： H05K1/00

CPC分类号： H05K3/363 ,  H05K3/3452 ,  H05K2201/09181 ,  H05K2201/09727 ,  H05K2201/0989

摘要： A highly reliable printed circuit board which is capable of preventing a short circuit between traces from being caused by a solder bridge formed by excess solder. The printed circuit board has a solder resist covering copper foil traces formed on a substrate and the substrate, for insulation. The solder resist is formed such that exposed portions of the substrate between adjacent ones of the conductive traces each have a shape protruding in a direction of where the other printed circuit board is connected, with respect to exposed portions of the adjacent ones of the conductive traces, in a boundary between the connection part and a portion on which an insulating layer is formed.

摘要翻译： 一种高度可靠的印刷电路板，其能够防止迹线之间的短路由由多余焊料形成的焊料桥引起。 印刷电路板具有覆盖在基板和基板上形成的用于绝缘的铜箔迹线的阻焊层。 阻焊剂形成为使得相邻的导电迹线之间的基板的暴露部分相对于相邻的导电迹线的暴露部分具有沿着另一个印刷电路板连接的方向突出的形状 在连接部分和形成有绝缘层的部分之间的边界。

公开(公告)号：US20060246753A1

公开(公告)日：2006-11-02

申请号：US11406353

申请日：2006-04-19

申请人： Koji Ishikawa

发明人： Koji Ishikawa

IPC分类号： H05K1/00

CPC分类号： H01R4/028

摘要： A connector that reduces generation of faults, such as short-circuits of terminals and circuits, by reducing generations of whiskers resulting from use of lead-free solder. The connector comprises a contact part and a housing part. A recess is formed in the area where the contact part is received into the housing part. The recess encloses whiskers generated in the connector at this location. The recess is sized such that whiskers of an anticipated size do not extend from the contact part to the housing part and such that foreign bodies are unlikely to be able to enter the recess.

摘要翻译： 通过减少使用无铅焊料产生的晶须的代数，减少了诸如端子和电路短路等故障的连接器。 连接器包括接触部分和壳体部分。 在接触部分被容纳到壳体部分的区域中形成凹部。 该凹槽包围在该位置处在连接器中产生的晶须。 凹部的尺寸使得预期尺寸的晶须不会从接触部分延伸到壳体部分，并且异物不太可能进入凹部。

公开(公告)号：US20060244103A1

公开(公告)日：2006-11-02

申请号：US11411096

申请日：2006-04-26

申请人： Koji Ishikawa ,  Kazutaka Mori ,  Hiroshige Kogayu ,  Tamotsu Miyake ,  Mitsugu Kusunoki

发明人： Koji Ishikawa ,  Kazutaka Mori ,  Hiroshige Kogayu ,  Tamotsu Miyake ,  Mitsugu Kusunoki

IPC分类号： H01L27/082

CPC分类号： H01L23/5252 ,  H01L27/0823 ,  H01L2924/0002 ,  H01L2924/00

摘要： A semiconductor apparatus includes a first transistor having a first emitter electrode, a first base electrode, and a first collector electrode in a region over a first region. Base lead-out polysilicon connecting the first base electrode and a first base region passes over a second region provided out of the first region and a resistor element is added. A writing voltage is reduced in an antifuse using two bipolar transistors.

公开(公告)号：US4142018A

公开(公告)日：1979-02-27

申请号：US762182

申请日：1977-01-24

申请人： Hiroshi Ozawa ,  Yoshinori Torii ,  Nobuki Kobayashi ,  Koji Ishikawa

发明人： Hiroshi Ozawa ,  Yoshinori Torii ,  Nobuki Kobayashi ,  Koji Ishikawa

IPC分类号： B05D1/38 ,  B05D5/06 ,  B05D7/00 ,  B32B7/08 ,  B05D3/02

CPC分类号： B05D7/536 ,  B05D5/068 ,  B05D7/576 ,  Y10T428/25 ,  Y10T428/256 ,  Y10T428/31692 ,  Y10T428/31906 ,  Y10T428/31928

摘要： A process for forming a coating with a metallic finish, which comprises(1) a first step of coating an article with [A] a water-thinnable paint comprising (a) a cross-linkable (meth)acrylate ester copolymer or a mixture of the (meth)acrylate ester copolymers containing at least 0.1 equivalent, per 1,000 g of resin solids, of a carboxyl or carboxyl ion group and a group capable of undergoing a ring-opening reaction with the carboxyl or carboxy ion group upon heating, both of said groups being contained in the same or different copolymers, and having a number average molecular weight of at least 3,000 and (b) metallic scales, and baking the coating paint to form a coating containing the metallic scales and(2) a second step of coating [B] a powder paint comprising a (meth)acrylate ester copolymer having a glycidyl or .beta.-methylglycidyl group and a polycarboxylic acid on the scale-containing coating obtained in the first step, and baking the coated paint to form a protective coating for the scale-containing coating.

摘要翻译： 一种形成具有金属涂层的涂层的方法，其包括（1）用[A]一种水稀释涂料涂料的第一步骤，其包含（a）可交联（甲基）丙烯酸酯共聚物或 （甲基）丙烯酸酯共聚物，每1000克树脂固体含有至少0.1当量的羧基或羧基离子基团和能够在加热时与羧基或羧基离子基团开环反应的基团，两者均为 所述基团包含在相同或不同的共聚物中，并且具有至少3,000的数均分子量和（b）金属垢，并烘烤涂料以形成包含金属垢的涂层和（2）第二步 涂料[B]一种粉末涂料，其包含在第一步骤中获得的含水垢的涂料上含有缩水甘油基或β-甲基缩水甘油基的（甲基）丙烯酸酯共聚物和多元羧酸，并烘烤涂覆的涂料以形成保护涂层 含鳞屑的涂层。