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    PACKAGE STRUCTURE OF PHOTOELECTRONIC DEVICE AND FABRICATING METHOD THEREOF
    41.
    发明申请
    PACKAGE STRUCTURE OF PHOTOELECTRONIC DEVICE AND FABRICATING METHOD THEREOF 有权
    光电器件的封装结构及其制造方法

    公开(公告)号：US20090078956A1

    公开(公告)日：2009-03-26

    申请号：US12255165

    申请日：2008-10-21

    Applicant: WEN LIANG TSENG ,  LUNG HSIN CHEN ,  JIAN SHIHN TSANG

    Inventor： WEN LIANG TSENG ,  LUNG HSIN CHEN ,  JIAN SHIHN TSANG

    IPC: H01L21/50 ,  H01L33/00

    CPC classification number: H01L33/641 ,  H01L33/60 ,  H01L33/62 ,  H01L33/647 ,  H01L2224/16 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2924/01012 ,  H01L2924/01019 ,  H01L2924/0102 ,  H01L2924/01046 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/10253 ,  H01L2924/1461 ,  H01L2924/00014 ,  H01L2924/00

    Abstract: A package structure for photoelectronic devices comprises a silicon substrate, a first insulating layer, a reflective layer, a second insulating layer, a first conductive layer, a second conductive layer and a die. The silicon substrate has a first surface and a second surface, wherein the first surface is opposed to the second surface. The first surface has a reflective opening, and the second surface has at least two electrode via holes connected to the reflective opening and a recess disposed outside the electrode via holes. The first insulating layer overlays the first surface, the second surface and the recesses. The reflective layer is disposed on the reflective opening. The second insulating layer is disposed on the reflective layer. The first conductive layer is disposed on the surface of the second insulating layer. The second conductive layer is disposed on the surface of the second surface and inside the electrode via holes. The die is fixed inside the reflective opening and electrically connected to the first conductive layer.

    Abstract translation: 光电器件的封装结构包括硅衬底，第一绝缘层，反射层，第二绝缘层，第一导电层，第二导电层和裸片。 硅衬底具有第一表面和第二表面，其中第一表面与第二表面相对。 第一表面具有反射开口，并且第二表面具有连接到反射开口的至少两个电极通孔和设置在电极通孔外部的凹部。 第一绝缘层覆盖第一表面，第二表面和凹槽。 反射层设置在反射开口上。 第二绝缘层设置在反射层上。 第一导电层设置在第二绝缘层的表面上。 第二导电层设置在第二表面的表面和电极通孔的内部。 模具固定在反射开口内并电连接到第一导电层。

    Method for manufacturing light emitting diode package
    42.
    发明授权
    Method for manufacturing light emitting diode package 有权
    制造发光二极管封装的方法

    公开(公告)号：US08921131B2

    公开(公告)日：2014-12-30

    申请号：US13653634

    申请日：2012-10-17

    Applicant: Lung-Hsin Chen ,  Wen-Liang Tseng

    Inventor： Lung-Hsin Chen ,  Wen-Liang Tseng

    IPC: H01L21/00

    CPC classification number: H01L33/486 ,  H01L33/501 ,  H01L2924/0002 ,  H01L2933/0041 ,  H01L2924/00

    Abstract: An exemplary method for manufacturing an LED package includes following steps: providing a substrate; forming a reflector on the substrate with a receiving chamber defined in the reflector; providing an LED chip and mounting the LED chip on the substrate wherein the LED chip is received in the receiving chamber; providing a gelatinous phosphor layer and arranging the gelatinous phosphor layer on a top end of the reflector wherein the gelatinous phosphor layer covers the receiving chamber and phosphor powder is evenly distributed in the gelatinous phosphor layer; providing a pressing mold and arranging the pressing mold on a top end of the gelatinous phosphor layer; pressing the pressing mold toward the gelatinous phosphor layer to make the gelatinous phosphor layer fill in the receiving chamber; solidifying the gelatinous phosphor layer.

    Abstract translation: 制造LED封装的示例性方法包括以下步骤：提供衬底; 在所述基板上形成反射器，其中所述接收室限定在所述反射器中; 提供LED芯片并将LED芯片安装在基板上，其中LED芯片被容纳在接收室中; 提供凝胶状荧光体层，并将凝胶状磷光体层设置在反射器的顶端，其中，凝胶状磷光体层覆盖接收室，荧光体粉末均匀地分布在凝胶磷光体层中; 提供加压模具并将压模布置在凝胶磷光体层的顶端上; 将压模压向凝胶状磷光体层，使凝胶状磷光体层填充在接收室中; 凝胶化荧光体层。

    Light emitting diode package having fluorescent film directly coated on light emitting diode die and method for manufacturing the same
    43.
    发明授权
    Light emitting diode package having fluorescent film directly coated on light emitting diode die and method for manufacturing the same 有权
    具有直接涂覆在发光二极管裸片上的荧光膜的发光二极管封装及其制造方法

    公开(公告)号：US08906715B2

    公开(公告)日：2014-12-09

    申请号：US13600236

    申请日：2012-08-31

    Applicant: Lung-Hsin Chen ,  Wen-Liang Tseng ,  Pin-Chuan Chen

    Inventor： Lung-Hsin Chen ,  Wen-Liang Tseng ,  Pin-Chuan Chen

    IPC: H01L21/00

    CPC classification number: H01L33/505 ,  H01L33/486 ,  H01L2224/48091 ,  H01L2933/0041 ,  H01L2924/00014

    Abstract: A method for packaging an LED, includes steps: providing a supporting board and then dripping a gel mixed with fluorescent therein on the supporting board; scraping the gel over the supporting board with a scraper form a gelatinous fluorescent film on the supporting board, and solidifying the gelatinous fluorescent film pieces to form a solidified fluorescent film; cutting the solidified fluorescent film into individual pieces, and peeling the solid fluorescent films from the supporting board; attaching one piece of the fluorescent film on a light outputting surface of an LED die; mounting the LED die on a substrate, and electrically connecting the LED die to the circuit structure; and forming an encapsulation on the substrate to cover the LED die.

    Abstract translation: 一种LED封装方法，包括以下步骤：在支撑板上提供支撑板，然后将与荧光体混合的凝胶滴下; 用刮板在支撑板上刮擦凝胶，在支撑板上形成凝胶状荧光膜，并固化凝胶状荧光膜片以形成凝固的荧光膜; 将固化的荧光膜切割成单独的片，并将固体荧光膜从支撑板剥离; 将一片荧光膜附接到LED管芯的光输出表面上; 将LED管芯安装在基板上，并将LED管芯电连接到电路结构; 以及在所述衬底上形成封装以覆盖所述LED管芯。

    Method for manufacturing phosphor film and method for making LED package having the phosphor film
    44.
    发明授权
    Method for manufacturing phosphor film and method for making LED package having the phosphor film 有权
    荧光体膜的制造方法及具有荧光体膜的LED封装的制造方法

    公开(公告)号：US08658445B2

    公开(公告)日：2014-02-25

    申请号：US13600128

    申请日：2012-08-30

    Applicant: Lung-Hsin Chen ,  Wen-Liang Tseng ,  Pin-Chuan Chen

    Inventor： Lung-Hsin Chen ,  Wen-Liang Tseng ,  Pin-Chuan Chen

    IPC: H01L21/00

    CPC classification number: C09K11/02 ,  C09K11/08 ,  H01L33/50 ,  H01L2224/16225 ,  H01L2224/32225 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2224/73265 ,  H01L2224/92247 ,  H01L2933/0041 ,  H01L2924/00014 ,  H01L2924/00

    Abstract: A method for manufacturing a phosphor film for use in the an LED package, includes following steps: providing a mold comprising a first and a second molding part, the first molding part and the second molding part cooperatively forming a molding chamber, the first molding part defining an opening communicating with the molding chamber; filling a mixture of phosphor particles and a transparent glue into the first opening; moving a piston in the first opening along a direction from the first molding part to the second molding part, thereby pressing the mixture into the molding chamber; solidifying the mixture to form a phosphor film; and removing the phosphor film from the mold. The phosphor film is used to be attached to a top face of an LED chip opposite a substrate on which the LED chip is mounted.

    Abstract translation: 一种制造用于LED封装的荧光膜的方法，包括以下步骤：提供包括第一和第二成型部件的模具，第一模制部件和第二模制部件协同地形成模制室，第一模制部件 限定与所述模制室连通的开口; 将荧光体颗粒和透明胶的混合物填充到第一开口中; 沿着从第一成型部到第二成型部的方向在第一开口中移动活塞，从而将混合物压入成型室; 使混合物固化形成荧光膜; 并从模具中去除荧光膜。 荧光体膜用于与安装有LED芯片的基板相对的LED芯片的顶面附着。

    LIGHT EMITTING DIODE PACKAGE
    47.
    发明申请
    LIGHT EMITTING DIODE PACKAGE 审中-公开
    发光二极管封装

    公开(公告)号：US20110278601A1

    公开(公告)日：2011-11-17

    申请号：US12979368

    申请日：2010-12-28

    Applicant: MIN-TSUN HSIEH ,  WEN-LIANG TSENG ,  LUNG-HSIN CHEN ,  CHIH-YUNG LIN

    Inventor： MIN-TSUN HSIEH ,  WEN-LIANG TSENG ,  LUNG-HSIN CHEN ,  CHIH-YUNG LIN

    IPC: H01L33/48

    CPC classification number: H01L33/486 ,  H01L25/167 ,  H01L33/507 ,  H01L33/508 ,  H01L33/62 ,  H01L2924/0002 ,  H01L2924/00

    Abstract: An LED package includes a silicon base, an LED and a glass encapsulant. The silicon base has a first surface and a second surface opposite to the first surface. The LED chip is located on the first surface of the silicon base. The glass encapsulant covers the LED chip. The glass encapsulant and the silicon base define a receiving space therebetween to receive the LED chip. The glass encapsulant is fixedly engaged with the first surface of the silicon base, so the glass encapsulant and the silicon base enclose the LED chip.

    Abstract translation: LED封装包括硅基，LED和玻璃密封剂。 硅基部具有与第一表面相对的第一表面和第二表面。 LED芯片位于硅基底的第一表面上。 玻璃密封剂覆盖LED芯片。 玻璃密封剂和硅基底在其间限定了接收LED芯片的接收空间。 玻璃密封剂与硅基体的第一表面固定接合，因此玻璃密封剂和硅基底包围LED芯片。

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