ANALYZING APPARATUS, PROGRAM, DEFECT INSPECTION APPARATUS, DEFECT REVIEW APPARATUS, ANALYSIS SYSTEM, AND ANALYSIS METHOD
    41.
    发明申请
    ANALYZING APPARATUS, PROGRAM, DEFECT INSPECTION APPARATUS, DEFECT REVIEW APPARATUS, ANALYSIS SYSTEM, AND ANALYSIS METHOD 有权
    分析装置,程序,缺陷检查装置,缺陷检查装置,分析系统和分析方法

    公开(公告)号:US20080226153A1

    公开(公告)日:2008-09-18

    申请号:US12039255

    申请日:2008-02-28

    IPC分类号: G06K9/00

    摘要: In order to allow to easily specify inspection recipe with which defects desired to be detected can be detected efficiently, a defect inspection apparatus performs defect inspection of a substrate in accordance with a plurality of inspection recipes and produces defect information associated with position of defect in the substrate and attribute data of the defect for each of the inspection recipes and a defect review apparatus produces review result information specifying a kind of defect selected from defects contained in the defect information. An analyzing apparatus obtains defect information and review result information and totalizes the number of defects having attribute data similar to attribute data possessed in defects corresponding to kind of defects to be analyzed for each inspection recipe.

    摘要翻译: 为了能够容易地指定能够有效地检测出希望的缺陷的检查配方,缺陷检查装置根据多个检查配方进行基板的缺陷检查,并且生成与缺陷的位置有关的缺陷信息 每个检查配方的缺陷的基板和属性数据以及缺陷检查装置产生指定从缺陷信息中包含的缺陷中选择的缺陷的种类的检查结果信息。 分析装置获取缺陷信息并查看结果信息,并且将具有属性数据的缺陷的数量的总和与每个检查配方的要分析的缺陷的种类相对应的缺陷中具有的属性数据相似。

    Inspection data analysis program, inspection tools, review apparatus and yield analysis apparatus
    42.
    发明授权
    Inspection data analysis program, inspection tools, review apparatus and yield analysis apparatus 有权
    检验数据分析程序,检验工具,检查仪器和产量分析仪器

    公开(公告)号:US07421357B2

    公开(公告)日:2008-09-02

    申请号:US10887827

    申请日:2004-07-12

    IPC分类号: G06F19/00 G01R31/26

    摘要: An operation unit executes a process for calling to a main memory first data representative of a result of equipment QC applied to a production unit. A process for reading out to the main memory an amount of change in failure in accordance with particle numbers calculated for individual defect sizes from second inspection data representative of a result of equipment QC is applied to the production unit. Electrical test data of a product processed by the production unit during a period inclusive of the time that the second inspection is carried outis also read to the main memory. A process is also executed for using the amount of change in failure in accordance with the calculated particle numbers and the particle numbers for individual sizes determined from the first inspection data to determine an impact on the product by particles generated in the production equipment when the first inspection data is detected.

    摘要翻译: 操作单元执行用于向主存储器调用代表应用于生产单元的设备QC的结果的第一数据的处理。 对于生产单元,将向根据第二检查数据计算出的各个缺陷尺寸的粒子数量的故障量的变化量写入主存储器的处理被应用于生产单元。 在包括执行第二次检查的时间段期间由生产单元处理的产品的电气测试数据也被读取到主存储器。 还执行一个处理,以根据从第一检查数据确定的计算的粒子数和个体大小的粒子数量来使用故障变化量,以确定在生产设备中产生的颗粒对产品的影响时,当第一 检测数据。

    Crystals of taxane derivative and process for their production
    43.
    发明授权
    Crystals of taxane derivative and process for their production 有权
    紫杉烷衍生物的晶体及其生产过程

    公开(公告)号:US07410980B2

    公开(公告)日:2008-08-12

    申请号:US10495437

    申请日:2002-11-29

    IPC分类号: A61K31/443 C07D405/12

    CPC分类号: A61K31/443 C07D493/04

    摘要: A crystal of (1S,2S,3R,4S,5R,8R,9S,10R,13S)-4-acetoxy-2-benzoyloxy-9,10-[(1S)-2-(dimethylamino)ethylidenedioxy]-5,20-epoxy-1-hydroxytax-11-en-13-yl (2R,3S)-3-(tert-butoxycarbonylamino)-3-(3-fluoro-2-pyridyl)-2-hydroxypropionate, which has characteristic peaks at diffraction angles (2θ) of 6.2°, 10.3°, 10.7°, 11.4°, and 12.0° in a powder X-ray diffraction pattern, and a method for preparing the aforementioned crystal, which comprises the step of performing crystallization by using an organic solvent selected from the group consisting of a ketone type solvent, a nitrile type solvent, and a mixture thereof, or a mixture of said organic solvent and water.

    摘要翻译: (1S,2S,3R,4S,5R,8R,9S,10R,13S)-4-乙酰氧基-2-苯甲酰氧基-9,10 - [(1S)-2-(二甲基氨基)亚乙二氧基] (2R,3S)-3-(叔丁氧基羰基氨基)-3-(3-氟-2-吡啶基)-2-羟基丙酸酯的20-环氧-1-羟基塔克斯-11-烯-13-基 粉末X射线衍射图中衍射角(2θ)为6.2°,10.3°,10.7°,11.4°和12.0°,以及制备上述晶体的方法,包括通过使用有机物进行结晶的步骤 选自酮类溶剂,腈型溶剂及其混合物的溶剂,或所述有机溶剂和水的混合物。

    COMPRESSOR
    44.
    发明申请
    COMPRESSOR 审中-公开
    压缩机

    公开(公告)号:US20080159878A1

    公开(公告)日:2008-07-03

    申请号:US11951686

    申请日:2007-12-06

    IPC分类号: F04B49/00

    摘要: This compressor includes housing members that form a body; a drive shaft linked to a drive power source via an electromagnetic clutch; movable members moving in cooperation with the drive shaft and carrying out the compression of a fluid; a detected body moving in cooperation with the drive shaft; a drain bolt screwed into a drain bolt hole provided in a housing member in proximity to the detected body; and a detecting device detecting the rotation state of the drive shaft by the detected body. The drain bolt is provided with a permanent magnet, the detecting device is structured by a magnetic sensor that includes a magnetic impedance element, and the magnetic sensor is provided at the head portion of the drain bolt. Thereby, it is possible to provide a rotation detecting mechanism by using an existing drain bolt, without requiring the machining of a hole in the compressor body.

    摘要翻译: 该压缩机包括形成主体的壳体部件; 通过电磁离合器连接到驱动电源的驱动轴; 可移动构件与驱动轴协作移动并执行流体的压缩; 与驱动轴协作移动的检测体; 一个排放螺栓,螺纹连接到靠近被检测体的壳体构件中的排水螺栓孔; 以及检测装置,通过检测到的身体检测驱动轴的旋转状态。 排水螺栓设置有永磁体,检测装置由包括磁阻抗元件的磁传感器构成,磁传感器设置在排水螺栓的头部。 因此,可以通过使用现有的排水螺栓来提供旋转​​检测机构,而不需要在压缩机主体中加工孔。

    Method and system for inspecting electronic circuit pattern
    48.
    发明授权
    Method and system for inspecting electronic circuit pattern 有权
    检查电路图的方法和系统

    公开(公告)号:US07231079B2

    公开(公告)日:2007-06-12

    申请号:US10050519

    申请日:2002-01-18

    IPC分类号: G06K9/00

    摘要: For the purpose of reducing a false report and shortening inspection time, an area to be inspected is locally inspected under optimum inspection conditions. In order to avoid the number of detected defects from increasing explosively, and thereby to facilitate control of a critical defect, general-purpose layout data, which is used for producing a mask of a semiconductor wafer, is accumulated in a design information server 2. With reference to the layout data, an area to be inspected, which is inspected by a pattern inspecting apparatus 1, is divided into partial inspection areas including a cell portion and a non-cell portion. Inspection parameters are set for each of the partial inspection areas. In addition, the defect reviewing apparatus 8 obtains an inspection result of the pattern inspecting apparatus 1. When obtaining a defect image, the defect reviewing apparatus 8 identifies a position, where the defect occurred, from among a cell portion, a non-cell portion, a pattern dense portion, and the like according to layout data. Moreover, the defect reviewing apparatus 8 sets inspection parameters, such as pickup magnification of this defect, in response to a result of the identification to set a control criterion of criticality.

    摘要翻译: 为了减少虚假报告和缩短检查时间,在最佳检查条件下对被检查区域进行局部检查。 为了避免检测到的缺陷数量爆炸性增加,从而有利于控制关键缺陷,用于制造半导体晶片的掩模的通用布局数据被累积在设计信息服务器2中。 参照布局数据,由图案检查装置1检查的被检查区域被划分为包括单元部分和非单元部分的局部检查区域。 为每个部分检查区域设置检查参数。 另外,缺陷检查装置8获得图案检查装置1的检查结果。 当获得缺陷图像时,缺陷检查装置8根据布局数据从单元部分,非单元部分,图案密集部分等中识别发生缺陷的位置。 此外,缺陷检查装置8响应于识别的结果设置检查参数,例如该缺陷的拾取倍率,以设置关键性的控制标准。

    Test data analyzing system and test data analyzing program
    49.
    发明申请
    Test data analyzing system and test data analyzing program 失效
    测试数据分析系统和测试数据分析程序

    公开(公告)号:US20070021855A1

    公开(公告)日:2007-01-25

    申请号:US11483740

    申请日:2006-07-11

    IPC分类号: G06F19/00

    摘要: Disclosed is a test data analyzing method and system for use in estimation of a defect cause of a product, such as, an integrated circuit, a liquid crystal display, an optical transceiver, a thin film magnetic head, etc., which is fabricated through plural processes. The estimation of a defect cause is achieved by selecting a wafer number to be analyzed, reading test data, reading fabrication line data, counting frequency of machine codes by wafers, grouping test data by machine codes or frequencies, comparing test data distributions between groups by machine codes, and comparing results between machine codes.

    摘要翻译: 公开了一种用于估计产品的缺陷原因的测试数据分析方法和系统,例如集成电路,液晶显示器,光收发器,薄膜磁头等,其通过 多个过程。 缺陷原因的估计是通过选择要分析的晶片数量,读取测试数据,读取制造线数据,通过晶片对机器代码的计数频率,通过机器代码或频率分组测试数据来实现的,比较组之间的测试数据分布,通过 机器代码,并比较机器代码之间的结果。