公开(公告)号：USD493437S1

公开(公告)日：2004-07-27

申请号：US29175244

申请日：2003-01-31

申请人： Norio Okada ,  Mihoko Hotta

设计人： Norio Okada ,  Mihoko Hotta

公开(公告)号：USD488791S1

公开(公告)日：2004-04-20

申请号：US29183880

申请日：2003-06-17

申请人： Sugiko Honda ,  Norio Okada ,  Takahiro Iijima

设计人： Sugiko Honda ,  Norio Okada ,  Takahiro Iijima

公开(公告)号：US06242337B1

公开(公告)日：2001-06-05

申请号：US09167987

申请日：1998-10-08

申请人： Norio Okada

发明人： Norio Okada

IPC分类号： H01L214763

CPC分类号： H01L23/528 ,  H01L2924/0002 ,  H01L2924/00

摘要： In a method of manufacturing a semiconductor device, a first interlevel insulating film is formed on a silicon wafer. A metal film is formed on the first interlevel insulating film. The metal film is formed to form a first electrode wiring layer having an end located inside an end of the first interlevel insulating film on a peripheral portion of the silicon wafer. An insulating film is formed on the silicon wafer including the first interlevel insulating film and the first electrode wiring layer. A second interlevel insulating film having an end located outside the end of the first electrode wiring layer on the peripheral portion of the silicon wafer is formed by processing the insulating film. A device manufactured by this manufacturing method is also disclosed.

摘要翻译： 在制造半导体器件的方法中，在硅晶片上形成第一层间绝缘膜。 在第一层间绝缘膜上形成金属膜。 金属膜形成为在硅晶片的周边部分上形成有位于第一层间绝缘膜的端部内的端部的第一电极布线层。 在包括第一层间绝缘膜和第一电极布线层的硅晶片上形成绝缘膜。 通过加工绝缘膜，形成第二层间绝缘膜，该第二层间绝缘膜通过在硅晶片的周边部分位于第一电极布线层的端部之外的端部。 还公开了通过该制造方法制造的器件。

公开(公告)号：US08509575B2

公开(公告)日：2013-08-13

申请号：US13318638

申请日：2010-05-19

申请人： Norio Okada

发明人： Norio Okada

IPC分类号： G02B6/12

CPC分类号： H01S5/02276 ,  H01L2224/45144 ,  H01L2224/48091 ,  H01L2924/30107 ,  H01L2924/3011 ,  H01S5/02415 ,  H01S5/02476 ,  H01S5/0265 ,  H01S5/06226 ,  H01L2924/00014 ,  H01L2924/00

摘要： A temperature control module and a support block are mounted on a metal stem. A dielectric substrate is mounted on a side surface of the support block. A support block is mounted on a cooling surface of the temperature control module. A dielectric substrate is mounted on a side surface of the support block. A semiconductor optical modulation element is mounted on the dielectric substrate. A lead pin and a signal line are connected through a bonding wire. The signal line and a signal conductor are connected through a bonding wire. The signal conductor and the semiconductor optical modulation element are connected through a bonding wire.

摘要翻译： 温度控制模块和支撑块安装在金属杆上。 电介质基板安装在支撑块的侧表面上。 支撑块安装在温度控制模块的冷却表面上。 电介质基板安装在支撑块的侧表面上。 半导体光调制元件安装在电介质基片上。 引线引脚和信号线通过接合线连接。 信号线和信号导体通过接合线连接。 信号导体和半导体光调制元件通过接合线连接。

公开(公告)号：US20130161076A1

公开(公告)日：2013-06-27

申请号：US13571961

申请日：2012-08-10

申请人： Norio OKADA

发明人： Norio OKADA

IPC分类号： H05K1/00

CPC分类号： H01P5/028 ,  H01R12/62 ,  H01R13/6474 ,  H05K1/0218 ,  H05K1/0219 ,  H05K1/025 ,  H05K1/0306 ,  H05K3/361 ,  H05K3/366 ,  H05K2201/0715 ,  H05K2201/1034

摘要： A connection unit includes: a ceramic substrate; a first signal line on the ceramic substrate; a first grounded conductor on the ceramic substrate and electromagnetically coupled to the first signal line; a first lead pin having a first end connected to an upper surface of the first signal line and a second end protruding beyond the ceramic substrate; a second lead pin having a first end connected to an upper surface of the first grounded conductor and a second end protruding beyond the ceramic substrate; a flexible substrate including an insulating layer through which the first and second lead pins penetrate, a second signal line on a first major surface of the insulating layer and connected to the second end of the first lead pin, and a second grounded conductor on a second major surface of the insulating layer and connected to the second end of the second lead pin.

摘要翻译： 连接单元包括：陶瓷基板; 陶瓷基板上的第一信号线; 陶瓷衬底上的第一接地导体，并与第一信号线电磁耦合; 第一引脚，其具有连接到第一信号线的上表面的第一端和突出超过陶瓷基板的第二端; 第二引脚，其具有连接到第一接地导体的上表面的第一端和突出超过陶瓷基板的第二端; 柔性基板，其包括第一和第二引线引脚穿过的绝缘层，绝缘层的第一主表面上并连接到第一引脚的第二端的第二信号线，以及在第二引脚的第二引脚上的第二接地导体 绝缘层的主表面并连接到第二引脚的第二端。

公开(公告)号：US08357991B2

公开(公告)日：2013-01-22

申请号：US12616942

申请日：2009-11-12

申请人： Daisuke Oshida ,  Hiroyuki Kunishima ,  Norio Okada

发明人： Daisuke Oshida ,  Hiroyuki Kunishima ,  Norio Okada

IPC分类号： H01L23/52

CPC分类号： H01L23/5258 ,  H01L21/76877 ,  H01L23/5223 ,  H01L23/5329 ,  H01L23/53295 ,  H01L28/60 ,  H01L2924/0002 ,  H01L2924/00

摘要： A semiconductor device includes an upper interconnect, a lower interconnect, insulating layers interposed between the upper interconnect and the lower interconnect, a connecting portion that is formed in the insulating layers and connects the upper interconnect and the lower interconnect, and an element that is placed in one of the insulating layers and has a conductive layer connected to the connecting portion. The connecting portion is formed over the lower interconnect and the end portions of the conductive layer of the element, and is in contact with the upper face of the lower interconnect and the upper faces and side faces of the end portions of the conductive layer of the element.

摘要翻译： 半导体器件包括上互连，下互连，介于上互连和下互连之间的绝缘层，形成在绝缘层中并连接上互连和下互连的连接部分，以及放置 在绝缘层之一中并且具有连接到连接部分的导电层。 连接部分形成在元件的导电层的下互连和端部上，并且与下互连的上表面接触，并且导电层的端部的上表面和侧面 元件。

公开(公告)号：US20120298844A1

公开(公告)日：2012-11-29

申请号：US13434925

申请日：2012-03-30

申请人： Hiromitsu Itamoto ,  Norio Okada

发明人： Hiromitsu Itamoto ,  Norio Okada

IPC分类号： H03F3/08

CPC分类号： H04B10/691 ,  H04B10/693

摘要： An optical detecting device includes a light-detecting element for outputting an electrical signal, a pre-amplifier for amplifying the electrical signal, a signal line connected to an output of the pre-amplifier, and a resistor and a capacitor connected in series between the signal line and GND.

摘要翻译： 光检测装置包括用于输出电信号的光检测元件，用于放大电信号的前置放大器，连接到前置放大器的输出的信号线以及串联连接在前置放大器之间的电阻器和电容器 信号线和GND。

公开(公告)号：US20120162743A1

公开(公告)日：2012-06-28

申请号：US13196946

申请日：2011-08-03

申请人： Norio Okada

发明人： Norio Okada

IPC分类号： G02F1/03

CPC分类号： H01S5/0683 ,  G02F1/0123 ,  H01S5/0085

摘要： An uncooled optical semiconductor device includes: a semiconductor laser outputting laser light; an electric field absorption optical modulator absorbing light depending on a voltage applied to the electric field absorption optical modulator; a monitor photodiode monitoring backlight of the semiconductor laser; an auto power control circuit feeding back current of the monitor photodiode to a bias current supplied to the semiconductor laser; and a bias circuit feeding back an average value of a light absorption current to control a bias voltage applied to the electric field absorption optical modulator. The light absorption current is generated when the electric field absorption optical modulator absorbs the laser light.

摘要翻译： 非制冷光半导体器件包括：输出激光的半导体激光器; 电场吸收光学调制器，其根据施加到电场吸收光调制器的电压吸收光; 监视半导体激光器的监视器光电二极管; 自动功率控制电路将监控光电二极管的电流反馈到提供给半导体激光器的偏置电流; 以及反馈光吸收电流的平均值的偏置电路，以控制施加到电场吸收光调制器的偏置电压。 当电场吸收光调制器吸收激光时产生光吸收电流。

公开(公告)号：US20110279393A1

公开(公告)日：2011-11-17

申请号：US13099675

申请日：2011-05-03

申请人： Norio OKADA ,  Jong Seong LEE ,  Yuzuru MASUDA

发明人： Norio OKADA ,  Jong Seong LEE ,  Yuzuru MASUDA

IPC分类号： G06F3/041

CPC分类号： G06F1/1637 ,  G06F1/1626 ,  G06F3/017 ,  G06F3/0227 ,  G06F3/0416 ,  H04M2250/22

摘要： A method of controlling a display unit of a portable terminal includes receiving a signal corresponding to a user gesture from a touch sensor unit located in a peripheral area of the display unit; and activating or deactivating at least part of the display unit according to the signal received from the touch sensor unit.

摘要翻译： 控制便携式终端的显示单元的方法包括从位于显示单元的周边区域的触摸传感器单元接收与用户手势相对应的信号; 以及根据从所述触摸传感器单元接收的信号激活或去激活所述显示单元的至少一部分。

公开(公告)号：US08005327B2

公开(公告)日：2011-08-23

申请号：US12131161

申请日：2008-06-02

申请人： Takeshi Saito ,  Norio Okada

发明人： Takeshi Saito ,  Norio Okada

IPC分类号： G02B6/26

CPC分类号： H04B10/2504 ,  H01L2224/48091 ,  H01L2924/30107 ,  H01L2924/3011 ,  H04B10/501 ,  H01L2924/00014 ,  H01L2924/00

摘要： An optical transmission module includes a first transmission line for transmitting an electric signal, a resistance element used as a termination point, a second transmission line connected to the resistance element, and a surface ground pattern forming a coplanar line through the first and second transmission lines on a surface of a substrate. A modulator-integrated light-emitting element for outputting output light from an output end face is connected to the surface ground pattern. An electrode pad for modulator driving is located near the output end face on a top face of the modulator-integrated light-emitting element. The first transmission line and the electrode pad are connected by a first wire. The electrode pad and the second transmission line are connected by a second wire. A first notch portion is located in the substrate at a point of intersection between a propagation path of output light of the modulator integrated light-emitting element and a first side face of the substrate. The first and second transmission lines and the electrode pad are aligned.

摘要翻译： 光传输模块包括用于发送电信号的第一传输线，用作终端点的电阻元件，连接到电阻元件的第二传输线，以及通过第一和第二传输线形成共面线的表面接地图案 在基板的表面上。 用于输出来自输出端面的输出光的调制器集成发光元件连接到表面接地图案。 用于调制器驱动的电极焊盘位于调制器集成发光元件的顶面上的输出端面附近。 第一传输线和电极焊盘通过第一线连接。 电极焊盘和第二传输线通过第二导线连接。 在调制器集成发光元件的输出光的传播路径与基板的第一侧面的交点处，第一切口部分位于基板中。 第一和第二传输线和电极焊盘对齐。