公开(公告)号：US06254459B1

公开(公告)日：2001-07-03

申请号：US09455292

申请日：1999-12-06

Applicant: Rajeev Bajaj ,  Herbert E. Litvak ,  Rahul K. Surana ,  Stephen C. Jew ,  Jiri Pecen

Inventor： Rajeev Bajaj ,  Herbert E. Litvak ,  Rahul K. Surana ,  Stephen C. Jew ,  Jiri Pecen

IPC: B24B722

CPC classification number: B24D7/12 ,  B24B21/04 ,  B24B37/04 ,  B24B49/12

Abstract: A wafer polishing device with movable window can be used for in-situ monitoring of a wafer during CMP processing. During most of the CMP operation, the window remains below a polishing surface of a polishing device to protect the window from the deleterious effects of the polishing process. When the window moves into position between the wafer and a measurement sensor, the window is moved closer to the polishing surface. In this position, at least some polishing agent collected in the recess above the window is removed, and an in-situ measurement can be taken with reduced interference from the polishing agent. After the window is positioned away from the wafer and measurement sensor, the window moves farther away from the wafer and polishing surface. With such a movable window, the limitations of current polishing devices are overcome.

Abstract translation: 具有可移动窗口的晶片抛光装置可用于在CMP处理期间的晶片的原位监测。 在大多数CMP操作期间，窗口保持在抛光装置的抛光表面下方，以保护窗口免受抛光过程的有害影响。 当窗口移动到晶片和测量传感器之间的位置时，窗口移动到靠近抛光表面。 在这个位置上，除去收集在窗口上方的凹部中的至少一些抛光剂，并且可以减少来自抛光剂的干扰而进行原位测量。 窗户远离晶片和测量传感器放置后，窗户将远离晶片和抛光表面。 利用这种可移动窗口，克服了当前抛光装置的局限性。

公开(公告)号：US09067299B2

公开(公告)日：2015-06-30

申请号：US13591051

申请日：2012-08-21

Applicant: Rajeev Bajaj ,  Barry Lee Chin ,  Terrance Y. Lee

Inventor： Rajeev Bajaj ,  Barry Lee Chin ,  Terrance Y. Lee

IPC: B29C67/00 ,  B24B37/26 ,  B24D18/00

CPC classification number: B29C64/209 ,  B24B37/26 ,  B24D18/00 ,  B24D18/009 ,  B29C35/0805 ,  B29C64/112 ,  B29C64/20 ,  B29C2035/0827 ,  B29K2075/00 ,  B29K2105/0002 ,  B29K2105/16 ,  B29K2509/02 ,  B29L2031/736 ,  B33Y10/00 ,  B33Y30/00 ,  B33Y50/02 ,  B33Y80/00

Abstract: A method of fabricating a polishing layer of a polishing pad includes successively depositing a plurality of layers with a 3D printer, each layer of the plurality of polishing layers deposited by ejecting a pad material precursor from a nozzle and solidifying the pad material precursor to form a solidified pad material.

Abstract translation: 制造抛光垫的抛光层的方法包括用3D打印机连续沉积多个层，通过从喷嘴喷射垫材料前体而沉积多个抛光层的每层，并固化焊盘材料前体以形成 固化垫材料。

公开(公告)号：US08075745B2

公开(公告)日：2011-12-13

申请号：US11576942

申请日：2005-10-05

Applicant: Rajeev Bajaj

Inventor： Rajeev Bajaj

IPC: C25F7/00

CPC classification number: B23H5/08

Abstract: A polishing pad includes a guide plate having a plurality of holes therein and being affixed to a compressible under-layer; and a plurality of conducting polishing elements each affixed to the compressible under-layer and passing through a sealed contact with a proton exchange membrane and corresponding hole in the guide plate so as to be maintained in a substantially vertical orientation with respect to the compressible under-layer but being translatable in a vertical direction with respect to the guide plate. The polishing pad may also include a slurry distribution material fastened to the guide plate by an adhesive. Pad wear sensors may also be provided in the polishing pad.

Abstract translation: 抛光垫包括其中具有多个孔并被附着在可压缩底层上的引导板; 以及多个导电抛光元件，每个导电抛光元件各自固定到可压缩底层上，并且通过与质子交换膜和引导板中的对应孔的密封接触，以相对于可压缩底层保持基本垂直的方向， 层，但可相对于导板在垂直方向上平移。 抛光垫还可以包括通过粘合剂固定到引导板的浆料分布材料。 抛光垫也可以设置垫磨损传感器。

公开(公告)号：US08066555B2

公开(公告)日：2011-11-29

申请号：US12676318

申请日：2008-08-28

Applicant: Rajeev Bajaj

Inventor： Rajeev Bajaj

IPC: B24D11/00

CPC classification number: B24B37/26

Abstract: A polishing pad includes polishing elements interdigitated with one another over a surface of the polishing pad. Each of the polishing elements is secured so as to restrict lateral movement thereof with respect to others of the polishing elements, but remains moveable in an axis normal to a polishing surface of the polishing elements. Different densities of the polishing elements may be positioned within different areas of the surface of the polishing pad.

Abstract translation: 抛光垫包括在抛光垫的表面上相互交叉的抛光元件。 每个抛光元件被固定以便限制其相对于其它抛光元件的横向运动，但是保持在与抛光元件的抛光表面垂直的轴线上的移动。 抛光元件的不同密度可以位于抛光垫表面的不同区域内。

公开(公告)号：US20110143539A1

公开(公告)日：2011-06-16

申请号：US12991097

申请日：2009-05-15

Applicant: Rajeev Bajaj ,  Stephen Mark Fisher ,  William D. Joseph

Inventor： Rajeev Bajaj ,  Stephen Mark Fisher ,  William D. Joseph

IPC: H01L21/306 ,  B24B41/00

CPC classification number: B24B37/205 ,  B24B49/12

Abstract: A polishing pad including a path therethrough to transmit a signal for in situ monitoring of an endpoint in a polishing operation. In one embodiment, the polishing pad includes a polishing composition distribution layer on a first side of a guide plate and a support layer on an opposed second side of a guide plate. The guide plate retains a plurality of polishing elements that extend along a first direction substantially normal to a plane including the polishing pad and through the polishing composition distribution layer. The polishing pad includes an optical path along the first direction and through a thickness of the pad.

Abstract translation: 抛光垫，其包括穿过其中的通道，以在抛光操作中传输用于原位监测端点的信号。 在一个实施例中，抛光垫包括在导向板的第一侧上的抛光组合物分布层和在引导板的相对的第二侧上的支撑层。 引导板保持沿着基本上垂直于包括抛光垫的平面的第一方向延伸并穿过抛光组合物分布层的多个抛光元件。 抛光垫包括沿着第一方向并通过垫的厚度的光路。

公开(公告)号：US07762871B2

公开(公告)日：2010-07-27

申请号：US11369876

申请日：2006-03-06

Applicant: Rajeev Bajaj

Inventor： Rajeev Bajaj

IPC: B24B1/00 ,  B23K26/00

CPC classification number: B24B53/017 ,  B23K26/0006 ,  B23K26/352 ,  B23K2103/42 ,  B24B37/20

Abstract: A polishing pad conditioning apparatus includes a laser beam generating unit along with a system to transmit or focus the beam. The unit is mounted on a conditioning arm, such that the laser beam may be directed perpendicular to the plane of the polishing pad, which is next to the polishing platen. The conditioning arm is capable of moving across the polishing table to scan the pad radius, allowing the laser to traverse the pad radius.

Abstract translation: 抛光垫调节装置包括激光束产生单元以及用于传输或聚焦光束的系统。 该单元安装在调节臂上，使得激光束可以垂直于抛光垫的平面定向，抛光垫的平面邻近研磨台板。 调理臂能够移动穿过抛光台以扫描焊盘半径，允许激光穿过焊盘半径。

公开(公告)号：US20090061744A1

公开(公告)日：2009-03-05

申请号：US11846304

申请日：2007-08-28

Applicant: Rajeev Bajaj

Inventor： Rajeev Bajaj

IPC: B24B5/00

CPC classification number: B24B37/24 ,  B24B37/042 ,  H01L21/32125

Abstract: A polishing pad has one or more polishing elements made from a hydrogel material having an intrinsic ability to absorb water. The hydrogel material may or may not have micropores, but has a water absorption capability of 4%-60% by weight, a wet tensile strength greater than 1000 psi, a flexural modulus greater than 2000 psi, and a wet Shore D hardness between 25-80, inclusive. The hydrogel material may be made from one or a combination of the following moieties: urethane, alkylene oxides, esters, ethers, acrylic acids, acrylamides, amides, imides, vinylalcohols, vinylacetates, acrylates, methacrylates, sulfones, urethanes, vinylchlorides, etheretherketones, and/or carbonates.

Abstract translation: 抛光垫具有由具有吸收水的固有能力的水凝胶材料制成的一个或多个抛光元件。 水凝胶材料可以具有或可以不具有微孔，但是其吸水能力为4重量％-60重量％，湿拉伸强度大于1000psi，挠曲模量大于2000psi，湿肖氏D硬度为25 -80，包括 水凝胶材料可以由以下部分中的一种或组合制成：氨基甲酸酯，环氧烷，酯，醚，丙烯酸，丙烯酰胺，酰胺，酰亚胺，乙烯醇，乙酸乙烯酯，丙烯酸酯，甲基丙烯酸酯，砜，氨基甲酸酯，氯乙烯，醚醚， 和/或碳酸酯。

公开(公告)号：US20080248734A1

公开(公告)日：2008-10-09

申请号：US11697622

申请日：2007-04-06

Applicant: Rajeev Bajaj

Inventor： Rajeev Bajaj

IPC: B24B7/00 ,  B24B29/00

CPC classification number: B24B37/26

Abstract: A polishing pad includes a guide plate, a porous slurry distribution layer and a flexible under-layer. Polishing elements are interdigitated with one another through the slurry distribution layer and the guide plate. The polishing elements may be affixed to the compressible under-layer and pass through corresponding holes in the guide plate so as to be maintained in a substantially vertical orientation with respect to the compressible under-layer but be translatable in a vertical direction with respect to the guide plate. Optionally, a membrane may be positioned between the guide plate and the slurry distribution layer. The polishing pad may also include wear sensors to assist in determinations of pad wear and end-of-life.

Abstract translation: 抛光垫包括导板，多孔浆料分布层和柔性底层。 抛光元件通过浆料分布层和引导板相互交错。 抛光元件可以固定到可压缩底层并穿过导向板中的相应孔，以便相对于可压缩底层保持基本垂直的方向，但是可以相对于可压缩底层的垂直方向平移 导板。 可选地，膜可以定位在引导板和浆料分布层之间。 抛光垫还可以包括磨损传感器，以帮助确定垫磨损和使用寿命。

公开(公告)号：US20070224925A1

公开(公告)日：2007-09-27

申请号：US11562346

申请日：2006-11-21

Applicant: Rajeev Bajaj

Inventor： Rajeev Bajaj

IPC: B24D11/00

CPC classification number: B24D11/04 ,  B24D7/14

Abstract: A polishing pad has polishing elements of at least two different types of materials, each having a different coefficient of friction, and arranged over a surface of the pad so as to provide a non-planar material removal profile for the pad. The polishing elements may be arranged to provide different material removal profiles, such as an edge-fast, edge-slow, center-fast or center-slow material removal profile.

Abstract translation: 抛光垫具有至少两种不同类型材料的抛光元件，每种材料具有不同的摩擦系数，并且布置在垫的表面上，以便为该垫提供非平面材料去除曲线。 抛光元件可以布置成提供不同的材料去除轮廓，例如边缘快速，边缘缓慢，中心快速或中心缓慢的材料去除轮廓。

公开(公告)号：US07153188B1

公开(公告)日：2006-12-26

申请号：US11245558

申请日：2005-10-07

Applicant: Steven M. Zuniga ,  Hung Chih Chen ,  Stan D. Tsai ,  Kapila Wijekoon ,  Fred C. Redeker ,  Rajeev Bajaj

Inventor： Steven M. Zuniga ,  Hung Chih Chen ,  Stan D. Tsai ,  Kapila Wijekoon ,  Fred C. Redeker ,  Rajeev Bajaj

IPC: B24B49/00

CPC classification number: B24B37/015

Abstract: The carrier head has a base and a substrate backing structure for holding a substrate against a polishing surface during polishing. The substrate backing structure is connected to the base and includes an external surface that contacts a backside of the substrate during polishing. The substrate backing structure also includes a resistive heating system to distribute heat over an area of the external surface and at least one thermally conductive membrane. The external surface is a first surface of the at least one thermally conductive membrane, and the resistive heating system is integrated within one of the at least one thermally conductive membrane.

Abstract translation: 承载头具有底座和衬底背衬结构，用于在抛光期间将衬底保持在抛光表面上。 衬底背衬结构连接到基底并且包括在抛光期间接触衬底背面的外表面。 衬底背衬结构还包括电阻加热系统以在外表面的区域和至少一个导热膜上分配热量。 所述外表面是所述至少一个导热膜的第一表面，并且所述电阻加热系统集成在所述至少一个导热膜之一内。