公开(公告)号：US07961397B2

公开(公告)日：2011-06-14

申请号：US12201447

申请日：2008-08-29

申请人： Herschel M. Marchman ,  Thomas M. Moore ,  Rocky Kruger

发明人： Herschel M. Marchman ,  Thomas M. Moore ,  Rocky Kruger

IPC分类号： G02B27/10

CPC分类号： H01J37/226 ,  H01J37/3045 ,  H01J2237/2482 ,  H01J2237/317 ,  H01J2237/31749

摘要： A single-channel optical processing system for an energetic-beam instrument has separate sources for processing radiation and illumination radiation. The processing radiation and the illumination radiation are combined in a single optical path and directed to a sample surface inside the energetic-beam instrument through a self-focusing rod lens. The self-focusing rod lens thus has a working distance from the sample surface that will not interfere with typical arrangements of ion beams and electron beams in such instruments. A combination of polarizers and beam splitters allows separation of the combined incident radiation and the combined radiation reflected from the sample surface and returned through the same optical channel, so that the reflected radiation may be directed to an optical detector, such as a camera or spectrometer. In other embodiments, additional illumination of the sample surface is provided at an angle to the central axis of the self-focusing rod lens.

摘要翻译： 用于能量束仪器的单通道光学处理系统具有用于处理辐射和照射辐射的单独源。 处理辐射和照射辐射在单个光学路径中组合并通过自聚焦棒透镜指向能量束仪器内部的样品表面。 因此，自聚焦棒透镜具有与样品表面的工作距离，其不会干扰这些仪器中的离子束和电子束的典型布置。 偏振器和分束器的组合允许组合的入射辐射和从样品表面反射的组合辐射分离并通过相同的光学通道返回，使得反射的辐射可以被引导到诸如相机或光谱仪的光学检测器 。 在其他实施例中，样品表面的附加照明以与自聚焦棒透镜的中心轴成一定角度设置。

公开(公告)号：US07785233B1

公开(公告)日：2010-08-31

申请号：US12012474

申请日：2008-02-01

申请人： Thomas M. Moore

发明人： Thomas M. Moore

IPC分类号： A63B5/16

CPC分类号： A63K3/043

摘要： A hurdle has a crossbar and a pair of vertical legs. The hurdle is designed to give way or collapse when the crossbar is struck by a user to minimize the risk of injury and thereby decrease the user's fear of injury. This is done either by splitting the crossbar into separate left and right sections, or by splitting each of the legs into separate top and bottom sections. This permits the separate sections to break apart from an aligned, end-to-end orientation which they possess in an operative position of the hurdle into a nonaligned orientation after the hurdle has given way or collapsed. An elastic member connects the separate sections and urges the sections back into their aligned, end-to-end orientation when a user picks the sections of the hurdle up and resets the hurdle.

摘要翻译： 障碍物有横梁和一对垂直的腿。 当横梁被用户击打时，该障碍被设计为让路或折叠，以最小化受伤的风险，从而减少用户对受伤的恐惧。 这可以通过将交叉开关分割成单独的左侧和右侧部分，或通过将每个腿分成单独的顶部和底部来完成。 这允许分开的部分与对齐的端对端方向分离，在定位已经通过或塌缩之后，它们在障碍物的操作位置中具有不对准的取向。 弹性构件连接分开的部分并且当用户拾取障碍物的部分并重新设置障碍物时，将部分推回其对齐的端对端取向。

公开(公告)号：US07755372B2

公开(公告)日：2010-07-13

申请号：US12238906

申请日：2008-09-26

申请人： Lyudmila Zaykova-Feldman ,  Thomas M. Moore

发明人： Lyudmila Zaykova-Feldman ,  Thomas M. Moore

IPC分类号： G01R31/302

CPC分类号： G01R31/2881 ,  G01M7/08 ,  G01N3/00 ,  G01N3/307 ,  G01N3/313 ,  G01N2203/0044 ,  G01N2203/005 ,  G01N2203/0057 ,  G01N2203/0296 ,  G01N2203/0676 ,  G01R31/2868 ,  H01L21/67011

摘要： Methods for testing flip-chip packages includes aligning a microscope and a test engine. The package under test is placed between the microscope and the test engine, and an acoustic transducer is attached to the package under test. The test engine delivers an impact to the package under test on the side of the package opposite its ball-grid array. Acoustic information and image information from the package under test is recorded. In alternate embodiments, a sequence of packages may be automatically tested.

摘要翻译： 测试倒装芯片封装的方法包括对准显微镜和测试引擎。 被测试的包被放置在显微镜和测试引擎之间，并且声学换能器附着在被测试的包装上。 测试引擎在与球栅阵列相对的封装侧面对被测试的封装产生影响。 记录被测包装的声学信息和图像信息。 在替代实施例中，可以自动测试一系列包装。

公开(公告)号：US20090015274A1

公开(公告)日：2009-01-15

申请号：US12238906

申请日：2008-09-26

申请人： Lyudmila Zaykova-Feldman ,  Thomas M. Moore

发明人： Lyudmila Zaykova-Feldman ,  Thomas M. Moore

IPC分类号： G01R31/302

CPC分类号： G01R31/2881 ,  G01M7/08 ,  G01N3/00 ,  G01N3/307 ,  G01N3/313 ,  G01N2203/0044 ,  G01N2203/005 ,  G01N2203/0057 ,  G01N2203/0296 ,  G01N2203/0676 ,  G01R31/2868 ,  H01L21/67011

摘要： Methods for testing flip-chip packages includes aligning a microscope and a test engine. The package under test is placed between the microscope and the test engine, and an acoustic transducer is attached to the package under test. The test engine delivers an impact to the package under test on the side of the package opposite its ball-grid array. Acoustic information and image information from the package under test is recorded. In alternate embodiments, a sequence of packages may be automatically tested.

摘要翻译： 测试倒装芯片封装的方法包括对准显微镜和测试引擎。 被测试的包被放置在显微镜和测试引擎之间，并且声学换能器附着在被测试的包装上。 测试引擎在与球栅阵列相对的封装侧面对被测试的封装产生影响。 记录被测包装的声学信息和图像信息。 在替代实施例中，可以自动测试一系列包装。

公开(公告)号：US07126133B2

公开(公告)日：2006-10-24

申请号：US11335415

申请日：2006-01-19

申请人： Thomas M. Moore

发明人： Thomas M. Moore

IPC分类号： G01F23/00 ,  G21K5/08 ,  G21K5/10

CPC分类号： H01J37/20 ,  H01J37/26 ,  H01J2237/31745 ,  Y10T29/49915 ,  Y10T29/49922 ,  Y10T29/5147

摘要： A kit for preparing TEM sample holders includes at least one TEM coupon made of a sheet of material and having one or more paths from its edge to a TEM sample holder form embodied in the TEM coupon. There is at least one hole in the coupon defining the outer boundary of the TEM sample holder form. This hole has a mouth that defines a land of material. This land connects the TEM sample holder form to the edge of the sheet. The kit preferably includes at least one probe tip, where the probe tip has a probe-tip point, and finally, a press. The press has inner and outer dies and a former rod opposing the inner and outer dies. A shear punch is situated coaxially with the former rod. Thus, when an actuator drives the shear punch toward the inner and outer dies, the shear punch severs the land and cuts an opening in the TEM sample holder form, and simultaneously the former rod presses the probe tip point or points into the sheet of material. The result is a TEM sample holder with probe-tip points embedded in it, ready for inspection in a TEM of samples attached to the probe-tip points.

摘要翻译： 用于制备TEM样品保持器的试剂盒包括至少一种由一片材料制成的TEM试片，并且具有从其边缘到TEM样品保持器形式的一个或多个路径，其体现在TEM试片中。 试样中至少有一个孔限定了TEM样品保持器形式的外边界。 这个洞有一个口，定义了一块土地。 该土地将TEM样品架形式连接到片材的边缘。 套件优选地包括至少一个探针尖端，其中探针尖端具有探针尖端点，最后包括压力机。 压机具有内模和外模以及与内模和外模对置的前杆。 剪切冲头与前一个杆同轴设置。 因此，当致动器向内模和外模驱动剪切冲头时，剪切冲压器切割焊盘并切割TEM样品保持器形式的开口，同时前者杆将探针尖端点或点压入材料片 。 结果是具有探针尖点的TEM样品架，嵌入其中，准备在附着于探针尖端的样品的TEM中进行检查。

公开(公告)号：US07115882B2

公开(公告)日：2006-10-03

申请号：US11334927

申请日：2006-01-19

申请人： Thomas M. Moore

发明人： Thomas M. Moore

IPC分类号： G01F23/00 ,  G21K5/08 ,  G21K5/10

CPC分类号： H01J37/20 ,  H01J37/26 ,  H01J2237/31745 ,  Y10T29/49915 ,  Y10T29/49922 ,  Y10T29/5147

摘要： A TEM sample holder is formed by cutting the TEM sample holder form from a coupon in a press. The cutting at the same time joins the tip point of a nano-manipulator probe tip with the formed TEM sample holder. The tip point of the probe has a sample attached for inspection in a TEM. The cutting process also creates a gap in the sample holder to allow for FIB milling of the specimen.

公开(公告)号：US06534327B2

公开(公告)日：2003-03-18

申请号：US09832968

申请日：2001-04-11

申请人： Roger J. Stierman ,  Thomas M. Moore ,  Gregory B. Shinn

发明人： Roger J. Stierman ,  Thomas M. Moore ,  Gregory B. Shinn

IPC分类号： H01L214763

CPC分类号： H01L21/288 ,  H01L21/31053 ,  H01L21/3212 ,  H01L23/53228 ,  H01L24/11 ,  H01L2224/05023 ,  H01L2224/13099 ,  H01L2224/45144 ,  H01L2924/00011 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/01022 ,  H01L2924/01023 ,  H01L2924/01024 ,  H01L2924/01027 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01042 ,  H01L2924/01045 ,  H01L2924/01046 ,  H01L2924/01047 ,  H01L2924/01073 ,  H01L2924/01074 ,  H01L2924/01075 ,  H01L2924/01076 ,  H01L2924/01077 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01327 ,  H01L2924/04941 ,  H01L2924/04953 ,  H01L2924/14 ,  H01L2924/3025 ,  H01L2924/00

摘要： A method for reworking integrated circuit (IC) wafers having copper-metallized bond pads exposed in protective overcoat openings and one or more bondable metal layers deposited onto the bond pads by a technology which may produce some parts with off-spec or missing depositions. After identifying the wafer with off-spec metal layers, a layer of glass buffer is deposited over those wafers, which also fill any missing depositions at least partially. The glass-covered surface is then chemically-mechanically polished until the off-spec metal layers and at least a portion of the protective overcoat are removed, without damaging the copper metallization. Finally, a fresh layer of protective overcoat is deposited, selectively opened to expose the bond pads, and provided anew with one or more bondable metal layers.

摘要翻译： 一种用于返回集成电路（IC）晶片的方法，其具有暴露在保护性外涂层开口中的铜金属化接合焊盘和通过可能产生具有不规则或缺失沉积物的某些部件的技术沉积到接合焊盘上的一个或多个可粘结金属层。 在用不规范的金属层识别晶片之后，将一层玻璃缓冲液沉积在那些晶片上，这些晶片至少部分地填充任何缺失的沉积物。 然后将玻璃覆盖的表面进行化学机械抛光，直到去除不合格的金属层和保护外涂层的至少一部分，而不损坏铜金属化。 最后，沉积一层保护性外涂层，选择性地打开以暴露接合焊盘，并重新提供一个或多个可结合的金属层。

公开(公告)号：US06435398B2

公开(公告)日：2002-08-20

申请号：US09864574

申请日：2001-05-24

申请人： Cheryl Hartfield ,  Thomas M. Moore

发明人： Cheryl Hartfield ,  Thomas M. Moore

IPC分类号： B23K3110

CPC分类号： H01L22/20 ,  B23K35/007 ,  H01L24/11 ,  H01L2224/05001 ,  H01L2224/05022 ,  H01L2224/05026 ,  H01L2224/05147 ,  H01L2224/05155 ,  H01L2224/05166 ,  H01L2224/05171 ,  H01L2224/05184 ,  H01L2224/05571 ,  H01L2224/05664 ,  H01L2224/05669 ,  H01L2224/13099 ,  H01L2224/45124 ,  H01L2224/45144 ,  H01L2224/45147 ,  H01L2924/00011 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/01015 ,  H01L2924/01022 ,  H01L2924/01024 ,  H01L2924/01027 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01042 ,  H01L2924/01045 ,  H01L2924/01046 ,  H01L2924/01047 ,  H01L2924/01073 ,  H01L2924/01074 ,  H01L2924/01075 ,  H01L2924/01076 ,  H01L2924/01077 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01327 ,  H01L2924/04941 ,  H01L2924/04953 ,  H01L2924/10329 ,  H01L2924/14 ,  H01L2924/3025 ,  H01L2924/00 ,  H01L2224/05541 ,  H01L2224/05005 ,  H01L2924/00014

摘要： A method for reworking integrated circuit (IC) wafers having copper-metallized bond pads covered by deposited layers of a barrier metal and a bondable metal. After identifying the wafers with off-spec metal layers, the wafers are chemically etched using selective etchants consecutively until the metal layers over the bond pads are removed without damaging the copper metallization. Replacement metal layers are finally deposited over the bond pads. Specifically, the bondable metal, such as gold, is selectively removed by a cyclic dithio-oxamine compound, dissolved in tetra-hydro-furane or acetone. The barrier metals, such as nickel and palladium, are removed by a mixture of inorganic and organic oxidizing acids.

摘要翻译： 一种用于对由隔离金属和可结合金属的沉积层覆盖的铜金属化接合焊盘进行返工的集成电路（IC）晶片的方法。 在使用不规范的金属层识别晶片之后，使用选择性蚀刻剂连续地化学蚀刻晶片，直到去除接合焊盘上的金属层而不损坏铜金属化。 替代金属层最终沉积在接合焊盘上。 具体地说，可接合的金属，例如金，通过溶解在四氢呋喃或丙酮中的环状二硫 - 氧化胺化合物选择性除去。 阻挡金属如镍和钯通过无机和有机氧化酸的混合物除去。