Abstract:
A touch panel includes a display module, a touch sensor, an anti-noise unit and a signal processing unit. The display module generates a noise. The touch sensor is disposed above the display module and outputs an abnormal signal, wherein the abnormal signal includes the noise and a sensing signal. The anti-noise unit is adapted to receive the abnormal signal and then reject the noise so as to form the sensing signal. The signal processing unit is adapted to process the sensing signal.
Abstract:
The present invention provides a method and system for image identification and identification result output, wherein a feature image under identification acquired from an image is compared with a plurality of sample images respectively stored in a database so as to obtain a plurality of similarity indexes associated with the plurality of sample images respectively. Each similarity index represents similarity between the feature image and the corresponding sample image. Thereafter, the plurality of similarity indexes are sorted and then a least one of comparison results is output. The present invention is further capable of being used for identifying identification marks with respect to a carrier. By sorting the similarity index with respect to each feature forming the identification marks, it is capable of outputting many sets of combinations corresponding to the identification marks so as to improve speed for targeting suspected carrier and enhance the identification efficiency.
Abstract:
The present invention provides a color backsheet for a building-integrated photovoltaic (BIPV) module comprising a polyethylene terephthalate (PET) film and a fluorine-containing polymer film, at least one of the films being doped with dyes or pigments. The present invention also provides a color BIPV module comprising the color backsheet according to the present invention.
Abstract:
A multi-terminal solar panel includes a first substrate, a first solar cell layer, a transparent intercellular layer, a second solar cell layer and a second substrate. The first solar cell layer is disposed on the first substrate and has a first bandgap. The first solar cell layer includes two first terminal outputs, arranged substantially in parallel with each other, at two opposite edges thereof. The transparent intercellular layer is disposed on the first solar cell layer and exposes the two first terminal outputs. The second solar cell layer is disposed on the transparent intercellular layer and has a second bandgap. The second solar cell layer includes two second terminal outputs, arranged substantially in parallel with each other, at two opposite edges thereof. The second substrate is disposed on the second solar cell layer, wherein the two second terminal outputs are substantially perpendicular to the two first terminal outputs.
Abstract:
A punched metal tape having a conductive strip and an adhesive layer is provided to replace the conventional metal ribbon. The conductive strip surrounding a punched hole can be inversed to the opposite side of the metal tape to directly contact a back metal electrode of a photovoltaic cell.
Abstract:
Disclosed herein is a solar cell module, which includes a photovoltaic member, a back transparent substrate and an ink layer. The photovoltaic member is capable of converting light into electricity. The ink layer is disposed between the photovoltaic member and the transparent back substrate, and can be observed through the back transparent substrate. The ink layer may exhibit a colorful picture or pattern.
Abstract:
The present invention relates to a tandem organic light emitting device, which reduces the driving voltage by using a non-doping material having both the electron transporting and hole transporting abilities to act, respectively, as an electron transporting layer and a hole transporting layer that are in contact with the connecting layer. The tandem organic light emitting device does not have to double its driving voltage as a result of the increasing of the number of the emitting element contained therein. However, the brightness and the current efficiency of the device of the present invention will be higher than the theoretical fold value calculated in accordance with the number of emitting element contained in the device.
Abstract:
An apparatus and method for testing conductive bumps are provided. An exemplary embodiment of a bump testing unit comprises a support substrate with two probes protruding one surface thereof. A digital detecting device is embedded in the support substrate, comprising a first and second input terminals and an output terminal, wherein the input terminals electrically connects one of the probes.
Abstract:
A semiconductor device formed in a semiconductor substrate for dissipating electrostatic discharge and/or accumulated charge in an integrated circuit is provided. In one embodiment, the device comprises a semiconductor substrate; a plurality of layers of metal lines formed overlying the substrate; a plurality of via plugs through intermetal dielectric layers between the layers of metal lines and wherein the via plugs interconnect the metal lines; and a dummy pad formed over the plurality of layers of metal lines, the dummy pad having a diode connected thereto and to ground for providing a discharge path for the electrostatic discharge and/or accumulated charge.
Abstract:
A test structure to detect vertical leakage in a multi-layer flip chip pad stack or similar semiconductor device. The test structure is integrated into the semiconductor device when it is fabricated. A metal layer includes at least two portions that are electrically isolated from each other; one portion being disposed under a test pad, and another portion being disposed under a pad associated with a pad structure being tested. The metal layer in most cases is separated from a top metal layer directly underlying the pads by an inter-metal dielectric (IMD) layer. A metal layer portion underlying the pad to be tested forms a recess in which a conductive member is disposed without making electrical contact. The conductive line is electrically coupled to a test portion of the same or, alternately, of a different metal layer. The test structure may be implemented on multiple layers, with recesses portions underlying the same or different pads.