公开(公告)号：US07888186B2

公开(公告)日：2011-02-15

申请号：US12499788

申请日：2009-07-08

Applicant: Zhigang Bai ,  Weimin Chen ,  Zhijie Wang

Inventor： Zhigang Bai ,  Weimin Chen ,  Zhijie Wang

IPC: H01L21/00

CPC classification number: H01L23/3107 ,  H01L21/565 ,  H01L23/3121 ,  H01L24/45 ,  H01L24/48 ,  H01L25/105 ,  H01L2224/16225 ,  H01L2224/45124 ,  H01L2224/45144 ,  H01L2224/45147 ,  H01L2224/48091 ,  H01L2225/1058 ,  H01L2924/01013 ,  H01L2924/01079 ,  H01L2924/15153 ,  H01L2924/15165 ,  H01L2924/15331 ,  H01L2924/181 ,  Y10T29/41 ,  Y10T29/51 ,  H01L2924/00014 ,  H01L2924/00012

Abstract: A method for assembling a stackable semiconductor package includes providing a substrate having a first surface and a second surface. The first surface includes bond pads and one or more die pads. Conductive bumps are formed on the bond pads and one or more semiconductor dies are attached to the one or more die pads. The first surface of the substrate, the semiconductor dies and the conductive bumps are placed in a side-gate molding cast and a mold material is supplied to the first surface of the substrate to form a stackable semiconductor package. Similarly formed semiconductor packages may be stacked, one on another to form a stacked semiconductor package.

Abstract translation: 一种用于组装可堆叠半导体封装的方法包括提供具有第一表面和第二表面的衬底。 第一表面包括接合焊盘和一个或多个管芯焊盘。 导电凸块形成在接合焊盘上，并且一个或多个半导体管芯附接到一个或多个管芯焊盘。 将基板的第一表面，半导体管芯和导电凸块放置在侧浇口模铸件中，并将模具材料供应到基板的第一表面以形成可堆叠的半导体封装。 类似地形成的半导体封装可以彼此层叠以形成堆叠的半导体封装。

公开(公告)号：US07523848B2

公开(公告)日：2009-04-28

申请号：US11148540

申请日：2005-06-09

Applicant: David T. Beatson ,  Deepak Sood ,  Norman Lucas ,  Zhijie Wang

Inventor： David T. Beatson ,  Deepak Sood ,  Norman Lucas ,  Zhijie Wang

IPC: B23K31/02 ,  G01B11/00

CPC classification number: B23K20/007 ,  B23K20/10 ,  B23K31/12 ,  B23K2101/40 ,  H01L2224/78301 ,  H01L2924/14

Abstract: A system for measuring the size of free air balls for use with a wire bonder having a wire bonding tool and an Electric Flame Off (EFO) device is provided. The system includes an imager disposed above a first image plane, a prism disposed below the imager, and at least one lens positioned between the first image plane and the prism in a first optical path. The at least one lens is positioned between the prism and the imager in a second optical path, where the second optical path is different from the first optical path. An image of the free air ball disposed at a lower portion of the wire bonding tool is provided to the imager via the prism and the at least one lens.

Abstract translation: 提供了一种用于测量与具有引线接合工具和电火焰熄灭（EFO）装置的引线接合器一起使用的自由空气球的尺寸的系统。 该系统包括设置在第一图像平面上方的成像器，设置在成像器下方的棱镜以及位于第一光路中的第一像面与棱镜之间的至少一个透镜。 所述至少一个透镜位于所述棱镜和所述成像器之间的第二光路中，其中所述第二光路不同于所述第一光路。 设置在引线接合工具的下部的自由空气球的图像通过棱镜和至少一个透镜被提供给成像器。

公开(公告)号：US20050284914A1

公开(公告)日：2005-12-29

申请号：US11148540

申请日：2005-06-09

Applicant: David Beatson ,  Deepak Sood ,  Norman Lucas ,  Zhijie Wang

Inventor： David Beatson ,  Deepak Sood ,  Norman Lucas ,  Zhijie Wang

IPC: B23K20/00 ,  B23K20/10 ,  B23K31/02 ,  B23K31/12 ,  B23K37/00

CPC classification number: B23K20/007 ,  B23K20/10 ,  B23K31/12 ,  B23K2101/40 ,  H01L2224/78301 ,  H01L2924/14

Abstract: A system for measuring the size of free air balls for use with a wire bonder having a wire bonding tool and an Electric Flame Off (EFO) device is provided. The system includes an imager disposed above a first image plane, a prism disposed below the imager, and at least one lens positioned between the first image plane and the prism in a first optical path. The at least one lens is positioned between the prism and the imager in a second optical path, where the second optical path is different from the first optical path. An image of the free air ball disposed at a lower portion of the wire bonding tool is provided to the imager via the prism and the at least one lens.

Abstract translation: 提供了一种用于测量与具有引线接合工具和电火焰熄灭（EFO）装置的引线接合器一起使用的自由空气球的尺寸的系统。 该系统包括设置在第一图像平面上方的成像器，设置在成像器下方的棱镜以及位于第一光路中的第一像面与棱镜之间的至少一个透镜。 所述至少一个透镜位于所述棱镜和所述成像器之间的第二光路中，其中所述第二光路不同于所述第一光路。 设置在引线接合工具的下部的自由空气球的图像通过棱镜和至少一个透镜被提供给成像器。