公开(公告)号：US20050284914A1

公开(公告)日：2005-12-29

申请号：US11148540

申请日：2005-06-09

申请人： David Beatson ,  Deepak Sood ,  Norman Lucas ,  Zhijie Wang

发明人： David Beatson ,  Deepak Sood ,  Norman Lucas ,  Zhijie Wang

IPC分类号： B23K20/00 ,  B23K20/10 ,  B23K31/02 ,  B23K31/12 ,  B23K37/00

CPC分类号： B23K20/007 ,  B23K20/10 ,  B23K31/12 ,  B23K2101/40 ,  H01L2224/78301 ,  H01L2924/14

摘要： A system for measuring the size of free air balls for use with a wire bonder having a wire bonding tool and an Electric Flame Off (EFO) device is provided. The system includes an imager disposed above a first image plane, a prism disposed below the imager, and at least one lens positioned between the first image plane and the prism in a first optical path. The at least one lens is positioned between the prism and the imager in a second optical path, where the second optical path is different from the first optical path. An image of the free air ball disposed at a lower portion of the wire bonding tool is provided to the imager via the prism and the at least one lens.

摘要翻译： 提供了一种用于测量与具有引线接合工具和电火焰熄灭（EFO）装置的引线接合器一起使用的自由空气球的尺寸的系统。 该系统包括设置在第一图像平面上方的成像器，设置在成像器下方的棱镜以及位于第一光路中的第一像面与棱镜之间的至少一个透镜。 所述至少一个透镜位于所述棱镜和所述成像器之间的第二光路中，其中所述第二光路不同于所述第一光路。 设置在引线接合工具的下部的自由空气球的图像通过棱镜和至少一个透镜被提供给成像器。

公开(公告)号：US20050286060A1

公开(公告)日：2005-12-29

申请号：US11148486

申请日：2005-06-09

申请人： David Beatson ,  Deepak Sood ,  Norman Lucas

发明人： David Beatson ,  Deepak Sood ,  Norman Lucas

IPC分类号： B23K20/00 ,  G01B11/14

CPC分类号： H01L24/78 ,  B23K20/007 ,  H01L2224/78301 ,  H01L2224/859 ,  H01L2924/00014 ,  H01L2924/01005 ,  H01L2924/0102 ,  H01L2924/01033 ,  H01L2924/01077 ,  H01L2924/01082 ,  H01L2924/12043 ,  H01L2924/14 ,  Y10S228/904 ,  H01L2224/48 ,  H01L2224/45099 ,  H01L2924/00

摘要： A system for determining wire bonding tool placement for use with a wire bonder and an optical imager is provided. The system includes a prism disposed below the optical imager and the wire bonding tool. The system also includes at least one lens positioned between the prism and a lower portion of the wire bonding tool along a first optical axis. The at least one lens and the prism define an object plane between the at least one lens and the lower portion of the wire bonding tool. The at least one lens is positioned between the prism and the optical imager along a second optical axis. The at least one lens and the prism define an image plane between the at least one lens and the optical imager.

摘要翻译： 提供了一种用于确定用于引线接合器和光学成像器的引线接合工具布置的系统。 该系统包括设置在光学成像器下方的棱镜和引线接合工具。 该系统还包括沿着第一光轴定位在棱镜和引线接合工具的下部之间的至少一个透镜。 所述至少一个透镜和所述棱镜在所述至少一个透镜和所述引线接合工具的下部之间限定物平面。 所述至少一个透镜沿着第二光轴定位在所述棱镜和所述光学成像器之间。 所述至少一个透镜和所述棱镜限定所述至少一个透镜和所述光学成像器之间的图像平面。

公开(公告)号：US20070089551A1

公开(公告)日：2007-04-26

申请号：US11529784

申请日：2006-09-29

申请人： Scott Williams ,  Edward Laurent ,  David Beatson ,  Bahadir Tunaboylu ,  Edward Malantonio

发明人： Scott Williams ,  Edward Laurent ,  David Beatson ,  Bahadir Tunaboylu ,  Edward Malantonio

IPC分类号： G01B5/28 ,  G01D21/00

CPC分类号： G01R1/06727

摘要： A probe for a probe card assembly includes a beam and a fulcrum element. The fulcrum element is positioned between a base end portion of the beam and a tip end portion of the beam and is adapted for contact with the beam such that the beam is cantilevered by the fulcrum.

摘要翻译： 用于探针卡组件的探针包括光束和支点元件。 支点元件位于梁的基端部分和梁的顶端部分之间，并且适于与梁接触，使得梁被支点悬臂。

公开(公告)号：US20070026574A1

公开(公告)日：2007-02-01

申请号：US10552429

申请日：2004-04-08

申请人： David Beatson ,  Horst Clauderg ,  Kenneth Dury

发明人： David Beatson ,  Horst Clauderg ,  Kenneth Dury

IPC分类号： H01L21/00 ,  H01L23/495

CPC分类号： H01L24/85 ,  H01L24/05 ,  H01L24/45 ,  H01L24/48 ,  H01L24/49 ,  H01L24/81 ,  H01L2224/04042 ,  H01L2224/05554 ,  H01L2224/05599 ,  H01L2224/45015 ,  H01L2224/45124 ,  H01L2224/45144 ,  H01L2224/45147 ,  H01L2224/48 ,  H01L2224/49175 ,  H01L2224/81801 ,  H01L2224/85205 ,  H01L2224/85399 ,  H01L2924/00014 ,  H01L2924/01006 ,  H01L2924/01007 ,  H01L2924/01013 ,  H01L2924/01014 ,  H01L2924/01015 ,  H01L2924/01018 ,  H01L2924/01022 ,  H01L2924/01029 ,  H01L2924/0103 ,  H01L2924/01033 ,  H01L2924/0104 ,  H01L2924/01047 ,  H01L2924/0105 ,  H01L2924/01073 ,  H01L2924/01074 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/01084 ,  H01L2924/014 ,  H01L2924/04941 ,  H01L2924/04953 ,  H01L2924/05042 ,  H01L2924/10253 ,  H01L2924/12041 ,  H01L2924/14 ,  H01L2924/15747 ,  H01L2924/15787 ,  H01L2924/19041 ,  H01L2924/19043 ,  H01L2924/3011 ,  H01L2924/3025 ,  Y10T29/49204 ,  H01L2224/78 ,  H01L2924/00 ,  H01L2924/20751 ,  H01L2924/20753 ,  H01L2924/00015

摘要： Disclosed are interconnect structures and methods which utilize a bonding surface comprising copper nitride. The interconnect structures include a bonding surface comprising copper nitride which is effective at preventing oxidation and/or other unwanted corrosion of the underlying conductive material while providing the basis for a high conductivity bond. The copper nitride bonding surface provides a relatively non-conductive, corrosion-resistant bonding surface while at the same time being readily transformed into a conductive layer at or just prior to the time of bonding.

摘要翻译： 公开了利用包含氮化铜的接合表面的互连结构和方法。 互连结构包括包含氮化铜的结合表面，其有效地防止下面的导电材料的氧化和/或其它不希望的腐蚀，同时为高导电性键提供基础。 氮化铜接合表面提供相对不导电的耐腐蚀粘合表面，同时在粘合时或之前容易地转变成导电层。

公开(公告)号：US20050046968A1

公开(公告)日：2005-03-03

申请号：US10953962

申请日：2004-09-29

申请人： David Beatson ,  Christian Hoffman

发明人： David Beatson ,  Christian Hoffman

IPC分类号： G01N21/88 ,  G02B27/14 ,  G02B27/10 ,  G02B9/08 ,  G02B13/00

CPC分类号： G02B27/145 ,  G01N21/8806 ,  G01N2021/8845 ,  G02B27/1066

摘要： A method and system for providing different images representing plural depths of field of an electronic device. The vision system has a beamsplitter for receiving an image of the device illuminated by the at least one light source, the beamsplitter providing one of the plurality of images of the device based in a wavelength of the light source; an aperture having a plurality of effective diameters based on the wavelength of light from the at least one light source, the aperture determining a depth of field of the image of the device; and an optical element for receiving the image of the device, the optical element magnifying the image by a predetermined magnification factor to produce a magnified image having the determined depth of field.

摘要翻译： 一种用于提供表示电子设备的多个景深的不同图像的方法和系统。 视觉系统具有用于接收由至少一个光源照射的装置的图像的分束器，分束器基于光源的波长提供装置的多个图像中的一个; 基于来自所述至少一个光源的光的波长具有多个有效直径的孔，所述孔确定所述装置的图像的景深; 以及用于接收装置的图像的光学元件，所述光学元件以预定的放大系数放大图像以产生具有确定的景深的放大图像。

公开(公告)号：US20060219754A1

公开(公告)日：2006-10-05

申请号：US11096140

申请日：2005-03-31

申请人： Horst Clauberg ,  Ronald Focia ,  David Beatson ,  Kenneth Dury

发明人： Horst Clauberg ,  Ronald Focia ,  David Beatson ,  Kenneth Dury

IPC分类号： B23K13/08 ,  B23K37/00

CPC分类号： H01L24/85 ,  B08B7/00 ,  B08B7/0057 ,  B23K20/004 ,  B23K20/24 ,  B23K2101/40 ,  C23F4/00 ,  H01L21/67138 ,  H01L24/45 ,  H01L24/48 ,  H01L24/78 ,  H01L2224/45014 ,  H01L2224/45147 ,  H01L2224/48247 ,  H01L2224/7801 ,  H01L2224/78301 ,  H01L2224/85013 ,  H01L2224/85055 ,  H01L2224/85065 ,  H01L2224/85075 ,  H01L2224/851 ,  H01L2924/00014 ,  H01L2924/01007 ,  H01L2924/0101 ,  H01L2924/01013 ,  H01L2924/01018 ,  H01L2924/01028 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/14 ,  H01L2924/01001 ,  H01L2924/01002 ,  H01L2924/206

摘要： A wire cleaning system for cleaning wire configured to be wirebonded is provided. The wire cleaning system includes a chamber through which a wire configured to be wirebonded extends prior to the wire being wirebonded. The wire cleaning system also includes an energy source for removing contamination from the wire in the chamber prior to the wire being wirebonded.

摘要翻译： 提供了一种用于清洁被配置为引线键合的导线的电线清洁系统。 电线清洁系统包括一个室，通过该室配置成引线接合的导线在导线接合之前延伸。 电线清洁系统还包括能量源，用于在电线被引线接合之前去除腔室中的电线的污染物。

公开(公告)号：US20050260791A1

公开(公告)日：2005-11-24

申请号：US11123858

申请日：2005-05-05

申请人： David Beatson ,  Jamin Ling

发明人： David Beatson ,  Jamin Ling

IPC分类号： H01L21/44 ,  H01L21/48 ,  H01L21/60 ,  H01L21/607 ,  H01L21/68 ,  H01L23/13 ,  H01L23/31 ,  H01L23/49 ,  H01L23/498

CPC分类号： H01L24/85 ,  H01L21/486 ,  H01L21/565 ,  H01L21/568 ,  H01L21/6835 ,  H01L23/13 ,  H01L23/3128 ,  H01L23/49816 ,  H01L24/45 ,  H01L24/48 ,  H01L24/78 ,  H01L2221/68372 ,  H01L2224/11003 ,  H01L2224/45124 ,  H01L2224/45144 ,  H01L2224/45147 ,  H01L2224/45164 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2224/48228 ,  H01L2224/4824 ,  H01L2224/48464 ,  H01L2224/48471 ,  H01L2224/48475 ,  H01L2224/48599 ,  H01L2224/48699 ,  H01L2224/78301 ,  H01L2224/85001 ,  H01L2224/85045 ,  H01L2224/85051 ,  H01L2224/85186 ,  H01L2224/85205 ,  H01L2224/85365 ,  H01L2924/00014 ,  H01L2924/01013 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01046 ,  H01L2924/01047 ,  H01L2924/01079 ,  H01L2924/014 ,  H01L2924/12042 ,  H01L2924/14 ,  H01L2924/15311 ,  H01L2924/181 ,  H01L2924/18301 ,  H01L2924/30107 ,  H01L2924/00 ,  H01L2924/00012 ,  H01L2224/85399 ,  H01L2224/05599

摘要： A method of processing a semiconductor device is provided. The method includes providing a semiconductor device supported by a carrier structure. The carrier structure defines a plurality of vias from a first surface of the carrier structure adjacent the semiconductor device to a second surface of the carrier structure. The method also includes extending a conductor through one of the vias such that a first end of the conductor at least partially extends below the second surface. The method also includes electrically coupling another portion of the conductor to a portion of the semiconductor device.

摘要翻译： 提供一种处理半导体器件的方法。 该方法包括提供由载体结构支撑的半导体器件。 载体结构从邻近半导体器件的载体结构的第一表面到载体结构的第二表面限定多个通孔。 该方法还包括将导体延伸通过其中一个通孔，使得导体的第一端至少部分地延伸到第二表面的下方。 该方法还包括将导体的另一部分电耦合到半导体器件的一部分。

公开(公告)号：US20050284915A1

公开(公告)日：2005-12-29

申请号：US11152130

申请日：2005-06-14

申请人： David Beatson ,  Richard Sadler ,  Mohamad Aziz ,  Arindam Sinharoy

发明人： David Beatson ,  Richard Sadler ,  Mohamad Aziz ,  Arindam Sinharoy

IPC分类号： B23K20/00 ,  B23K31/02 ,  B23K37/00 ,  H01L21/00

CPC分类号： H01L24/85 ,  B23K20/004 ,  B23K2101/40 ,  H01L24/45 ,  H01L24/78 ,  H01L2224/45124 ,  H01L2224/45144 ,  H01L2224/45147 ,  H01L2224/78251 ,  H01L2224/7865 ,  H01L2224/78744 ,  H01L2224/85 ,  H01L2224/85205 ,  H01L2924/00014 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/01019 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/014 ,  H01L2924/14 ,  H01L2224/48 ,  H01L2924/00

摘要： An apparatus for manipulating a work piece in connection with a wire bonding machine including at least one magazine handler is provided. The apparatus includes a first conveyor system configured to receive work pieces from the at least one magazine handler, and a second conveyor system configured to receive work pieces from the at least one magazine handler. The apparatus is adapted such that the second conveyor system prepares a work piece for a wire bonding operation by a wire bonding tool concurrent with the first conveyor system supporting another work piece during a wire bonding operation of the another work piece using the wire bonding tool.

摘要翻译： 提供了一种用于与包括至少一个杂物处理器的引线接合机相关联地操作工件的设备。 该装置包括构造成从至少一个杂物处理器接收工件的第一传送系统和被配置成从至少一个杂物处理器接收工件的第二传送系统。 该装置适于使得第二传送系统在使用引线接合工具的另一工件的引线接合操作期间通过引线接合工具准备用于引线接合操作的工件，并与第一输送系统同时支撑另一工件。

公开(公告)号：US20050052194A1

公开(公告)日：2005-03-10

申请号：US10964316

申请日：2004-10-12

申请人： January Kister ,  David Beatson ,  Edward Laurent

发明人： January Kister ,  David Beatson ,  Edward Laurent

IPC分类号： G01R1/073 ,  G01R31/02

CPC分类号： G01R1/07357 ,  Y10T29/49117

摘要： A interconnect assembly features a prefabricated interconnect structure metallurgically bonded to a terminal of a larger structure. Fabrication of the interconnect structure's independently and separate from the larger structure enables the use of economic mass fabrication techniques that are well-known for miniature scale sheet metal parts. During fabrication, positioning and attachment, each interconnect structure is combined with and/or held in a carrier structure from which it is separated after attachment to the terminal. The interconnect structure is configured such that an attachment tool may be brought into close proximity to the attachment interface between the interconnect structure and the terminal for a short and direct transmission of bonding energy onto the attachment interface. The attachment interface provides for an electrically conductive and a bending stress opposing mechanical connection between the interconnect structure and the terminal. The interconnect assembly is preferably part of a probe apparatus.

摘要翻译： 互连组件具有冶金结合到更大结构的端子的预制互连结构。 互连结构的独立结构和较大结构的制造使得能够使用为微型钣金零件而众所周知的经济大规模制造技术。 在制造，定位和附接期间，每个互连结构与载体结构组合和/或保持在载体结构中，在附接到终端之后，载体结构被分离。 互连结构被配置成使得附接工具可以靠近互连结构和端子之间的连接接口，以便将粘合能量短暂且直接地传递到附接界面上。 连接接口提供了导电和弯曲应力，该互连结构与端子之间的机械连接相反。 互连组件优选地是探针装置的一部分。

公开(公告)号：US20050046969A1

公开(公告)日：2005-03-03

申请号：US10952953

申请日：2004-09-29

申请人： David Beatson ,  Christian Hoffman

发明人： David Beatson ,  Christian Hoffman

IPC分类号： G01N21/88 ,  G02B27/14 ,  G02B27/10 ,  G02B9/00

CPC分类号： G02B27/145 ,  G01N21/8806 ,  G01N2021/8845 ,  G02B27/1066

摘要： A method and system for providing different images representing plural depths of field of an electronic device. The vision system has a beamsplitter for receiving an image of the device illuminated by the at least one light source, the beamsplitter providing one of the plurality of images of the device based in a wavelength of the light source; an aperture having a plurality of effective diameters based on the wavelength of light from the at least one light source, the aperture determining a depth of field of the image of the device; and an optical element for receiving the image of the device, the optical element magnifying the image by a predetermined magnification factor to produce a magnified image having the determined depth of field.

摘要翻译： 一种用于提供表示电子设备的多个景深的不同图像的方法和系统。 视觉系统具有用于接收由至少一个光源照射的装置的图像的分束器，分束器基于光源的波长提供装置的多个图像中的一个; 基于来自所述至少一个光源的光的波长具有多个有效直径的孔，所述孔确定所述装置的图像的景深; 以及用于接收装置的图像的光学元件，所述光学元件以预定的放大系数放大图像以产生具有确定的景深的放大图像。