公开(公告)号：US08792410B2

公开(公告)日：2014-07-29

申请号：US13370732

申请日：2012-02-10

申请人： Weimin Chen ,  Gauquan Lin

发明人： Weimin Chen ,  Gauquan Lin

IPC分类号： H04B7/14 ,  H04W28/06 ,  H04W84/04

CPC分类号： H04W28/06 ,  H04W84/047

摘要： Embodiments of the present invention disclose a relay method of a transport bearer, an apparatus and a communication system. According to the technical solutions in the present invention, when receiving information encapsulated by a source device and sent by the source device, a relay base station first decapsulates the information, encapsulates the information again, and then sends the encapsulated information to a host device, thus ensuring that the information has only a layer of encapsulation in the transport procedure, so as to avoid a case that a high overhead caused by two layers of encapsulation occurs in the transport procedure. Compared with the prior art, the overhead in the transport procedure may be reduced, and the transport efficiency may be increased.

摘要翻译： 本发明的实施例公开了传输承载的中继方法，装置和通信系统。 根据本发明的技术方案，当接收到由源设备封装并由源设备发送的信息时，中继基站首先对信息进行解封装，再次封装信息，然后将封装的信息发送到主机设备， 从而确保信息在传输过程中仅具有一层封装，以避免在传输过程中发生由两层封装引起的高开销的情况。 与现有技术相比，可以降低运输过程中的开销，并且可以提高运输效率。

公开(公告)号：US08354739B2

公开(公告)日：2013-01-15

申请号：US13092159

申请日：2011-04-22

申请人： Yeqing Su ,  Zhigang Bai ,  Weimin Chen ,  Wei Shen ,  Jianhong Wang ,  Baoguan Yin ,  Wanming Yu

发明人： Yeqing Su ,  Zhigang Bai ,  Weimin Chen ,  Wei Shen ,  Jianhong Wang ,  Baoguan Yin ,  Wanming Yu

IPC分类号： H01L23/495 ,  H01L21/28

CPC分类号： H01L21/6835 ,  H01L21/568 ,  H01L23/3107 ,  H01L23/49541 ,  H01L24/48 ,  H01L24/85 ,  H01L2224/05554 ,  H01L2224/48091 ,  H01L2224/48247 ,  H01L2224/8501 ,  H01L2924/00014 ,  H01L2924/18165 ,  H01L2224/45099

摘要： A method for manufacturing a thin semiconductor package includes providing a lead frame with a removable substrate that has an attaching surface attached to a first surface of the lead frame. The lead frame is formed from an electrically conductive sheet and has leads that extend inwardly from a lead frame boundary towards a central region of the lead frame. A semiconductor die is mounted on the removable substrate at the central region. The semiconductor die has a connection pad surface with die pads on it, and the connection pad surface is attached to the attaching surface of the removable substrate. The lead frame and die are encapsulated with a first encapsulant so that the lead frame is sandwiched between the first encapsulant and the removable substrate. The removable substrate is removed from the lead frame to expose the first surface of the lead frame and then the die pads are electrically connected to respective ones of the leads. The die and lead frame then are encapsulated with a second encapsulant so that the lead frame and die are sandwiched between the first and second encapsulants. Part of the first encapsulant is then removed to reduce the thickness of the package and expose the leads.

摘要翻译： 一种用于制造薄半导体封装的方法，包括：提供具有可移除基板的引线框架，该可移除基板具有附接到引线框架的第一表面的附接表面。 引线框架由导电片形成，并且具有从引线框架边界朝向引线框架的中心区域向内延伸的引线。 半导体管芯安装在中央区域的可拆卸基板上。 半导体管芯具有连接焊盘表面，其上具有焊盘，并且连接焊盘表面附接到可移除基板的附接表面。 引线框架和管芯用第一密封剂封装，使得引线框架夹在第一密封剂和可移除基板之间。 将可移除基板从引线框架移除以露出引线框架的第一表面，然后将管芯焊盘电连接到相应的引线。 然后，管芯和引线框架用第二密封剂封装，使得引线框架和管芯夹在第一和第二密封剂之间。 然后去除部分第一密封剂以减小包装的厚度并暴露引线。

公开(公告)号：US08955457B2

公开(公告)日：2015-02-17

申请号：US13263151

申请日：2010-04-06

申请人： Weimin Chen ,  Toru Mitsuboshi

发明人： Weimin Chen ,  Toru Mitsuboshi

IPC分类号： A01K61/02

CPC分类号： A01K61/02 ,  A01K61/80 ,  Y02A40/845

摘要： A method for feeding farmed fish by using au automatic feeder (20), which supplies a feed to the farmed fish in accordance with a preset feeding schedule, and a feed-demand sensor (22), which detects a demand for the feed by the farmed fish, characterized in that the feed-supply by the automatic feeder (20) is controlled on the basis of the detection results from the feed-demand sensor (22).

摘要翻译： 一种通过使用au自动进料器（20）喂养养殖鱼的方法，该自动喂料器根据预设的进料计划向饲养的鱼提供饲料;以及饲料需求传感器（22），其检测饲料的需求 养殖鱼，其特征在于，基于来自所述饲料需求传感器（22）的检测结果来控制由所述自动进料器（20）供给的饲料。

公开(公告)号：US20100317152A1

公开(公告)日：2010-12-16

申请号：US12499788

申请日：2009-07-08

申请人： Zhigang BAI ,  Weimin Chen ,  Zhijie Wang

发明人： Zhigang BAI ,  Weimin Chen ,  Zhijie Wang

IPC分类号： H01L21/60 ,  B23P23/00

CPC分类号： H01L23/3107 ,  H01L21/565 ,  H01L23/3121 ,  H01L24/45 ,  H01L24/48 ,  H01L25/105 ,  H01L2224/16225 ,  H01L2224/45124 ,  H01L2224/45144 ,  H01L2224/45147 ,  H01L2224/48091 ,  H01L2225/1058 ,  H01L2924/01013 ,  H01L2924/01079 ,  H01L2924/15153 ,  H01L2924/15165 ,  H01L2924/15331 ,  H01L2924/181 ,  Y10T29/41 ,  Y10T29/51 ,  H01L2924/00014 ,  H01L2924/00012

摘要： A method for assembling a stackable semiconductor package includes providing a substrate having a first surface and a second surface. The first surface includes bond pads and one or more die pads. Conductive bumps are formed on the bond pads and one or more semiconductor dies are attached to the one or more die pads. The first surface of the substrate, the semiconductor dies and the conductive bumps are placed in a side-gate molding cast and a mold material is supplied to the first surface of the substrate to form a stackable semiconductor package. Similarly formed semiconductor packages may be stacked, one on another to form a stacked semiconductor package.

摘要翻译： 一种用于组装可堆叠半导体封装的方法包括提供具有第一表面和第二表面的衬底。 第一表面包括接合焊盘和一个或多个管芯焊盘。 导电凸块形成在接合焊盘上，并且一个或多个半导体管芯附接到一个或多个管芯焊盘。 将基板的第一表面，半导体管芯和导电凸块放置在侧浇口模铸件中，并将模具材料供应到基板的第一表面以形成可堆叠的半导体封装。 类似地形成的半导体封装可以彼此层叠以形成堆叠的半导体封装。

公开(公告)号：US07742509B2

公开(公告)日：2010-06-22

申请号：US12237735

申请日：2008-09-25

申请人： Yingjun Ma ,  Shijie Gu ,  Li Wu ,  Hehui Wu ,  Weimin Chen ,  Yanli Wang

发明人： Yingjun Ma ,  Shijie Gu ,  Li Wu ,  Hehui Wu ,  Weimin Chen ,  Yanli Wang

IPC分类号： H01S3/098 ,  H01S3/08

CPC分类号： H01S3/08031 ,  H01S3/08036 ,  H01S3/08054 ,  H01S3/09415 ,  H01S3/10061 ,  H01S3/1028 ,  H01S3/1611 ,  H01S3/1671 ,  H01S3/1673

摘要： A single longitudinal-mode laser includes a first mirror and a second mirror that define a laser cavity therein that does not include a linear polarizer. A birefringent gain medium can generate a lasing light at a lasing wavelength along a light propagation direction in response to a pump light at a pumping wavelength. The birefringent gain medium has an optical axis substantially perpendicular to the light propagation direction. A first wave plate positioned between the first mirror and the birefringent gain medium is a quarter wave plate at the lasing wavelength and a whole wave plate at the pumping wavelength. A second wave plate is positioned between the birefringent gain medium and the second mirror. The first wave plat and the second wave plate in part produce a single longitudinal mode in the lasing light.

摘要翻译： 单个纵模激光器包括在其中限定不包括线性偏振器的激光腔的第一反射镜和第二反射镜。 双折射增益介质可以响应泵浦波长的泵浦光沿光传播方向产生激发波长的激光。 双折射增益介质具有基本上垂直于光传播方向的光轴。 位于第一反射镜和双折射增益介质之间的第一波片是激光波长的四分之一波片和在泵浦波长处的整个波片。 第二波片位于双折射增益介质和第二反射镜之间。 第一波片和第二波片部分地在激光中产生单一纵模。

公开(公告)号：US20090257831A1

公开(公告)日：2009-10-15

申请号：US12083744

申请日：2005-12-31

申请人： Bingwen Li ,  Jiyun Zhao ,  Qiguang Wang ,  Shiqi Chen ,  Jianwu Wang ,  Weimin Chen

发明人： Bingwen Li ,  Jiyun Zhao ,  Qiguang Wang ,  Shiqi Chen ,  Jianwu Wang ,  Weimin Chen

IPC分类号： E21D15/45

CPC分类号： E21D15/44

摘要： A suspending hydraulic pillar includes an oil cylinder, a movable prop, a handle-valve body, a reset spring, a top cover, a bottom seat, a three-way valve, a position-limiting steel wire, and a guide ring. The handle-valve body is provided between a port of the oil cylinder port and the moveable prop. Position-limiting steel wire, a guiding ring, and an oil inlet is located on a lower part of the moveable prop. The three-way valve is provided in the handle-valve body. A dust-prevention ring and a sealing ring are provided between the handle-valve body, the mvoable prop, and the oil cylinder. The handle-valve body is fixed on the oil cylinder by means of a connecting steel wire. The handle-valve body does not move up and down as the movable prop telescopically extends or contracts. The suspending hydraulic has good stability, high strength and supporting force, good sealing, and high anti-erosive capability.

摘要翻译： 悬挂液压柱包括油缸，可动支柱，手柄阀体，复位弹簧，顶盖，底座，三通阀，限位钢丝和导向环。 手柄阀体设置在油缸端口和可移动支架之间。 位置限制钢丝，导向环和进油口位于可移动支柱的下部。 三通阀设在手柄阀体内。 在手柄阀体，可拆卸支架和油缸之间设有防尘环和密封圈。 手柄阀体通过连接钢丝固定在油缸上。 当可移动支柱可伸缩地伸展或收缩时，手柄阀体不会上下移动。 悬挂液压稳定性好，强度高，支撑力大，密封性好，抗腐蚀能力强。

公开(公告)号：US06684014B2

公开(公告)日：2004-01-27

申请号：US09967483

申请日：2001-09-28

申请人： Li Wu ,  Jiwu Ling ,  Weimin Chen ,  Chenggang Xin ,  Zhen Miao ,  Cuilian Zhan

发明人： Li Wu ,  Jiwu Ling ,  Weimin Chen ,  Chenggang Xin ,  Zhen Miao ,  Cuilian Zhan

IPC分类号： G02B626

CPC分类号： G02B6/2937 ,  G02B6/32

摘要： The invention relates to a micro-optic adhesive assembly and a method for making a micro-optic assembly. The method of joining optical assemblies in accordance with the present invention improves the strength and shock resistance of adhesive joints in micro-optic devices without affecting the optical path. The adhesive assembly of the present invention has sufficiently flexibility to be able to conform to different alignment geometries without introducing significant bulk or thermal expansion incompatibility. Further the improved method is compatible with the device manufacturing techniques and does not add significant manufacturing complexity. An optical device in accordance with the invention comprises: a first optical element having an optical path therethrough and having a coupling end face; a second optical element having an optical path therethrough and having a coupling end face optically coupled to the coupling end face of the first optical element such that light propagating on the optical path of the first element couples to the optical path of the second element; an adhesive joint between the coupling end face of the first element and the coupling end face of the second element, such that adhesive is not in the optical paths therethrough; and a plurality of flexible crossties each secured to an exterior surface of the first element and to an exterior surface of the second element to reinforce the adhesive joint.

摘要翻译： 本发明涉及微光学胶粘剂组件和用于制造微光学组件的方法。 根据本发明的连接光学组件的方法提高了微光学器件中的粘合剂接合部的强度和抗冲击性，而不影响光路。 本发明的粘合剂组件具有足够的柔性以能够符合不同的对准几何形状而不引入显着的体积或热膨胀不相容性。 此外，改进的方法与设备制造技术兼容，并且不会增加显着的制造复杂性。 根据本发明的光学装置包括：具有穿过其中的光路并具有耦合端面的第一光学元件; 第二光学元件具有穿过其中的光路，并且具有光耦合到第一光学元件的耦合端面的耦合端面，使得在第一元件的光路上传播的光耦合到第二元件的光路; 在第一元件的耦合端面和第二元件的耦合端面之间的粘合剂接合部，使得粘合剂不在其中的光路中; 以及多个柔性搭扣，每个固定到第一元件的外表面和第二元件的外表面以加强粘合剂接合部。

公开(公告)号：US20120014314A1

公开(公告)日：2012-01-19

申请号：US13246965

申请日：2011-09-28

申请人： Weimin Chen ,  Gaoquan Lin ,  Saixiang Fu

发明人： Weimin Chen ,  Gaoquan Lin ,  Saixiang Fu

IPC分类号： H04W40/00 ,  H04L12/54

CPC分类号： H04W84/047 ,  H04L1/1887 ,  H04W28/06

摘要： A method for realizing data forwarding, a network system, and a related device are provided. The method includes: receiving data sent from an external device; and judging whether the data is from or to a backhaul terminal, and directly forwarding the data if the data is from or to the backhaul terminal. A Base Station (BS) device includes: a receiving module, configured to receive data sent from an external device; a backhaul judging module, configured to judge whether the data is from or to a backhaul terminal; and a sending module, configured to directly forward the data after the backhaul judging module judges that the data is from or to the backhaul terminal. A backhaul terminal and a network system are further correspondingly provided. Accordingly, transmission bandwidth is saved through the provided technical solutions.

摘要翻译： 提供了实现数据转发的方法，网络系统和相关设备。 该方法包括：接收从外部设备发送的数据; 并且判断数据是来自还是回传终端，以及如果数据来自或者回程终端，则直接转发数据。 基站（BS）装置包括：接收模块，用于接收从外部设备发送的数据; 回程判断模块，被配置为判断所述数据是来自还是回传终端; 以及发送模块，被配置为在所述回程判断模块判断所述数据来自所述回程终端或者回程终端之后直接转发所述数据。 进一步相应地提供回程终端和网络系统。 因此，通过提供的技术方案节省了传输带宽。

公开(公告)号：US20110316130A1

公开(公告)日：2011-12-29

申请号：US13092159

申请日：2011-04-22

申请人： Yeqing Su ,  Zhigang Bai ,  Weimin Chen ,  Wei Shen ,  Jianhong Wang ,  Baoguan Yin ,  Wanming Yu

发明人： Yeqing Su ,  Zhigang Bai ,  Weimin Chen ,  Wei Shen ,  Jianhong Wang ,  Baoguan Yin ,  Wanming Yu

IPC分类号： H01L23/495 ,  H01L21/28

CPC分类号： H01L21/6835 ,  H01L21/568 ,  H01L23/3107 ,  H01L23/49541 ,  H01L24/48 ,  H01L24/85 ,  H01L2224/05554 ,  H01L2224/48091 ,  H01L2224/48247 ,  H01L2224/8501 ,  H01L2924/00014 ,  H01L2924/18165 ,  H01L2224/45099

摘要： A method for manufacturing a thin semiconductor package includes providing a lead frame with a removable substrate that has an attaching surface attached to a first surface of the lead frame. The lead frame is formed from an electrically conductive sheet and has leads that extend inwardly from a lead frame boundary towards a central region of the lead frame. A semiconductor die is mounted on the removable substrate at the central region. The semiconductor die has a connection pad surface with die pads on it, and the connection pad surface is attached to the attaching surface of the removable substrate. The lead frame and die are encapsulated with a first encapsulant so that the lead frame is sandwiched between the first encapsulant and the removable substrate. The removable substrate is removed from the lead frame to expose the first surface of the lead frame and then the die pads are electrically connected to respective ones of the leads. The die and lead frame then are encapsulated with a second encapsulant so that the lead frame and die are sandwiched between the first and second encapsulants. Part of the first encapsulant is then removed to reduce the thickness of the package and expose the leads.

摘要翻译： 一种用于制造薄半导体封装的方法，包括：提供具有可移除基板的引线框架，该可移除基板具有附接到引线框架的第一表面的附接表面。 引线框架由导电片形成，并且具有从引线框架边界朝向引线框架的中心区域向内延伸的引线。 半导体管芯安装在中央区域的可拆卸基板上。 半导体管芯具有连接焊盘表面，其上具有焊盘，并且连接焊盘表面附接到可移除基板的附接表面。 引线框架和管芯用第一密封剂封装，使得引线框架夹在第一密封剂和可移除基板之间。 将可移除基板从引线框架移除以露出引线框架的第一表面，然后将管芯焊盘电连接到相应的引线。 然后，管芯和引线框架用第二密封剂封装，使得引线框架和管芯夹在第一和第二密封剂之间。 然后去除部分第一密封剂以减小包装的厚度并暴露引线。

公开(公告)号：US07888186B2

公开(公告)日：2011-02-15

申请号：US12499788

申请日：2009-07-08

申请人： Zhigang Bai ,  Weimin Chen ,  Zhijie Wang

发明人： Zhigang Bai ,  Weimin Chen ,  Zhijie Wang

IPC分类号： H01L21/00

CPC分类号： H01L23/3107 ,  H01L21/565 ,  H01L23/3121 ,  H01L24/45 ,  H01L24/48 ,  H01L25/105 ,  H01L2224/16225 ,  H01L2224/45124 ,  H01L2224/45144 ,  H01L2224/45147 ,  H01L2224/48091 ,  H01L2225/1058 ,  H01L2924/01013 ,  H01L2924/01079 ,  H01L2924/15153 ,  H01L2924/15165 ,  H01L2924/15331 ,  H01L2924/181 ,  Y10T29/41 ,  Y10T29/51 ,  H01L2924/00014 ,  H01L2924/00012

摘要： A method for assembling a stackable semiconductor package includes providing a substrate having a first surface and a second surface. The first surface includes bond pads and one or more die pads. Conductive bumps are formed on the bond pads and one or more semiconductor dies are attached to the one or more die pads. The first surface of the substrate, the semiconductor dies and the conductive bumps are placed in a side-gate molding cast and a mold material is supplied to the first surface of the substrate to form a stackable semiconductor package. Similarly formed semiconductor packages may be stacked, one on another to form a stacked semiconductor package.

摘要翻译： 一种用于组装可堆叠半导体封装的方法包括提供具有第一表面和第二表面的衬底。 第一表面包括接合焊盘和一个或多个管芯焊盘。 导电凸块形成在接合焊盘上，并且一个或多个半导体管芯附接到一个或多个管芯焊盘。 将基板的第一表面，半导体管芯和导电凸块放置在侧浇口模铸件中，并将模具材料供应到基板的第一表面以形成可堆叠的半导体封装。 类似地形成的半导体封装可以彼此层叠以形成堆叠的半导体封装。