公开(公告)号：US10818816B2

公开(公告)日：2020-10-27

申请号：US15821302

申请日：2017-11-22

Applicant: Advanced Semiconductor Engineering, Inc.

Inventor： Lu-Ming Lai ,  Shih-Chieh Tang

IPC: H01L27/146 ,  H01L31/0232 ,  H01L31/105 ,  H01L31/173 ,  H01L27/15 ,  H01L31/02 ,  G06K9/00 ,  H01L33/20

Abstract: An optical device includes a substrate, a plurality of light emitting devices, a photo detector and a circuit layer. The substrate has a first surface and a second surface opposite to the first surface. The substrate includes a first region and a second region. The light emitting devices are disposed on the first surface in the first region of the substrate. The photo detector is disposed in the second region of the substrate. The photo detector includes an electrical contact exposed from the second surface of the substrate. The circuit layer is disposed on the second surface of the substrate and electrically connected to the electrical contact of the photo detector.

公开(公告)号：US10508910B2

公开(公告)日：2019-12-17

申请号：US14975083

申请日：2015-12-18

Applicant: Advanced Semiconductor Engineering, Inc.

Inventor： Ying-Chung Chen ,  Hsun-Wei Chan ,  Lu-Ming Lai ,  Kuang-Hsiung Chen

IPC: G01C3/08

Abstract: An optical module includes a carrier, a light source disposed on an upper side of the carrier, an optical sensor disposed on the upper side of the carrier, and a housing disposed on the upper side of the carrier over the light source and the optical sensor. The housing defines a first aperture exposing at least a portion of the light source and a second aperture exposing at least a portion of the optical sensor. An outer sidewall of the housing includes at least one singulation portion adjacent to the upper side of the carrier and perpendicular to the upper side of the carrier.

公开(公告)号：US09711473B1

公开(公告)日：2017-07-18

申请号：US15054502

申请日：2016-02-26

Applicant: Advanced Semiconductor Engineering, Inc.

Inventor： Chin-Cheng Kuo ,  Ying-Te Ou ,  Lu-Ming Lai

IPC: H01L23/28 ,  H01L23/00 ,  H01L23/528 ,  H01L23/522 ,  H01L21/768 ,  H01L21/78

CPC classification number: H01L24/13 ,  H01L21/561 ,  H01L21/76802 ,  H01L21/76831 ,  H01L21/76877 ,  H01L21/78 ,  H01L23/3114 ,  H01L23/3185 ,  H01L23/5226 ,  H01L23/528 ,  H01L24/05 ,  H01L24/11 ,  H01L24/14 ,  H01L2224/0401 ,  H01L2224/05124 ,  H01L2224/05147 ,  H01L2224/05624 ,  H01L2224/05647 ,  H01L2224/05655 ,  H01L2224/05666 ,  H01L2224/13024 ,  H01L2224/13111 ,  H01L2924/10156 ,  H01L2924/00014

Abstract: A semiconductor die includes a semiconductor body, an insulating layer, a conductive circuit layer and at least one conductive bump. The semiconductor body has a first surface, a second surface and a side surface extending between the first surface and the second surface. The insulating layer is disposed on the first surface and the side surface of the semiconductor body. The insulating layer includes a first insulating layer over the semiconductor body and a second insulating layer over the first insulating later. The insulating layer includes a step structure. The conductive circuit layer is electrically connected to the first surface of the semiconductor body, the conductive circuit layer includes at least one pad, and the conductive bump is electrically connected to the pad.

公开(公告)号：US20170073221A1

公开(公告)日：2017-03-16

申请号：US14855684

申请日：2015-09-16

Applicant: Advanced Semiconductor Engineering, Inc.

Inventor： Ching-Han Huang ,  Hsun-Wei Chan ,  Lu-Ming Lai

IPC: B81B7/00 ,  B81C1/00

Abstract: A semiconductor device package includes a carrier, a wall disposed on a top surface of the carrier, a cover, and a sensor element. The cover includes a portion protruding from a bottom surface of the cover, where the protruding portion of the cover contacts a top surface of the wall to define a space. The sensor element is positioned in the space.

Abstract translation: 半导体器件封装包括载体，设置在载体的顶表面上的壁，盖和传感器元件。 所述盖包括从所述盖的底表面突出的部分，其中所述盖的突出部分接触所述壁的顶表面以限定空间。 传感器元件位于空间中。