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公开(公告)号：US20180335558A1
公开(公告)日：2018-11-22
申请号：US15982947
申请日：2018-05-17
Applicant: Ayar Labs, Inc.
Inventor： John Fini , Roy Edward Meade , Derek Van Orden , Mark Wade
Abstract: A first reflecting region is positioned at an end of an optical fiber and includes a polarization-sensitive reflector configured to selectively reflect a first polarization of light emanating from the optical fiber into a first reflected beam and transmit light that is not of the first polarization. The first reflected beam is directed toward a first optical grating coupler on a chip. A spacer layer is disposed on the first reflecting region such that light transmitted from the first reflecting region enters and passes through the spacer layer. A second reflecting region is disposed on the spacer layer and is configured to reflect light that is incident upon the second reflecting region into a second reflected beam directed toward a second optical grating coupler on the chip. A thickness of the spacer layer is set to control a separation distance between the first reflected beam and the second reflected beam.
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公开(公告)号：US20180239095A1
公开(公告)日：2018-08-23
申请号：US15902923
申请日：2018-02-22
Applicant: Ayar Labs, Inc.
Inventor： Mark Wade , Chen Sun , John Fini , Roy Edward Meade , Vladimir Stojanovic , Alexandra Wright
CPC classification number: G02B6/423 , G02B6/3636 , G02B6/4214 , G02B6/4239 , G02B6/4283 , H01L29/0649
Abstract: A photonic chip includes a substrate, an electrical isolation region formed over the substrate, and a front end of line (FEOL) region formed over the electrical isolation region. The photonic chip also includes an optical coupling region. The electrical isolation region and the FEOL region and a portion of the substrate are removed within the optical coupling region. A top surface of a the substrate within the optical coupling region includes a plurality of grooves configured to receive and align a plurality of optical fibers. The grooves are formed at a vertical depth within the substrate to provide for alignment of optical cores of the plurality of optical fibers with the FEOL region when the plurality of optical fibers are positioned within the plurality of grooves within the optical coupling region.
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公开(公告)号：US20180172910A1
公开(公告)日：2018-06-21
申请号：US15841210
申请日：2017-12-13
Applicant: Ayar Labs, Inc.
Inventor： Roy Edward Meade , John Fini , Mark Wade
Abstract: A lens assembly for an optical fiber includes an optical gap structure and a multi-mode optical fiber. The optical gap structure has first and second ends and a length measured therebetween. The first end of the optical gap structure is configured to attach to an end of a single-mode optical fiber. The multi-mode optical fiber has first and second ends and a length measured therebetween. The first end of the multi-mode optical fiber is attached to the second end of the optical gap structure. The length of the optical gap structure and the length of the multi-mode optical fiber are set to provide a prescribed working distance and a prescribed light beam waist diameter. The prescribed working distance is a distance measured from the second end of the multi-mode optical fiber to a location of the prescribed light beam waist diameter.
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公开(公告)号：US12014962B2
公开(公告)日：2024-06-18
申请号：US18346555
申请日：2023-07-03
Applicant: Ayar Labs, Inc.
Inventor： Roy Edward Meade , Anatol Khilo , Forrest Sedgwick , Alexandra Wright
IPC: H01L21/66 , G01R31/3185 , G02B6/12 , G02B6/13 , H04B10/073 , F21V8/00 , H04B10/50
CPC classification number: H01L22/30 , G01R31/318511 , G02B6/12 , G02B6/13 , H04B10/0731 , G02B6/0028 , H04B10/503
Abstract: A semiconductor wafer includes a semiconductor chip that includes a photonic device. The semiconductor chip includes an optical fiber attachment region in which an optical fiber alignment structure is to be fabricated. The optical fiber alignment structure is not yet fabricated in the optical fiber attachment region. The semiconductor chip includes an in-plane fiber-to-chip optical coupler positioned at an edge of the optical fiber attachment region. The in-plane fiber-to-chip optical coupler is optically connected to the photonic device. A sacrificial optical structure is optically coupled to the in-plane fiber-to-chip optical coupler. The sacrificial optical structure includes an out-of-plane optical coupler configured to receive input light from a light source external to the semiconductor chip. At least a portion of the sacrificial optical structure extends through the optical fiber attachment region.
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公开(公告)号：US11994724B2
公开(公告)日：2024-05-28
申请号：US17671525
申请日：2022-02-14
Applicant: Ayar Labs, Inc.
Inventor： Alexandra Wright , Mark Wade , Chen Sun , Vladimir Stojanovic , Rajeev Ram , Milos Popovic , Roy Edward Meade , Derek Van Orden
CPC classification number: G02B6/4202 , G02B6/2934 , G02B6/4216 , G02B6/4219 , G02B6/4287
Abstract: An optical input/output chiplet is disposed on a first package substrate. The optical input/output chiplet includes one or more supply optical ports for receiving continuous wave light. The optical input/output chiplet includes one or more transmit optical ports through which modulated light is transmitted. The optical input/output chiplet includes one or more receive optical ports through which modulated light is received by the optical input/output chiplet. An optical power supply module is disposed on a second package substrate. The second package substrate is separate from the first package substrate. The optical power supply module includes one or more output optical ports through which continuous wave laser light is transmitted. A set of optical fibers optically connect the one or more output optical ports of the optical power supply module to the one or more supply optical ports of the optical input/output chiplet.
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Patent Agency Ranking
公开(公告)号：US11899251B2
公开(公告)日：2024-02-13
申请号：US17083058
申请日：2020-10-28
Applicant: Ayar Labs, Inc.
Inventor： Chong Zhang , Roy Edward Meade
CPC classification number: G02B6/42 , G02B6/30 , G02B6/4214 , G02B6/4249 , G02B6/4274 , H01L23/5389 , H01L25/18 , H01L25/50 , H05K1/0274 , G02B6/428 , G02B6/43 , H05K2201/10121
Abstract: A vertical integrated photonics chiplet assembly includes a package substrate and an external device connected to a top surface of the package substrate. A photonics chip is disposed within the package substrate. The photonics chip includes optical coupling devices positioned at a top surface of the photonics chip. A plurality of conductive via structures are disposed within the package substrate in electrical connection with electrical circuits within the photonics chip. The plurality of conductive via structures are electrically connected through the package substrate to the external device. An opening is formed through the top surface of the substrate to expose a portion of the top surface of the photonics chip at which the optical coupling devices are positioned. An optical fiber array is disposed and secured within the opening such that a plurality of optical fibers of the optical fiber array optically couple to the optical coupling devices.
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公开(公告)号：US20230070458A1
公开(公告)日：2023-03-09
申请号：US17987485
申请日：2022-11-15
Applicant: Ayar Labs, Inc.
Inventor： Roy Edward Meade , Chong Zhang , Haiwei Lu , Chen Li
Abstract: A multi-chip package assembly includes a substrate, a first semiconductor chip attached to the substrate, and a second semiconductor chip attached to the substrate, such that a portion of the second semiconductor chip overhangs an edge of the substrate. A first v-groove array for receiving a plurality of optical fibers is present within the portion of the second semiconductor chip that overhangs the edge of the substrate. An optical fiber assembly including the plurality of optical fibers is positioned and secured within the first v-groove array of the second semiconductor chip. The optical fiber assembly includes a second v-groove array configured to align the plurality of optical fibers to the first v-groove array of the second semiconductor chip. An end of each of the plurality of optical fibers is exposed for optical coupling within an optical fiber connector located at a distal end of the optical fiber assembly.
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公开(公告)号：US11493708B2
公开(公告)日：2022-11-08
申请号：US17021805
申请日：2020-09-15
Applicant: Ayar Labs, Inc.
Inventor： Roy Edward Meade , Vladimir Stojanovic
Abstract: A plurality of lid structures include at least one lid structure configured to overlie one or more heat sources within a multi-chip-module and at least one lid structure configured to overlie one or more temperature sensitive components within the multi-chip-module. The plurality of lid structures are configured and positioned such that each lid structure is separated from each adjacent lid structure by a corresponding thermal break. A heat spreader assembly is positioned in thermally conductive interface with the plurality of lid structures. The heat spreader assembly is configured to cover an aggregation of the plurality of lid structures. The heat spreader assembly includes a plurality of separately defined heat transfer members respectively configured and positioned to overlie the plurality of lid structures. The heat spreader assembly is configured to limit heat transfer between different heat transfer members within the heat spreader assembly.
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公开(公告)号：US20220214509A1
公开(公告)日：2022-07-07
申请号：US17700367
申请日：2022-03-21
Applicant: Ayar Labs, Inc.
Inventor： John Fini , Roy Edward Meade , Derek Van Orden , Mark Wade
IPC: G02B6/42
Abstract: A beam steering structure includes an alignment structure shaped to receive and align an optical fiber such that an axis of a core of the optical fiber is oriented in a first direction. The beam steering structure includes an end portion having an angled optical surface oriented at a non-zero angle relative to the first direction. The end portion is shaped and positioned so that light propagating along the first direction from the optical fiber passes through the end portion to reach the angled optical surface. A reflecting system is positioned on the angled optical surface across the first direction. The reflecting system is configured to reflect incident light propagating along the first direction into a first reflected beam of a first polarization and a second reflected beam of a second polarization. The first and second reflected beams are directed into first and second optical communication channels, respectively.
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公开(公告)号：US20220171142A1
公开(公告)日：2022-06-02
申请号：US17671525
申请日：2022-02-14
Applicant: Ayar Labs, Inc.
Inventor： Alexandra Wright , Mark Wade , Chen Sun , Vladimir Stojanovic , Rajeev Ram , Milos Popovic , Roy Edward Meade , Derek Van Orden
Abstract: An optical input/output chiplet is disposed on a first package substrate. The optical input/output chiplet includes one or more supply optical ports for receiving continuous wave light. The optical input/output chiplet includes one or more transmit optical ports through which modulated light is transmitted. The optical input/output chiplet includes one or more receive optical ports through which modulated light is received by the optical input/output chiplet. An optical power supply module is disposed on a second package substrate. The second package substrate is separate from the first package substrate. The optical power supply module includes one or more output optical ports through which continuous wave laser light is transmitted. A set of optical fibers optically connect the one or more output optical ports of the optical power supply module to the one or more supply optical ports of the optical input/output chiplet.
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