摘要:
An electronic device may be provided having an organic light-emitting diode display and control circuitry for operating the display. The display may include one or more display layers interposed between the control circuitry and a display layer having thin-film transistors. The electronic device may include a coupling structure interposed between the layer of thin-film transistors and the control circuitry that electrically couples the layer of thin-film transistors to the control circuitry. The coupling structure may include a dielectric member having a conductive via, a flexible printed circuit having a bent portion, or a conductive via formed in an encapsulation layer of the display. The display may include a layer of opaque masking material. The layer of opaque masking material may be formed on an encapsulation layer, an organic emissive layer, a thin-film transistor layer, or a glass layer of the organic light-emitting diode display.
摘要:
A hinge assembly having a hollow and partially annular clutch is arranged to pivotally couple a portable computer base portion to a portable computer lid portion. The hinge assembly includes at least an elongated, hollow and partially open cylindrical portion that includes a partially annular outer region and a central bore region, the central bore region suitably arranged to provide support for electrical conductors between the base and lid portions. The hinge assembly also includes a plurality of fastening components that couple the hollow clutch to the base portion and the lid portion of the portable computer, with at least one of the fastening regions being integrally formed with the hollow and partially open cylindrical portion such that space, size and part count are minimized.
摘要:
The described embodiments relate generally to optimizing airflow in a computer system. By modifying the external surface of centrifugal cooling fan enclosures the pressure drop associated with airflow moving around the enclosures can be reduced. This is generally accomplished by rounding off hard edges from the outside of the cooling fan enclosure as well as forming cover surfaces rather than simply using flat cover surfaces. In some cases this can also involve modifying the shape of the fan inlet, or even contouring the shape of the cooling fan blades to allow air to flow more easily through the computer enclosure.
摘要:
The described embodiments relate generally to computing devices including liquid crystal displays (LCDs) and more particularly to methods for attaching a backlight assembly to a cover glass layer while minimizing an amount of stress transferred through the cover glass layer to the LCD module. A continuous and compliant foam adhesive can be used to bond the cover glass layer to the backlight assembly. The compliant bond can absorb and distribute local stress concentrations caused by structural loads, mismatched surfaces and differing thermal expansion rates between various structures and cover glass layer. This can reduce stress concentrations in the cover glass layer that can lead to stress induced birefringence in the LCD cell. In another embodiment, a series of rigid plates can be bonded to the cover glass layer and attached to the backlight assembly. Point loads applied from the backlight assembly can be distributed over a larger area due to the resilience of the rigid plates.
摘要:
A low profile heat removal system suitable for removing excess heat generated by a component operating in a compact computing environment is disclosed.
摘要:
A low profile heat removal system suitable for removing excess heat generated by a component operating in a compact computing environment is disclosed.
摘要:
Magnetic elements and attractors may be employed to secure a top case and a bottom case of a housing of a personal computing device. The magnetic elements may include a magnet that produces a magnetic field and a shunt. The shunt may direct the magnetic field through an opening to a pocket in which the magnet is received. Accordingly, flux leakage may be reduced and the bottom case may be secured to the top case. Magnetic elements and attractors may also be employed to secure a lid portion of the portable computing device to the housing thereof. These magnetic elements and attractors may be centered with respect to proximal and distal edges thereof.
摘要:
A low profile heat removal system suitable for removing excess heat generated by an integrated circuit operating in a compact computing environment is disclosed.
摘要:
The present application describes various embodiments regarding systems and methods for providing a lightweight and durable portable computing device having a thin profile. The portable computing device can take the form of a laptop computer. The laptop computer can include a uni-body top case having an integrated support system formed therein, the integrated support system providing structural support that distributes applied loads through the top case preventing warping and bowing.
摘要:
One or more fastenings can be used to fasten components together, such as housing components on a computing device. Each fastening can include a first opening associated with a first component, a second opening associated with a second component, a floating fastener, and a screw. The floating fastener is inserted into the first opening and/or second opening, and includes a threaded opening therein having a primary axis therethrough. The screw is inserted through first and/or second openings and into the threaded opening in the floating fastener. The screw and threaded opening combination is defined by contact between the screw and threaded opening about a thread surface that is substantially perpendicular to the primary axis, a screw thread return angle of 45 degrees or less, and a thread depth that is less than about triple the float between the major diameters of the screw and the threaded opening.