CREATING EMISSION IMAGES OF INTEGRATED CIRCUITS
    42.
    发明申请
    CREATING EMISSION IMAGES OF INTEGRATED CIRCUITS 失效
    创建集成电路的排放图像

    公开(公告)号:US20100329586A1

    公开(公告)日:2010-12-30

    申请号:US12493686

    申请日:2009-06-29

    IPC分类号: G06K9/36

    摘要: A method, system and computer program product are disclosed for creating an image from a device. In one embodiment, the method comprises acquiring first and second images from the device, said first and second images having overlapping portions, and estimating said overlapping portions to obtain an approximate shift amount to align approximately said first and second images. This method further comprises analyzing the overlapping portions, using a defined cross-correlation algorithm, to calculate a precise shift amount to align the first and second images; and using said precise shift amount to join the first and second images together. In one embodiment, an optical system is used to acquire the images, a stage is used to move either the device or the optical system to acquire the first and second images, and the estimating includes using movement of the stage to estimate the overlapping areas.

    摘要翻译: 公开了用于从设备创建图像的方法,系统和计算机程序产品。 在一个实施例中,该方法包括从设备获取第一和第二图像,所述第一和第二图像具有重叠部分,并且估计所述重叠部分以获得近似偏移量以对准所述第一和第二图像。 该方法还包括使用定义的互相关算法来分析重叠部分以计算精确偏移量以对齐第一和第二图像; 并且使用所述精确位移量将第一和第二图像连接在一起。 在一个实施例中,使用光学系统来获取图像,阶段用于移动设备或光学系统以获取第一和第二图像,并且估计包括使用平台的运动来估计重叠区域。

    Method and apparatus for diagnosing broken scan chain based on leakage light emission
    43.
    发明授权
    Method and apparatus for diagnosing broken scan chain based on leakage light emission 失效
    基于泄漏光发射诊断断层扫描链的方法和装置

    公开(公告)号:US07788058B2

    公开(公告)日:2010-08-31

    申请号:US12115768

    申请日:2008-05-06

    IPC分类号: G06F19/00

    CPC分类号: G01R31/318538 G01R31/311

    摘要: A mechanism for diagnosing broken scan chains based on leakage light emission is provided. An image capture mechanism detects light emission from leakage current in complementary metal oxide semiconductor (CMOS) devices. The diagnosis mechanism identifies devices with unexpected light emission. An unexpected amount of light emission may indicate that a transistor is turned off when it should be turned on or vice versa. All possible inputs may be tested to determine whether a problem exists with transistors in latches or with transistors in clock buffers. Broken points in the scan chain may then be determined based on the locations of unexpected light emission.

    摘要翻译: 提供了一种基于泄漏光发射来诊断断层扫描链的机构。 图像捕获机构检测互补金属氧化物半导体(CMOS)器件中的泄漏电流的发光。 诊断机制识别具有意外发光的设备。 意外的发光量可能表明当它应该被打开时晶体管被关闭,反之亦然。 可以测试所有可能的输入以确定锁存器中的晶体管或时钟缓冲器中的晶体管是否存在问题。 然后可以基于意外光发射的位置来确定扫描链中的断点。

    System and method for estimation of integrated circuit signal characteristics using optical measurements
    44.
    发明授权
    System and method for estimation of integrated circuit signal characteristics using optical measurements 有权
    使用光学测量估计集成电路信号特性的系统和方法

    公开(公告)号:US07612571B2

    公开(公告)日:2009-11-03

    申请号:US12115658

    申请日:2008-05-06

    IPC分类号: G01R31/00

    CPC分类号: G01R31/311 Y10T29/49004

    摘要: Systems and methods for making electrical measurements using optical emissions include positioning a sensor/photodetector to measure radiation emissions from devices to be tested. Radiation emission information is collected from the device to be tested during electrical operation. Characteristic features of the radiation emission information are determined, and differences between the characteristic features are deciphered. Based on the differences, models are employed to determine electrical properties of the device, especially operational characteristics.

    摘要翻译: 使用光学发射进行电气测量的系统和方法包括定位传感器/光电检测器以测量待测装置的辐射发射。 在电气操作期间,从要测试的设备收集辐射发射信息。 确定辐射发射信息的特征,特征特征之间的差异被解密。 基于差异,使用模型来确定装置的电气特性,特别是操作特性。

    On-chip power supply noise detector
    47.
    发明申请
    On-chip power supply noise detector 失效
    片上电源噪声检测器

    公开(公告)号:US20060214672A1

    公开(公告)日:2006-09-28

    申请号:US11089215

    申请日:2005-03-24

    IPC分类号: G01R27/08

    CPC分类号: G01R31/3004 G01R19/16552

    摘要: Techniques for on-chip detection of integrated circuit power supply noise are disclosed. By way of example, a technique for monitoring a power supply line in an integrated circuit comprises the following steps/operations. A first signal and a second signal are preconditioned. The first signal is representative of a voltage of the power supply line being monitored. The second signal is representative of a voltage of a reference power supply line. Preconditioning comprises shifting respective levels of the voltages such that the voltages are within an input voltage range of comparator circuitry. Then, the preconditioned first signal and the preconditioned second signal are compared in accordance with the comparator circuitry. Comparison comprises detecting when a difference exists between the voltage level of the preconditioned first signal and the voltage level of the preconditioned second signal.

    摘要翻译: 公开了片上检测集成电路电源噪声的技术。 作为示例,用于监视集成电路中的电源线的技术包括以下步骤/操作。 第一信号和第二信号被预处理。 第一信号代表被监测的电源线的电压。 第二信号代表参考电源线的电压。 预处理包括使电压的各个电平移动,使得电压在比较器电路的输入电压范围内。 然后,根据比较器电路对预处理的第一信号和预处理的第二信号进行比较。 比较包括检测预处理的第一信号的电压电平与预处理的第二信号的电压电平之间的差异。

    Method and apparatus for improving transition fault testability of semiconductor chips
    48.
    发明授权
    Method and apparatus for improving transition fault testability of semiconductor chips 失效
    改善半导体芯片的过渡故障可测性的方法和装置

    公开(公告)号:US06453436B1

    公开(公告)日:2002-09-17

    申请号:US09473811

    申请日:1999-12-28

    IPC分类号: G01R3128

    摘要: A scan chain latch circuit is provided. The scan chain latch circuit includes a first shift register latch, a second shift register latch, and a third shift register latch. A first multiplexor is connected between the first and second shift register latches, and a second multiplexor is connected between the second and third shift register latches. Each multiplexor is configured for implementing a jump mode such that a logic value may be passed via the first multiplexor from the first shift register latch to the third shift register latch.

    摘要翻译: 提供扫描链锁存电路。 扫描链锁存电路包括第一移位寄存器锁存器,第二移位寄存器锁存器和第三移位寄存器锁存器。 第一复用器连接在第一和第二移位寄存器锁存器之间,第二多路复用器连接在第二和第三移位寄存器锁存器之间。 每个多路复用器被配置为实现跳跃模式,使得逻辑值可以经由第一多路复用器从第一移位寄存器锁存器传递到第三移位寄存器锁存器。

    Reliable physical unclonable function for device authentication
    49.
    发明授权
    Reliable physical unclonable function for device authentication 有权
    用于设备认证的可靠的物理不可克隆功能

    公开(公告)号:US08741713B2

    公开(公告)日:2014-06-03

    申请号:US13572245

    申请日:2012-08-10

    IPC分类号: H01L21/336

    摘要: The present disclosure relates to a secure device having a physical unclonable function and methods of manufacturing such a secure device. The device includes a substrate and at least one high-k/metal gate device formed on the substrate. The at least one high-k/metal gate device represents the physical unclonable function. In some cases, the at least one high-k/metal gate device may be subjected a variability enhancement. In some cases, the secure device may include a measurement circuit for measuring a property of the at least one high-k/metal gate device.

    摘要翻译: 本公开涉及具有物理不可克隆功能的安全装置和制造这种安全装置的方法。 该器件包括衬底和形成在衬底上的至少一个高k /金属栅极器件。 至少一个高k /金属栅极器件表示物理不可克隆功能。 在一些情况下,可以对至少一个高k /金属栅极器件进行可变性增强。 在一些情况下,安全装置可以包括用于测量至少一个高k /金属门装置的特性的测量电路。

    ANGULAR SPECTRUM TAILORING IN SOLID IMMERSION MICROSCOPY FOR CIRCUIT ANALYSIS
    50.
    发明申请
    ANGULAR SPECTRUM TAILORING IN SOLID IMMERSION MICROSCOPY FOR CIRCUIT ANALYSIS 失效
    用于电路分析的固体显微镜中的角度光谱定标

    公开(公告)号:US20110037973A1

    公开(公告)日:2011-02-17

    申请号:US12911781

    申请日:2010-10-26

    IPC分类号: G01N21/88

    CPC分类号: G01R31/311

    摘要: A structure for locating a fault in a semiconductor chip. The chip includes a substrate on a dielectric interconnect. A first electrical response image of the chip, which includes a spot representing the fault, is overlayed on a first reflection image for monochromatic light in an optical path from an optical microscope through a SIL/NAIL and into the chip. The index of refraction of the substrate exceeds that of the dielectric interconnect and is equal to that of the SIL/NAIL. A second electrical response image of the chip is overlayed on a second reflection image for the monochromatic light in an optical path in which an optical stop prevents all subcritical angular components of the monochromatic light from being incident on the SIL/NAIL. If the second electrical response image includes or does not include the spot, then the fault is in the substrate or the dielectric interconnect, respectively.

    摘要翻译: 用于定位半导体芯片中的故障的结构。 芯片包括电介质互连上的衬底。 包括代表故障的点的芯片的第一电响应图像重叠在从光学显微镜通过SIL / NAIL并进入芯片的光路中的单色光的第一反射图像上。 衬底的折射率超过电介质互连的折射率,等于SIL / NAIL的折射率。 芯片的第二电响应图像覆盖在光路中的单色光的第二反射图像上,其中光学停止器防止单色光的所有亚临界角分量入射到SIL / NAIL上。 如果第二电响应图像包括或不包括点,则故障分别在基板或电介质互连中。