Electronically Programmable Antifuse and Circuits Made Therewith
    41.
    发明申请
    Electronically Programmable Antifuse and Circuits Made Therewith 有权
    电子可编程防腐和电路

    公开(公告)号:US20070120221A1

    公开(公告)日:2007-05-31

    申请号:US11627723

    申请日:2007-01-26

    IPC分类号: H01L29/00 H01L21/326

    摘要: An antifuse device (120) that includes a bias element (124) and an programmable antifuse element (128) arranged in series with one another so as to form a voltage divider having an output node (F) located between the bias and antifuse elements. When the antifuse device is in its unprogrammed state, each of the bias element and antifuse element is non-conductive. When the antifuse device is in its programmed state, the bias element remains non-conductive, but the antifuse element is conductive. The difference in the resistance of the antifuse element between its unprogrammed state and programmed state causes the difference in voltages seen at the output node to be on the order of hundreds of mili-volts when a voltage of 1 V is applied across the antifuse device. This voltage difference is so high that it can be readily sensed using a simple sensing circuit (228).

    摘要翻译: 一种反熔丝装置(120),其包括彼此串联布置的偏置元件(124)和可编程反熔丝元件(128),以形成具有位于偏置和反熔丝元件之间的输出节点(F)的分压器。 当反熔丝装置处于其未编程状态时,偏置元件和反熔丝元件中的每一个都是不导电的。 当反熔丝装置处于其编程状态时,偏置元件保持不导电,但是反熔丝元件是导电的。 反熔丝元件在其未编程状态和编程状态之间的电阻差异导致当在反熔断器件上施加1V的电压时,在输出节点处看到的电压差为几百微升。 该电压差非常高以至于可以使用简单的感测电路(228)容易地感测。

    Fabrication of bipolar transistor having reduced collector-base capacitance
    42.
    发明申请
    Fabrication of bipolar transistor having reduced collector-base capacitance 失效
    具有减小的集电极 - 基极电容的双极晶体管的制造

    公开(公告)号:US20070096259A1

    公开(公告)日:2007-05-03

    申请号:US11633380

    申请日:2006-12-04

    IPC分类号: H01L27/082

    摘要: A method is provided for fabricating a bipolar transistor in which a collector layer is formed which includes an active portion having a relatively high dopant concentration and a second portion which has a lower dopant concentration. An epitaxial intrinsic base layer is formed to overlie the collector layer in conductive communication with the active portion of the collector layer. A low-capacitance region is formed laterally adjacent to the second portion of the collector layer, the low-capacitance region including a dielectric region disposed in an undercut directly underlying the intrinsic base layer. An emitter layer is formed to overlie the intrinsic base layer.

    摘要翻译: 提供一种用于制造双极晶体管的方法,其中形成集电极层,其包括具有较高掺杂剂浓度的有源部分和具有较低掺杂剂浓度的第二部分。 外延本征基极层形成为覆盖集电极层,与集电极层的有源部分导电连通。 低电容区域形成为与集电极层的第二部分横向相邻,低电容区域包括设置在直接位于本征基极层下方的底切处的电介质区域。 形成发射极层以覆盖本征基极层。

    PROGRAMMABLE SEMICONDUCTOR DEVICE CONTAINING A VERTICALLY NOTCHED FUSIBLE LINK REGION AND METHODS OF MAKING AND USING SAME
    43.
    发明申请
    PROGRAMMABLE SEMICONDUCTOR DEVICE CONTAINING A VERTICALLY NOTCHED FUSIBLE LINK REGION AND METHODS OF MAKING AND USING SAME 审中-公开
    包含垂直可编程可熔连接区域的可编程半导体器件及其制造和使用方法

    公开(公告)号:US20070029576A1

    公开(公告)日:2007-02-08

    申请号:US11161439

    申请日:2005-08-03

    IPC分类号: H01L27/10

    摘要: The present invention relates to a programmable semiconductor device, preferably a FinFET or tri-gate structure, that contains a first contact element, a second contact element, and at least one fin-shaped fusible link region coupled between the first and second contact elements. The second contact element is laterally spaced apart from the first contact element, and the fin-shaped fusible link region has a vertically notched section. A programming current flowing through the fin-shaped fusible link region causes either significant resistance increase or formation of an electric discontinuity in the vertically notched section. Alternatively, the vertically notched section may contain a dielectric material, and application of a programming voltage between a gate electrode overlaying the vertically notched section and one of the contact elements breaks down the dielectric material and allows current flow between the gate electrode and the fin-shaped fusible link region.

    摘要翻译: 本发明涉及一种可编程半导体器件,优选地为FinFET或三栅极结构,其包含第一接触元件,第二接触元件以及耦合在第一和第二接触元件之间的至少一个鳍状可熔连接区域。 第二接触元件与第一接触元件横向间隔开,并且鳍状可熔连接区域具有垂直切口部分。 流过翅片状易熔连接区域的编程电流导致垂直切口部分中显着的电阻增加或电中断的形成。 或者,垂直切口部分可以包含电介质材料,并且在覆盖垂直切口部分的栅极电极和其中一个接触元件之间施加编程电压会破坏电介质材料,并允许电流在栅电极和鳍片间电流之间流动, 形易熔连接区域。

    DOPED SINGLE CRYSTAL SILICON SILICIDED EFUSE
    44.
    发明申请
    DOPED SINGLE CRYSTAL SILICON SILICIDED EFUSE 有权
    单晶硅晶硅胶

    公开(公告)号:US20070026579A1

    公开(公告)日:2007-02-01

    申请号:US11161320

    申请日:2005-07-29

    IPC分类号: H01L21/84

    摘要: An eFuse begins with a single crystal silicon-on-insulator (SOI) structure that has a single crystal silicon layer on a first insulator layer. The single crystal silicon layer is patterned into a strip. Before or after the patterning, the single crystal silicon layer is doped with one or more impurities. At least an upper portion of the single crystal silicon layer is then silicided to form a silicided strip. In one embodiment the entire single crystal silicon strip is silicided to create a silicide strip. Second insulator(s) is/are formed on the silicide strip, so as to isolate the silicided strip from surrounding structures. Before or after forming the second insulators, the method forms electrical contacts through the second insulators to ends of the silicided strip. By utilizing a single crystal silicon strip, any form of semiconductor, such as a diode, conductor, insulator, transistor, etc. can form the underlying portion of the fuse structure. The overlying silicide material allows the fuse to act as a conductor in its unprogrammed state. However, contrary to metal or polysilicon based eFuses which only comprise an insulator in the programmed state, when the inventive eFuse is programmed (and the silicide is moved or broken) the underlying semiconductor structure operates as an active semiconductor device.

    摘要翻译: eFuse从在第一绝缘体层上具有单晶硅层的单晶硅绝缘体(SOI)结构开始。 将单晶硅层图案化成条带。 在构图之前或之后,单晶硅层掺杂有一种或多种杂质。 至少单晶硅层的上部然后被硅化以形成硅化带。 在一个实施例中,整个单晶硅带被硅化以产生硅化物条。 在硅化物条上形成第二绝缘体,从而将硅化物带与周围结构隔离。 在形成第二绝缘体之前或之后,该方法通过第二绝缘体形成与硅化带的端部的电接触。 通过使用单晶硅条,任何形式的半导体,例如二极管,导体,绝缘体,晶体管等都可以形成熔丝结构的下面部分。 上覆的硅化物材料允许熔丝作为未编程状态的导体。 然而,与仅编程状态的仅包含绝缘体的金属或多晶硅基eFuse相反,当本发明的eFuse被编程(并且硅化物被移动或断开)时,下面的半导体结构作为有源半导体器件工作。

    Epitaxial imprinting
    45.
    发明申请
    Epitaxial imprinting 失效
    外延印记

    公开(公告)号:US20070013001A1

    公开(公告)日:2007-01-18

    申请号:US11182381

    申请日:2005-07-15

    IPC分类号: H01L27/12 H01L27/01

    摘要: The present invention provides an epitaxial imprinting process for fabricating a hybrid substrate that includes a bottom semiconductor layer; a continuous buried insulating layer present atop said bottom semiconductor layer; and a top semiconductor layer present on said continuous buried insulating layer, wherein said top semiconductor layer includes separate planar semiconductor regions that have different crystal orientations, said separate planar semiconductor regions are isolated from each other. The epitaxial printing process of the present invention utilizing epitaxial growth, wafer bonding and a recrystallization anneal.

    摘要翻译: 本发明提供一种用于制造包括底部半导体层的混合衬底的外延压印工艺; 存在于所述底部半导体层顶部的连续掩埋绝缘层; 以及存在于所述连续掩埋绝缘层上的顶部半导体层,其中所述顶部半导体层包括具有不同晶体取向的分离的平面半导体区域,所述分开的平面半导体区域彼此隔离。 利用外延生长,晶片接合和再结晶退火的本发明的外延印刷方法。

    METHODS OF IMPLEMENTING AND ENHANCED SILICON-ON-INSULATOR (SOI) BOX STRUCTURES
    46.
    发明申请
    METHODS OF IMPLEMENTING AND ENHANCED SILICON-ON-INSULATOR (SOI) BOX STRUCTURES 失效
    实施和增强硅绝缘体(SOI)盒结构的方法

    公开(公告)号:US20060234428A1

    公开(公告)日:2006-10-19

    申请号:US11106004

    申请日:2005-04-14

    IPC分类号: H01L21/84 H01L21/00

    摘要: Enhanced silicon-on-insulator (SOI) buried oxide (BOX) structures and methods are provided for implementing enhanced SOI BOX structures. An oxygen implant step is performed from a backside into a thinned silicon substrate layer. An anneal step forms thick buried oxide (BOX) regions from oxygen implants in the silicon substrate layer. The oxygen implant step forms an isolated region near the oxygen implants. A backside implant step selectively dopes the isolated region for forming a backgate for an SOI device being formed including a selected one of anti-fuse (AF) devices, and SOI transistors including PFET and NFET devices.

    摘要翻译: 提供了增强的绝缘体上硅(SOI)掩埋氧化物(BOX)结构和方法来实现增强的SOI BOX结构。 将氧注入步骤从背面进行到薄化的硅衬底层。 退火步骤从硅衬底层中的氧注入形成厚的掩埋氧化物(BOX)区域。 氧注入步骤在氧植入物附近形成隔离区域。 背侧注入步骤选择性地掺杂用于形成包括所选择的抗熔丝(AF)器件的SOI器件的SOI器件的隔离区域以及包括PFET和NFET器件的SOI晶体管的隔离区域。

    Resettable fuse device and method of fabricating the same
    47.
    发明申请
    Resettable fuse device and method of fabricating the same 有权
    可复位保险丝装置及其制造方法

    公开(公告)号:US20060060938A1

    公开(公告)日:2006-03-23

    申请号:US10948773

    申请日:2004-09-23

    IPC分类号: H01L29/00 H01L21/44

    摘要: A resettable fuse device is fabricated on one surface of a semiconductor substrate (10) and includes: a gate region (20) having first and second ends; a source node (81) formed in proximity to the first end of the gate region; an extension region (52) formed to connect the source node to the first end of the gate region; and a drain node (80) formed in proximity to the second end of the gate region and separated from the gate region by a distance (D) such that upon application of a predetermined bias voltage to the drain node a connection between the drain node and the second end of the gate region is completed by junction depletion. A gate dielectric (30) and a gate electrode (40) are formed over the gate region. Current flows between the source node and the drain node when the predetermined bias is applied to both the drain node and the gate electrode.

    摘要翻译: 在半导体衬底(10)的一个表面上制造可重置熔丝器件,并且包括:具有第一和第二端的栅极区域(20) 源极节点(81),其形成在所述栅极区域的第一端附近; 形成为将源极节点连接到栅极区域的第一端的延伸区域(52) 以及漏极节点(80),其形成在栅极区域的第二端附近,并且与栅极区分离距离(D),使得在向漏极节点施加预定的偏置电压时,漏极节点和 栅极区域的第二端通过结损耗完成。 栅极电介质(30)和栅电极(40)形成在栅极区域上方。 当预定偏压施加到漏极节点和栅电极时,电流在源节点和漏极节点之间流动。

    Autonomic thermal monitor and controller for thin film devices
    48.
    发明申请
    Autonomic thermal monitor and controller for thin film devices 失效
    用于薄膜器件的自动热监测器和控制器

    公开(公告)号:US20050275054A1

    公开(公告)日:2005-12-15

    申请号:US10853800

    申请日:2004-05-25

    摘要: A thermal monitor diode is provided that comprises a silicon thin film on an insulator mounted on a silicon substrate. An opening extends through the silicon thin film and through the insulator and partially into the silicon substrate and terminates at an end wall. A conductive material is disposed in the opening and extends to the end wall. The substrate has a P/N junction formed therein adjacent the end wall, and an insulating spacer material surrounds the conductive material and is sufficiently thin to allow temperature excursions in the silicon thin film to pass therethrough. The invention also contemplates a method of forming the diode.

    摘要翻译: 提供一种热监测二极管,其包括安装在硅衬底上的绝缘体上的硅薄膜。 开口延伸穿过硅薄膜并穿过绝缘体并部分地延伸到硅衬底中并终止于端壁。 导电材料设置在开口中并延伸到端壁。 衬底具有邻近端壁形成的P / N结,并且绝缘间隔物材料围绕导电材料并且足够薄以允许硅薄膜中的温度偏移通过。 本发明还考虑了形成二极管的方法。