公开(公告)号：US08162584B2

公开(公告)日：2012-04-24

申请号：US11508551

申请日：2006-08-23

Applicant: David J. Michael ,  James Clark ,  Gang Liu

Inventor： David J. Michael ,  James Clark ,  Gang Liu

IPC: G06K9/00 ,  H01L21/677

CPC classification number: H01L21/681 ,  G06T7/73

Abstract: The invention provides, in some aspects, a wafer alignment system comprising an image acquisition device, an illumination source, a rotatable wafer platform, and an image processor that includes functionality for mapping coordinates in an image of an article (such as a wafer) on the platform to a “world” frame of reference at each of a plurality of angles of rotation of the platform.

Abstract translation: 本发明在一些方面提供了一种晶片对准系统，其包括图像获取装置，照明源，可旋转晶片平台和图像处理器，该图像处理器包括用于将物品（例如晶片）的图像中的坐标映射到 平台在平台的多个旋转角度的每一个处以“世界”参照系。

公开(公告)号：US08030235B2

公开(公告)日：2011-10-04

申请号：US12338069

申请日：2008-12-18

Applicant: Shyam Miglani ,  H. David Prior ,  David J. Michael

Inventor： Shyam Miglani ,  H. David Prior ,  David J. Michael

IPC: C04B35/03 ,  C04B35/42

CPC classification number: C04B35/0435 ,  B22D41/02 ,  C04B35/013 ,  C04B2235/3201 ,  C04B2235/3208 ,  C04B2235/3217 ,  C04B2235/3232 ,  C04B2235/3241 ,  C04B2235/3244 ,  C04B2235/3262 ,  C04B2235/3272 ,  C04B2235/3418 ,  C04B2235/402 ,  C04B2235/424 ,  C04B2235/425 ,  C04B2235/428 ,  C04B2235/447 ,  C04B2235/72 ,  C04B2235/77 ,  C04B2235/9669

Abstract: A magnesia-carbon brick comprised of about 50 to about 95% by weight magnesia and about 1 to about 20% by weight carbon, with or without metallic additions, such that the chemical analysis of the mixture of aggregates used in the brick will comprise, by chemical analysis, about 2 to about 15% SiO2, about 3 to about 50% Al2O3, and about 50 to about 95% MgO.

Abstract translation: 包含约50至约95重量％的氧化镁和约1至约20重量％的碳的氧化镁 - 碳砖，具有或不具有金属添加剂，使得在砖中使用的聚集体的混合物的化学分析将包含， 通过化学分析，约2至约15％的SiO 2，约3至约50％的Al 2 O 3和约50至约95％的MgO。

公开(公告)号：US20100160142A1

公开(公告)日：2010-06-24

申请号：US12338069

申请日：2008-12-18

Applicant: Shyam Miglani ,  H. David Prior ,  David J. Michael

Inventor： Shyam Miglani ,  H. David Prior ,  David J. Michael

IPC: C04B35/035

CPC classification number: C04B35/0435 ,  B22D41/02 ,  C04B35/013 ,  C04B2235/3201 ,  C04B2235/3208 ,  C04B2235/3217 ,  C04B2235/3232 ,  C04B2235/3241 ,  C04B2235/3244 ,  C04B2235/3262 ,  C04B2235/3272 ,  C04B2235/3418 ,  C04B2235/402 ,  C04B2235/424 ,  C04B2235/425 ,  C04B2235/428 ,  C04B2235/447 ,  C04B2235/72 ,  C04B2235/77 ,  C04B2235/9669

Abstract: A magnesia-carbon brick comprised of about 50 to about 95% by weight magnesia and about 1 to about 20% by weight carbon, with or without metallic additions, such that the chemical analysis of the mixture of aggregates used in the brick will comprise, by chemical analysis, about 2 to about 15% SiO2, about 3 to about 50% Al2O3, and about 50 to about 95% MgO.

Abstract translation: 包含约50至约95重量％的氧化镁和约1至约20重量％的碳的氧化镁 - 碳砖，具有或不具有金属添加剂，使得在砖中使用的聚集体的混合物的化学分析将包含， 通过化学分析，约2至约15％的SiO 2，约3至约50％的Al 2 O 3和约50至约95％的MgO。

公开(公告)号：US20100065757A1

公开(公告)日：2010-03-18

申请号：US12209248

申请日：2008-09-12

Applicant: John W. Schwab ,  Gang Liu ,  David J. Michael ,  Lei Wang

Inventor： John W. Schwab ,  Gang Liu ,  David J. Michael ,  Lei Wang

IPC: G01N23/00 ,  G01B11/00 ,  G02B27/30

CPC classification number: G03F9/00 ,  G03F9/7065 ,  G03F9/7084 ,  G03F9/7088

Abstract: A vision system is provided to determine a positional relationship between a semiconductor wafer on a platen and an element on a processing machine, such as a printing screen, on a remote side of the semiconductor wafer from the platen. A source directs ultraviolet light through an aperture in the platen to illuminate the semiconductor wafer and cast a shadow onto the element adjacent an edge of the semiconductor wafer. A video camera produces an image using light received from the platen aperture, wherein some of that received light was reflected by the wafer. The edge of the semiconductor wafer in the image is well defined by a dark/light transition.

Abstract translation: 提供了一种视觉系统，用于确定压板上的半导体晶片与半导体晶片的远离压纸台的诸如印刷屏幕的处理机器上的元件之间的位置关系。 光源通过压板中的孔引导紫外光照射半导体晶片并将阴影投射到与半导体晶片的边缘相邻的元件上。 摄像机使用从压板孔接收的光产生图像，其中一些所接收的光被晶片反射。 图像中的半导体晶片的边缘由暗/光转变很好地限定。

公开(公告)号：US20070213199A1

公开(公告)日：2007-09-13

申请号：US11532215

申请日：2006-09-15

Applicant: David J. Michael

Inventor： David J. Michael

IPC: C04B35/043 ,  C04B35/482

CPC classification number: C04B35/0435 ,  C04B35/62665 ,  C04B35/632 ,  C04B2235/3208 ,  C04B2235/3217 ,  C04B2235/3222 ,  C04B2235/3244 ,  C04B2235/5427 ,  C04B2235/5463 ,  C04B2235/608 ,  C04B2235/72 ,  C04B2235/77 ,  C04B2235/80 ,  C04B2235/96 ,  C04B2235/9615 ,  F27D1/0006

Abstract: A refractory brick, comprised of a refractory material having about 55% to about 96% by weight magnesia particles or magnesia particles containing spinel precipitates, about 3% to about 20% by weight fine zirconia particles having a particle size less than 35 Tyler mesh (less than 425 μm), and about 1% to about 25% of a material selected from the group consisting of coarse zirconia, coarse spinel, coarse alumina-zirconia, and combinations thereof.

Abstract translation: 一种耐火砖，由具有约55％至约96％重量的氧化镁颗粒或含有尖晶石沉淀物的氧化镁颗粒的耐火材料构成，约3％至约20％重量的粒径小于35泰勒网的细小氧化锆颗粒（ 小于425μm）和约1％至约25％的选自粗氧化锆，粗尖晶石，粗氧化铝 - 氧化锆及其组合的材料。

公开(公告)号：US06801649B1

公开(公告)日：2004-10-05

申请号：US09772751

申请日：2001-01-30

Applicant: David J. Michael ,  Juha Koljonen ,  Paul Dutta-Choudhury

Inventor： David J. Michael ,  Juha Koljonen ,  Paul Dutta-Choudhury

IPC: G06K900

CPC classification number: G06K9/3216 ,  G06K9/6203 ,  G06T7/30 ,  G06T7/60

Abstract: An efficient and reliable method and apparatus is disclosed that finds a reference point of an object profile within an image when the object is of an unknown size. The object profile is modeled using a synthetic labeled-projection model, which in conjunction with the image, is projected over a portion of the image of the object profile to derive a histogram. The histogram is normalized and a maximum of a first derivative of the histogram is defined for that position. The position of the labeled-projection model is moved relative to the image, and the process is repeated until a selected portion of the image has been examined. The first derivative of the normalized labeled projection is greatest when a feature of the image and the feature denoted by a specific synthetic label of the labeled-projection model are aligned. The method and apparatus can locate the center of the object with reliability, because use of the labeled-projection model and the histogram minimizes the * effects of image artifacts. Further, the method decreases computational time, and thus, increases performance speed.

Abstract translation: 公开了一种有效且可靠的方法和装置，当物体具有未知尺寸时，找到图像内的对象轮廓的参考点。 使用合成的标注投影模型对对象轮廓进行建模，该模型与图像一起投影在对象轮廓的图像的一部分上以导出直方图。 对直方图进行归一化，并为该位置定义直方图的一阶导数的最大值。 标记投影模型的位置相对于图像移动，并重复该过程直到已经检查图像的所选部分。 当图像的特征和由标记投影模型的特定合成标签表示的特征对齐时，归一化标记投影的一阶导数最大。 该方法和装置可以可靠地定位对象的中心，因为使用标注投影模型和直方图可以最大限度地减小图像伪影的*效应。 此外，该方法减少了计算时间，从而提高了性能速度。

公开(公告)号：US06173070B2

公开(公告)日：2001-01-09

申请号：US09000583

申请日：1997-12-30

Applicant: David J. Michael ,  Aaron S. Wallack

Inventor： David J. Michael ,  Aaron S. Wallack

IPC: G06K900

CPC classification number: G06T7/001 ,  G06K9/00201 ,  G06T7/75 ,  G06T2200/04 ,  G06T2207/30152

Abstract: A system and method for analyzing 3D captured image data of scanned surfaces to locate object of interest, such as solder balls. A 3D model is created of an object of interest, the 3D model including weighted “don't care” areas where a match is not required. The 3D models which are used include geometric shapes, including a frustum, and models created from actual 3D image data of real objects. The 3D captured image data is processed to locate objects matching the 3D models, including processing by normalized correlation. Once the objects are located, the system selects data points within the 3D captured image data that are a predetermined distance away from the located objects. These data points are analyzed to determine a surface plane which fits the selected data points, thereby locating the surface in the 3D capture image data.

Abstract translation: 一种用于分析扫描表面的3D拍摄图像数据以定位感兴趣对象（例如焊球）的系统和方法。 创建一个感兴趣对象的3D模型，3D模型包括不需要匹配的加权“无关”区域。 使用的3D模型包括几何形状，包括平截头体，以及由真实对象的实际3D图像数据创建的模型。 处理3D捕获的图像数据以定位与3D模型匹配的对象，包括通过归一化相关的处理。 一旦找到对象，系统就会选择距离定位对象一预定距离的3D捕获图像数据中的数据点。 分析这些数据点以确定适合所选数据点的表面，从而将表面定位在3D捕获图像数据中。

公开(公告)号：US6167150A

公开(公告)日：2000-12-26

申请号：US122507

申请日：1998-07-24

Applicant: David J. Michael ,  Lowell D. Jacobson ,  Nelson Tarr

Inventor： David J. Michael ,  Lowell D. Jacobson ,  Nelson Tarr

IPC: G06K9/46 ,  G06T7/00 ,  G06K9/00

CPC classification number: G06T7/0006 ,  G06K9/4638 ,  G06T7/12 ,  G06T2207/30164

Abstract: A method and apparatus is provided that detects extended defects in a surface, by detecting connected features and classifying the connected features so as to identify defects. A method and apparatus is described which processes an image for edges, thresholds the edge and then determines whether the edges are connected features by examining the orientation of the edges compared to their neighboring edges. Application of the method to read/write heads in a storage-drive assembly application is disclosed. Particular enhancements of the method and apparatus for that application are described, including classifying the defects on a head based on their relationship to the boundary of the head, and applying hysteresis thresholding or diffusion to identify cracks which interfere with the function of the heads.

Abstract translation: 提供了一种通过检测连接的特征并对连接的特征进行分类以识别缺陷来检测表面中的扩展缺陷的方法和装置。 描述了一种方法和装置，其处理边缘的图像，对边缘进行阈值，然后通过检查边缘与其相邻边缘的方向来确定边缘是否是连接的特征。 公开了将该方法应用到存储驱动组件应用中的读/写头。 描述了用于该应用的方法和装置的特别增强，包括基于它们与头部边界的关系来分类头部上的缺陷，以及应用滞后阈值或扩散来识别干扰头部功能的裂纹。

公开(公告)号：US5978521A

公开(公告)日：1999-11-02

申请号：US937384

申请日：1997-09-25

Applicant: Aaron S. Wallack ,  David J. Michael

Inventor： Aaron S. Wallack ,  David J. Michael

IPC: G01B11/00 ,  G01B11/275 ,  G01B21/04 ,  G06K9/32

CPC classification number: G01B11/275 ,  G01B11/002 ,  G01B21/042 ,  G01B2210/12

Abstract: The invention provides improved machine vision methods for determining a calibration relationship among the imaging reference frames of multiple cameras (or other image acquisition devices) that acquire images of a common moveable object. The calibration relationship includes parameters for transforming positional coordinates among the camera's respective imaging reference frames. The method includes placing on the common object, stage, or belt a plurality of fiducials, e.g., calibration marks, that are at known positions relative to each other with respect to a frame of reference referred to as the "alignment reference frame"; aligning an axis of the alignment reference frame with an axis of the object's reference frame of motion, i.e., the reference frame in which the object, frame or belt moves; placing a respective fiducial in the field of view of each camera; determining a calibration relationship among the imaging reference frames of the respective image acquisition devices as a function of (i) the known relative locations of the fiducials (vis-a-vis the alignment reference frame), (ii) the fiducial calibrating positions determined for each camera (vis-a-vis that camera's acquisition reference frame), and (iii) the object calibrating positions determined for each respective image acquisition device (vis-a-vis the motion reference frame).

Abstract translation: 本发明提供了用于确定获取公共可移动物体的图像的多个照相机（或其他图像获取装置）的成像参考系之间的校准关系的改进的机器视觉方法。 校准关系包括用于变换相机各自成像参考帧之间的位置坐标的参数。 所述方法包括将公共物体，舞台或皮带放置在相对于被称为“对准参考框架”的参照系的相对于彼此的已知位置处的多个基准点，例如校准标记; 将对准基准框架的轴线对准物体的参考运动帧的轴线，即对象，框架或皮带移动的参考框架; 在每个相机的视野中放置相应的基准; 确定各图像采集装置的成像参考帧之间的校准关系作为（i）基准的已知相对位置（vis-+ E，gra a + EE-对准参考帧）的函数，（ii） 为每个摄像机确定的基准校准位置（vis-+ E，摄像机的采集参考帧的摄像机+ EE -vis），以及（iii）为每个相应的图像采集设备确定的对象校准位置（vis- + E， + EE -vis运动参考框）。

公开(公告)号：US5640199A

公开(公告)日：1997-06-17

申请号：US236215

申请日：1994-05-02

Applicant: Arman Garakani ,  David J. Michael ,  Juha Koljonen

Inventor： Arman Garakani ,  David J. Michael ,  Juha Koljonen

IPC: E05B9/08 ,  E05B13/10 ,  G06T7/00 ,  H01L21/66 ,  H04N7/18

CPC classification number: G06T7/001 ,  G06T7/0024 ,  H01L24/85 ,  G06T2207/30152 ,  H01L22/12 ,  H01L2224/48091 ,  H01L2224/48247 ,  H01L2224/48463 ,  H01L2224/49171 ,  H01L2224/78801 ,  H01L2224/78901 ,  H01L2224/85205 ,  H01L2224/859 ,  H01L2924/00014 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01033 ,  H01L2924/01039 ,  H01L2924/01082 ,  H01L2924/01322 ,  H01L2924/14

Abstract: This invention provides a method and apparatus for automatically locating the bond of a wire to a lead frame and semiconductor chip or similar device as an in-process operation to facilitate in-process inspection. The apparatus includes a wire bonding machine, or similar apparatus, having a movable platform such as an X-Y table for holding semiconductor chips situated in lead frames; a video camera or other optical sensing or imaging device for generating images, which camera is typically positioned over the target chip and lead frame to be bonded; illumination means for illuminating the chip in a lead frame; an image processor capable of summing said absolute difference values, whereby each sum is stored as a difference metric, and digitizing and analyzing the optically sensed images; a bonding mechanism; and a host controller connected to the bonding mechanism, the movable platform, the camera and the image processor. The apparatus generates and stores a pre-bond digital image of the semiconductor chip in the lead frame before bonding has occurred; connects one or more wires between the chip and lead frame by any of a number of means such as ultrasonic bonding, heat bonding, conductive glue bonding or other means; generates and stores a post-bond digital image of the now-bonded chip in its lead frame; registers the pre-bond and post-bond stored digital images using nearest neighbor interpolation so that analysis can be done; and permits inspection of the results of the wire bonds according to appropriate criteria.

Abstract translation: 本发明提供一种方法和装置，用于将导线的键合自动定位到引线框架和半导体芯片或类似装置，作为在线操作以便于进行中的检查。 该装置包括具有诸如X-Y工作台的可移动平台的引线接合机或类似装置，用于保持位于引线框架中的半导体芯片; 用于产生图像的摄像机或其他光学感测或成像装置，该相机通常位于要接合的目标芯片和引线框架上; 照明装置，用于照亮引线框架中的芯片; 能够对所述绝对差值求和的图像处理器，由此将每个和存储为差分度量，并对光学感测图像进行数字化和分析; 粘合机制; 以及连接到接合机构，可移动平台，相机和图像处理器的主机控制器。 在发生接合之前，该装置生成并存储引线框中的半导体芯片的预先接合数字图像; 通过诸如超声波接合，热粘合，导电胶粘或其它方式的任何一种手段来连接芯片和引线框架之间的一条或多条线; 在其引线框中产生并存储现在粘合的芯片的后绑定数字图像; 使用最近邻插值注册预绑定和后绑定存储的数字图像，以便进行分析; 并且可以根据适当的标准检查引线结果。