MEMORY DEVICES AND METHODS OF FORMING MEMORY DEVICES

    公开(公告)号:US20210273160A1

    公开(公告)日:2021-09-02

    申请号:US16802562

    申请日:2020-02-27

    Abstract: A memory device may be provided including one or more bottom electrodes, one or more mask elements, one or more top electrodes and a switching layer. The bottom electrode(s) may include a first bottom electrode, the mask element(s) may include a first mask element and the top electrode(s) may include a first top electrode. The first mask element may be arranged over a first part of the first bottom electrode. The first top electrode may be arranged over and in contact with the first mask element. The switching layer may be arranged to extend over a second part of the first bottom electrode, and along a first side surface of the first mask element and further along a first side surface of the first top electrode. The first side surfaces of the first mask element and the first top electrode may face a same direction.

    MEMORY DEVICE AND A METHOD FOR FORMING THE MEMORY DEVICE

    公开(公告)号:US20210135101A1

    公开(公告)日:2021-05-06

    申请号:US16672632

    申请日:2019-11-04

    Abstract: A memory device may include at least one inert electrode, at least one active electrode, an insulating element arranged at least partially between the at least one active electrode and the at least one inert electrode, and a switching element arranged under the insulating element. The switching element may be arranged at least partially between the at least one active electrode and the at least one inert electrode. The switching element may include a first end and a second end contacting the at least one active electrode; and a middle segment between the first end and the second end, where the middle segment may at least partially contact the at least one inert electrode.

    NANOGAP SENSORS AND METHODS OF FORMING THE SAME

    公开(公告)号:US20210010997A1

    公开(公告)日:2021-01-14

    申请号:US16505733

    申请日:2019-07-09

    Abstract: In a non-limiting embodiment, a device may include a substrate having conducting lines thereon. One or more fin structures may be arranged over the substrate. Each fin structure may include a sensor arranged over the substrate and around the fin structure. The sensor may include a self-aligned first sensing electrode and a self-aligned second sensing electrode arranged around the fin structure. The first sensing electrode and the second sensing electrode each may include a first portion lining a sidewall of the fin structure and a second portion arranged laterally from the first portion. At least the first portion of the first sensing electrode and the first portion of the second sensing electrode may define a sensing cavity of the sensor. The second portion of the first sensing electrode and the second portion of the second sensing electrode may be electrically coupled to the conducting lines.

    HALL EFFECT SENSORS WITH TUNABLE SENSITIVITY AND/OR RESISTANCE

    公开(公告)号:US20200292631A1

    公开(公告)日:2020-09-17

    申请号:US16297880

    申请日:2019-03-11

    Abstract: A device having a Hall effect sensor is provided. The Hall effect sensor includes a sensor well and a Hall plate disposed within the sensor well. The Hall plate includes a first current terminal and a second current terminal configured to flow a current through the Hall plate, and the Hall plate further includes a first sensing terminal and a second sensing terminal configured to sense a Hall voltage. A separation layer and a separation well are disposed within the sensor well, as well as surround the Hall plate and isolate the Hall plate. At least one of a current sensitivity and a resistance of the Hall effect sensor is tunable based on an adjustable thickness of the Hall plate. The thickness of the Hall plate is adjustable based at least in part on implants in the separation layer and/or a bias voltage applied to the separation layer.

    THYRISTOR RANDOM ACCESS MEMORY
    48.
    发明申请

    公开(公告)号:US20190115350A1

    公开(公告)日:2019-04-18

    申请号:US16217064

    申请日:2018-12-12

    Abstract: Devices and methods for forming a device are presented. The device includes a substrate having a well of a first polarity type and a thyristor-based memory cell. The thyristor-based memory cell includes at least a first region of a second polarity type adjacent to the well, a gate which serves as a second word line disposed on the substrate, at least a first layer of the first polarity type disposed adjacent to the first region of the second polarity type and adjacent to the gate, and at least a heavily doped first layer of the second polarity type disposed on the first layer of the first polarity type and adjacent to the gate. At least the heavily doped first layer of the second polarity type is self-aligned with side of the gate.

    SIDEWALL ENGINEERING FOR ENHANCED DEVICE PERFORMANCE IN ADVANCED DEVICES

    公开(公告)号:US20190103474A1

    公开(公告)日:2019-04-04

    申请号:US15724230

    申请日:2017-10-03

    Abstract: A method of sidewall engineering with negative capacitance materials is disclosed. For example, the negative capacitance material is a ferroelectric material. The method includes providing a dielectric liner on the sidewall of the gate and providing a negative capacitance liner or spacer over the dielectric liner. In one embodiment, the dielectric liner is an oxide liner and the negative capacitance liner or spacer is a ferroelectric liner or spacer. The engineered negative capacitance liner or spacer enhances the gate-to-S/D region and gate-to-contact coupling and hence the device ION-IOFF performance is improved.

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